公开(公告)号：EP3117692A1

公开(公告)日：2017-01-18

申请号：EP15712239.1

申请日：2015-03-13

Applicant: Indium Corporation

Inventor： HU, Ming ,  LEE, Ning-Cheng

IPC: H05K3/34 ,  B23K1/20 ,  C08K5/09 ,  H01L23/00

CPC classification number: B23K35/362 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0623 ,  B23K35/3612 ,  B23K35/3613 ,  B23K2201/42 ,  C08K5/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/10126 ,  H01L2224/11011 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/131 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/041 ,  H05K2203/043 ,  H01L2924/014

Abstract: Methods of forming solder bumps or joints using a radiation curable, thermal curable solder flux, or dual curable solder flux are disclosed. The method includes applying a liquid solder flux 130 that is radiation curable or thermal curable to a substrate 110 such that the solder flux covers contact padsl20 on the substrate; placing solder balls 140 on the contacts pads covered with the radiation curable or thermal curable solder flux; heating the substrate to join the solder balls to the contact pads, thereby forming solder bumps or solder joints 150; and curing the liquid solder flux by applying radiation or heat to the substrate, thereby forming a solid film 160. The solder flux includes radiation curable, thermally curable, or dual curable materials that aid formation of solder bumps or joints before the solder flux is cured; and are curable to form a solid material by the application of radiation or heat.

Abstract translation: 使用的可辐射固化，可热固化的焊剂，或双重固化型焊剂形成焊料凸块或接头的方法是游离缺失光盘。 该方法包括施加液体助焊剂所做的是辐射可固化的或可热固化的基板检查没有焊剂覆盖接触焊盘在基板上; 放置在覆盖有辐射固化或热固化的焊剂接触焊盘的焊料球; 加热加入焊球接触焊盘，从而形成焊锡凸块或焊点的基底; 并且通过施加辐射或热量到基板，由此形成固体电影固化所述液体焊剂。 助焊剂包括可辐射固化的，热固化的，或双固化材料做助剂形成的焊料凸块或焊点的焊剂被固化之前的; 和可固化以形成通过辐射或热的施加的固体材料。

公开(公告)号：EP3042553A1

公开(公告)日：2016-07-13

申请号：EP14777490.5

申请日：2014-09-03

Applicant: Zizala Lichtsysteme GmbH

Inventor： KIESLINGER, Dietmar ,  WURM, Peter

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/305 ,  H05K1/181 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/099 ,  H05K2201/10106 ,  Y02P70/613

Abstract: Method for positionally stable soldering of at least one component part contact face (11) of an electronic component part (1) to at least one corresponding carrier plate contact face (12) of a carrier plate (2), said method comprising the following steps: a) applying at least two adhesive bonding points (3a, 3b, 8a, 8b, 9a, 9b) to the carrier plate (2), wherein the position of each adhesive bonding point (3a, 3b, 8a, 8b, 9a, 9b) is preset, b) populating the carrier plate (2) with the at least one electronic component part (1), wherein the position of the adhesive bonding points (3a, 3b, 8a, 8b, 9a, 9b) in step a) is preset in such a way that the at least one electronic componenet part (1) makes contact with the at least two adhesive bonding points (3a, 3b, 8a, 8b, 9a, 9b) substantially in an edge region formed by the at least one side face (5a, 5b, 5c, 5d) and the lower face (6), and the at least one component part contact face (11) at least partially overlaps with the at least one carrier plate contact face (12), c) waiting for a presettable time period t during a curing process for the adhesive bonding points (3a, 3b, 8a, 8b, 9a, 9b), d) heating the soldering material (13) in order to produce an electrical, mechanical and/or thermal connection between the at least one component part contact face (11) and the at least one carrier plate contact face (12).

公开(公告)号：EP2852263A4

公开(公告)日：2016-01-06

申请号：EP13791708

申请日：2013-04-11

Applicant: FUJI ELEC FA COMPONENTS & SYS

Inventor： OKAMOTO KOKICHI ,  TAGUCHI TAKAHIRO

IPC: H05K3/34

CPC classification number: H05K13/0465 ,  B23K1/20 ,  H01L2224/32225 ,  H01L2924/19105 ,  H05K3/303 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/2036 ,  Y02P70/613

公开(公告)号：EP2632237A4

公开(公告)日：2015-03-18

申请号：EP12817081

申请日：2012-05-16

Applicant: NGK SPARK PLUG CO

Inventor： ITO TATSUYA ,  MORI SEIJI ,  HAYASHI TAKAHIRO ,  WAKAZONO MAKOTO ,  NISHIDA TOMOHIRO

IPC: H05K3/34 ,  H05K3/28

CPC classification number: H05K1/0213 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4007 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2201/099 ,  H05K2201/09918 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the convection terminals.

公开(公告)号：EP2493274A4

公开(公告)日：2014-04-16

申请号：EP10824385

申请日：2010-01-25

Applicant: PRINCO CORP

Inventor： YANG CHIH-KUANG

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/04 ,  H05K3/38

CPC classification number: H05K3/4007 ,  H01L2224/11 ,  H05K1/111 ,  H05K1/118 ,  H05K3/048 ,  H05K2201/0367 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2203/0588 ,  H05K2203/0594

公开(公告)号：EP2659749A1

公开(公告)日：2013-11-06

申请号：EP11802080.9

申请日：2011-12-20

Applicant: Robert Bosch GmbH

Inventor： NOWOTNICK, Jens ,  WAGENBRENNER, Walter ,  WARMBOLD, Ulrich ,  HEINEMANN, Sven ,  LAUSMANN, Matthias ,  GEBHARDT, Holger ,  KLANTE, Bernhard

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0268 ,  H05K3/10 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/099 ,  H05K2203/0415 ,  Y10T29/49155

Abstract: The invention relates to a printed circuit board (10), with conductor tracks (11, 11a), which are arranged at least on a surface of the printed circuit board (10) and serve for the electrical contacting of components, and with at least one testing zone (12), which is formed by a portion of the conductor track (11) and serves for the electrical contacting of a testing element (20), in particular a testing head, wherein the surface of the printed circuit board (10) is provided with a protective layer (14), which is formed in the testing zone (12) such that it is interrupted in the region of a contact zone (15), and wherein the contact zone (15) is provided with a layer (18), which establishes an electrical contacting of the testing element (20) with the layer (18). According to the invention, it is provided that the contact zone (15) is arranged at least partially at a lateral distance from the edges of the conductor track (11) in the region of the testing zone (12).

公开(公告)号：EP2608640A2

公开(公告)日：2013-06-26

申请号：EP12197763.1

申请日：2012-12-18

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Denda, Tatsuaki ,  Kobayashi, Kazutaka

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H01L33/60 ,  H01L21/50 ,  H01L2224/16245 ,  H01L2924/181 ,  H05K1/0203 ,  H05K1/0265 ,  H05K1/0274 ,  H05K1/111 ,  H05K2201/09409 ,  H05K2201/098 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00012

Abstract: A light-emitting element mounting package includes a light-emitting element mounting portion (40) that includes a plurality of wiring portions (41, 42, 43, 44, 45) arranged interposing a predetermined gap between the wiring portions facing each other, and an insulating layer (30) on which the light-emitting element mounting portion is mounted, wherein an upper surface of the light-emitting element mounting portion is exposed on the insulating layer, wherein cutout portions are formed on lower sides of side edges of the wiring portions and contact the insulating layer.

Abstract translation: 发光元件安装封装包括发光元件安装部分（40），该发光元件安装部分（40）包括在彼此面对的布线部分之间布置有预定间隙的多个布线部分（41,42,43,44,45），以及 绝缘层（30），其上安装有发光元件安装部分，其中所述发光元件安装部分的上表面暴露在所述绝缘层上，其中，所述绝缘层形成在所述绝缘层的侧边的下侧 布线部分并与绝缘层接触。

公开(公告)号：EP2531010A2

公开(公告)日：2012-12-05

申请号：EP12158298.5

申请日：2012-03-06

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Uemura, Kozo ,  Shibusawa, Soichi ,  Hayashida, Yumiko ,  Nishimura, Kiyoshi ,  Kawashima, Seiko ,  Oyaizu, Tsuyoshi ,  Ogata, Masahiro ,  Matsuda, Shuhei ,  Tamai, Hiroki

IPC: H05K3/28

CPC classification number: H05K3/284 ,  F21S8/04 ,  F21V19/0055 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0209 ,  H05K3/244 ,  H05K2201/0162 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to one embodiment, a light-emitting device (1) includes a substrate (10), a reflecting layer (18) formed on the substrate, a light-emitting element (11) placed on the reflecting layer, and a sealing resin layer (12) that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm 3 /(m 2 ·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

Abstract translation: 根据一个实施例，发光装置（1）包括基板（10），形成在基板上的反射层（18），放置在反射层上的发光元件（11）以及密封树脂层 （12）覆盖反射层和发光元件。 密封树脂层的氧透过率为1200cm 3 /（m 2·day·atm）以下，被密封树脂​​层覆盖的反射层的面积相对于覆盖树脂基板的整个面积的比例 通过密封树脂层的厚度在30％和75％之间（包括端值）。

公开(公告)号：EP2209358A4

公开(公告)日：2012-07-04

申请号：EP09817569

申请日：2009-07-15

Applicant: IBIDEN CO LTD

Inventor： AKAI SHO ,  IMAI TATSUYA ,  TOKIHISA IKU

IPC: H05K3/46 ,  H05K3/34

CPC classification number: H05K3/3452 ,  H05K3/244 ,  H05K3/389 ,  H05K3/4644 ,  H05K2201/099 ,  H05K2203/025

公开(公告)号：EP2161976A4

公开(公告)日：2011-07-13

申请号：EP07721472

申请日：2007-06-15

Applicant: PRINCO CORP

Inventor： YANG CHIH-KUANG ,  HSING CHIEH-LIN

IPC: H05K3/34

CPC classification number: H05K3/4007 ,  H05K3/107 ,  H05K3/20 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/099