公开(公告)号：EP4432348A1

公开(公告)日：2024-09-18

申请号：EP23161841.4

申请日：2023-03-14

申请人： Infineon Technologies Austria AG

发明人： TAN, Joon Shyan ,  WANG, Lee Shuang ,  KASSIM, Azlina ,  LEE, Teck Sim ,  CHUA, Kok Yau ,  LEE, Chee Hong ,  YUAN, Zhihui

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49562 ,  H01L23/49589 ,  H01L2224/060320130101 ,  H01L2224/4824720130101 ,  H01L2224/490320130101 ,  H01L2224/4911220130101 ,  H01L2924/1904120130101 ,  H01L2924/1904320130101 ,  H01L2924/1910520130101 ,  H01L2924/1025320130101 ,  H01L2924/1027220130101 ,  H01L2924/1027120130101 ,  H01L2924/1032920130101 ,  H01L2924/103320130101 ,  H01L2224/0404220130101 ,  H01L2224/4024720130101 ,  H01L2224/3224520130101 ,  H01L2224/7326520130101 ,  H01L24/06 ,  H01L24/48 ,  H01L24/73 ,  H01L24/49

摘要： A power semiconductor package comprises: a first power semiconductor die arranged on and electrically coupled to a first side of a first die pad, a first passive electronic component comprising a first end and an opposite second end, wherein the first end is arranged on and coupled to the first side of the first die pad and the second end is coupled to an internal ledge of a first external contact, a second passive electronic component connected in series with the first passive electronic component, and an encapsulation encapsulating the first power semiconductor die and the first and second passive electronic components, wherein the first external contact is exposed from a first lateral side of the encapsulation.