公开(公告)号：EP4443480A1

公开(公告)日：2024-10-09

申请号：EP23192852.4

申请日：2023-08-23

申请人： LX Semicon Co., Ltd.

发明人： MOON, Dongwoo ,  KIM, Deogsoo ,  KIM, Taeryong

IPC分类号： H01L21/56 ,  H01L23/051 ,  H01L23/31 ,  H01L25/07 ,  H01L25/00 ,  H01L23/373 ,  H01L23/498

CPC分类号： H01L25/072 ,  H01L23/3735 ,  H01L25/50 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/051 ,  H01L23/3121 ,  H01L24/06 ,  H01L23/5385 ,  H01L2224/0618120130101 ,  H01L2224/0824520130101 ,  H01L2224/060320130101 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49562 ,  H01L23/49575

摘要： The embodiment relates to a power semiconductor module and a power converter including the same. A power semiconductor module according to an embodiment can include a first substrate and a second substrate, a sub-module disposed between the first substrate and the second substrate and a first conductive frame and a second conductive frame electrically connected to the sub-module. The sub-module can include a power semiconductor device disposed between a first internal conductive frame and a second internal conductive frame and a first mold disposed between the first internal conductive frame and the second internal conductive frame, and disposed on a side surface of the power semiconductor device.

公开(公告)号：EP4432350A1

公开(公告)日：2024-09-18

申请号：EP22903124.0

申请日：2022-11-09

申请人： Huawei Technologies Co., Ltd.

发明人： PENG, Xiping ,  LIU, Xusheng ,  YUAN, Zhenhua

IPC分类号： H01L23/498 ,  H05K1/18

CPC分类号： H01L23/498 ,  H01L23/49816 ,  H01L24/04 ,  H01L24/06 ,  H05K1/0245 ,  H01L23/49838 ,  H05K1/0228 ,  H05K1/0219

摘要： This application provides a package substrate, a semiconductor package, and an electronic device. The package substrate includes a substrate body. The substrate body is provided with a plurality of unit regions. Each unit region includes at least one solder ball group. The solder ball group includes a first solder ball, a second solder ball, a third solder ball, a fourth solder ball, a fifth solder ball, and a sixth solder ball that are arranged at spacings. The first solder ball, the second solder ball, the third solder ball, and the fourth solder ball are respectively located at four vertices of a parallelogram, and the second solder ball and the third solder ball each are adjacent to the first solder ball. The fifth solder ball is provided on a side of the parallelogram and is located between the first solder ball and the third solder ball. The sixth solder ball is provided on another side of the parallelogram and is located between the second solder ball and the fourth solder ball. The first solder ball and the fourth solder ball are located on a perpendicular bisector of a connection line between the fifth solder ball and the sixth solder ball. This can reduce crosstalk between pins and reduce a package area, to implement a high-density and low-crosstalk pin arrangement mode.

公开(公告)号：EP4423814A1

公开(公告)日：2024-09-04

申请号：EP22888403.7

申请日：2022-10-21

申请人： Adeia Semiconductor Bonding Technologies Inc.

发明人： GAO, Guilian ,  FOUNTAIN, Gaius, Gillman, Jr. ,  HABA, Belgacem

IPC分类号： H01L25/065 ,  H01L25/18 ,  H01L25/16 ,  H01L25/00 ,  H01L23/528

CPC分类号： H01L25/18 ,  H01L25/16 ,  H01L25/0657 ,  H01L2225/0654120130101 ,  H01L2225/0658920130101 ,  H01L24/16 ,  H01L24/08 ,  H01L2225/0652420130101 ,  H01L2225/065120130101 ,  H01L2225/0656520130101 ,  H01L24/48 ,  H01L23/5286 ,  H01L24/17 ,  H01L24/05 ,  H01L24/13 ,  H01L24/06 ,  H01L23/481

公开(公告)号：EP4052881B1

公开(公告)日：2024-08-21

申请号：EP21832648.6

申请日：2021-04-23

IPC分类号： H01L23/053 ,  H01L21/56 ,  H01L25/18 ,  H01L25/07 ,  H01L23/28 ,  B29C45/27 ,  B29C45/00 ,  H01L23/00

CPC分类号： H01L25/18 ,  H01L2224/060320130101 ,  H01L2224/4813920130101 ,  H01L23/053 ,  H01L25/072 ,  B29C45/0025 ,  B29C2045/002720130101 ,  B29C45/0046 ,  B29C45/27 ,  H01L2224/4822720130101 ,  H01L2224/4514420130101 ,  H01L2224/4514720130101 ,  H01L2224/4512420130101 ,  H01L2224/4501420130101 ,  H01L2224/3712420130101 ,  H01L2224/3714720130101 ,  H01L2224/371620130101 ,  H01L24/45 ,  H01L24/37 ,  H01L24/06 ,  H01L2924/1309120130101 ,  H01L2924/1305520130101 ,  H01L2924/120320130101 ,  H01L2924/1027220130101 ,  H01L2924/1025320130101 ,  H01L2924/103320130101 ,  H01L24/40 ,  H01L2224/4022520130101 ,  H01L24/48

公开(公告)号：EP4406014A1

公开(公告)日：2024-07-31

申请号：EP22777129.2

申请日：2022-08-23

申请人： QUALCOMM INCORPORATED

发明人： LI, Yue ,  LISK, Durodami ,  SUN, Jinying

IPC分类号： H01L23/485 ,  H01L21/60 ,  H01L25/065

CPC分类号： H01L24/02 ,  H01L2224/1622720130101 ,  H01L2224/1314720130101 ,  H01L2224/13120130101 ,  H01L2224/1308220130101 ,  H01L2224/1614620130101 ,  H01L2924/1531120130101 ,  H01L24/14 ,  H01L2224/1413120130101 ,  H01L2224/0512420130101 ,  H01L2224/023920130101 ,  H01L2224/034520130101 ,  H01L2224/0555820130101 ,  H01L2224/0501820130101 ,  H01L2224/039120130101 ,  H01L2224/0616720130101 ,  H01L2224/1413220130101 ,  H01L24/06 ,  H01L2224/040120130101 ,  H01L2224/0613120130101 ,  H01L2224/0613220130101 ,  H01L2224/8181520130101 ,  H01L2224/141120130101 ,  H01L2224/114720130101 ,  H01L24/03 ,  H01L24/11 ,  H01L2224/0554820130101 ,  H01L2224/0500820130101 ,  H01L2224/036120130101 ,  H01L2224/0362220130101 ,  H01L2224/0231320130101 ,  H01L2224/1184920130101 ,  H01L2224/8119120130101 ,  H01L2224/1718120130101 ,  H01L2224/1614520130101 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/0651720130101 ,  H01L2225/0651320130101 ,  H01L2225/0656820130101 ,  H01L2924/142120130101 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2924/38120130101 ,  H01L2224/06120130101 ,  H01L2224/0238120130101 ,  H01L2224/0613720130101 ,  H01L2924/1531320130101 ,  H01L2224/023520130101 ,  H01L2224/0616820130101 ,  H01L2224/0616920130101

公开(公告)号：EP4128341B1

公开(公告)日：2024-07-24

申请号：EP21776018.0

申请日：2021-03-23

IPC分类号： H01L23/50 ,  H01L23/538 ,  H01L23/495 ,  H01L23/373 ,  H01L25/16

CPC分类号： H01L2224/4813720130101 ,  H01L2224/4824720130101 ,  H01L2924/18120130101 ,  H01L2924/0001420130101 ,  H01L2224/4917120130101 ,  H01L23/495 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49531 ,  H01L23/3735 ,  H01F2027/06520130101 ,  H01L24/49 ,  H01L24/06 ,  H01L2224/0613520130101 ,  H01L2224/0555420130101 ,  H01L2224/0555320130101 ,  H01L2224/0404220130101 ,  H01L2924/1420130101 ,  H01L24/97 ,  H01L23/3107 ,  H01L25/16

公开(公告)号：EP3923325B1

公开(公告)日：2024-06-19

申请号：EP20892133.8

申请日：2020-08-06

IPC分类号： G11C5/02 ,  H01L23/485 ,  H01L23/49 ,  H01L25/065 ,  G11C5/06

CPC分类号： H01L23/488 ,  H01L23/31 ,  H01L25/0657 ,  H01L2225/065120130101 ,  H01L2225/0650620130101 ,  G11C5/063 ,  H01L24/06 ,  H01L24/49 ,  G11C5/025 ,  H01L2225/0656220130101 ,  H01L2225/0652720130101 ,  H01L2224/4911320130101 ,  H01L2924/0001420130101 ,  H01L2224/4822720130101 ,  H01L2924/18120130101 ,  H01L2924/1531120130101 ,  H01L24/48 ,  H01L2924/143420130101 ,  H01L2224/0555320130101 ,  H01L2224/0404220130101

公开(公告)号：EP4369393A1

公开(公告)日：2024-05-15

申请号：EP22206635.9

申请日：2022-11-10

申请人： Siemens Aktiengesellschaft

发明人： Stegmeier, Stefan ,  Wagner, Claus Florian ,  Woiton, Michael

IPC分类号： H01L23/485 ,  C23C4/134

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/060320130101 ,  H01L2224/0610220130101 ,  H01L2224/061220130101 ,  H01L2224/0341820130101 ,  C23C4/134 ,  H01L2224/0216620130101 ,  H01L2224/4514720130101 ,  H01L24/45 ,  H01L2924/130520130101 ,  H01L2924/130620130101 ,  H01L2924/1305520130101 ,  H01L2224/0584720130101 ,  H01L2224/058820130101 ,  H01L2224/8521420130101 ,  H01L24/85 ,  H01L2924/35120130101 ,  C23C4/06

摘要： Die Erfindung betrifft eine Halbleiteranordnung (2) mit einem schaltbaren Halbleiterelement (4), welches zumindest ein Steuerkontakt (6) mit einer Steuerkontakt-Kontaktfläche (12) und zumindest einen Lastkontakt (8) mit einer Lastkontakt-Kontaktfläche (14), welche größer als die Steuerkontakt-Kontaktfläche (12) ist, aufweist. Um eine höhere Lebensdauer der Halbleiteranordnung (2) zu erreichen, wird vorgeschlagen, dass ein elektrisch isolierender Werkstoff auf einen an die Steuerkontakt-Kontaktfläche (12) angrenzenden Bereich (34) der Lastkontakt-Kontaktfläche (14) mittels eines additiven Verfahrens zur Ausbildung einer elektrisch isolierenden Schicht (26) aufgebracht ist, wobei ein metallischer Werkstoff mittels eines thermischen Spritzverfahrens auf die Steuerkontakt-Kontaktfläche (12) und die elektrisch isolierende Schicht (26) zur Ausbildung eines metallischen Steuer-Kontaktierungselements (22) mit einer Steuer-Kontaktierungselement-Kontaktfläche (24), welche größer als die Steuerkontakt-Kontaktfläche (12) ist, aufgebracht ist, wobei das Steuer-Kontaktierungselement (22) die Lastkontakt-Kontaktfläche (14) teilweise überlappt.

公开(公告)号：EP4369392A1

公开(公告)日：2024-05-15

申请号：EP23191631.3

申请日：2023-08-16

申请人： Samsung Electronics Co., Ltd.

发明人： KIM, Hyeonjeong ,  LEE, Jongmin ,  CHOI, Jimin

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L25/0657 ,  H01L24/06 ,  H01L24/17 ,  H01L23/481 ,  H01L2224/060320130101 ,  H01L2224/0605120130101 ,  H01L2224/0651920130101 ,  H01L2224/0555220130101 ,  H01L2224/0555320130101 ,  H01L2224/0556820130101 ,  H01L2224/055720130101 ,  H01L25/18 ,  H01L2225/0651320130101 ,  H01L2225/0654120130101 ,  H01L2225/0651720130101 ,  H01L2225/0652720130101 ,  H01L2225/0658620130101

摘要： A semiconductor package includes a first semiconductor chip including a circuit layer on a first substrate, first through silicon vias passing through the first substrate, first lower bump pads on the circuit layer, and a first upper bump pad and a second upper bump pad on a second surface of the first substrate, each of the first upper bump pad and the second upper bump pad connected to a corresponding one of the first through silicon vias. The package includes a second semiconductor chip including a circuit layer on a first surface of a second substrate, and second lower bump pads on the circuit layer on the second substrate. The package includes a first solder bump to bond the first upper bump pad and the second lower bump pad, and a plurality of second solder bumps to bond the second upper bump pad and the second lower bump pads.

公开(公告)号：EP4216259B1

公开(公告)日：2024-05-15

申请号：EP22152939.9

申请日：2022-01-24

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L25/11

CPC分类号： H01L2224/0410520130101 ,  H01L2224/7326720130101 ,  H01L2224/9224420130101 ,  H01L2224/21420130101 ,  H01L2924/1309120130101 ,  H01L2224/3224520130101 ,  H01L2924/1305520130101 ,  H01L24/20 ,  H01L25/115 ,  H01L2224/1210520130101 ,  H01L2224/838420130101 ,  H01L24/19 ,  H01L2224/0605120130101 ,  H01L2224/0555120130101 ,  H01L2224/0555420130101 ,  H01L2224/0555320130101 ,  H01L2224/29120130101 ,  H01L24/06 ,  H01L23/49562 ,  H01L2224/060320130101 ,  H01L2224/0618120130101 ,  H01L2924/3010720130101 ,  H01L23/36