公开(公告)号：EP4258336A3

公开(公告)日：2024-08-14

申请号：EP23192886.2

申请日：2019-04-11

申请人： Analog Devices, Inc.

发明人： BENSON, Keith E. ,  CLARK, Michael Patrick ,  HEINY, Michael Baldwin ,  BU, Vincent Lixiang

IPC分类号： H01L23/66 ,  H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L23/04

CPC分类号： H01L23/04 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2223/662720130101 ,  H01L2223/668320130101 ,  H01L2224/0404220130101 ,  H01L2224/0562420130101 ,  H01L2224/0564420130101 ,  H01L2224/1300920130101 ,  H01L2224/1614520130101 ,  H01L2224/1622720130101 ,  H01L2224/1623520130101 ,  H01L2224/1718120130101 ,  H01L2224/2617520130101 ,  H01L2224/2901120130101 ,  H01L2224/2901420130101 ,  H01L2224/291920130101 ,  H01L2224/3222520130101 ,  H01L2224/3224520130101 ,  H01L2224/4809120130101 ,  H01L2224/4822720130101 ,  H01L2224/7320420130101 ,  H01L2224/7326520130101 ,  H01L2224/8338520130101 ,  H01L2224/859220130101 ,  H01L2224/9212520130101 ,  H01L2924/1025320130101 ,  H01L2924/103220130101 ,  H01L2924/1032920130101 ,  H01L2924/103320130101 ,  H01L2924/142120130101 ,  H01L2924/1421520130101 ,  H01L2924/142320130101 ,  H01L2924/1531120130101 ,  H01L2924/1531320130101 ,  H01L2924/1625120130101 ,  H01L2924/165920130101 ,  H01L2924/1904120130101 ,  H01L2924/1904320130101 ,  H01L2924/1910520130101 ,  H01L2924/3512120130101 ,  H01L23/66 ,  H01L2223/664420130101 ,  H01L23/3677 ,  H01L25/0655

摘要： A packaged radio frequency (RF) module is disclosed. The module can include a package substrate, a first die electrically and mechanically attached to the substrate, the first die comprising an RF switch, wherein the first die is flip-chip attached to the package substrate by way of a plurality of interconnects between the first die and the package substrate, a second die electrically and mechanically attached to the substrate, an encapsulating material protecting electrical connections between the first die and the package substrate, and a lid attached to the package substrate such that the package substrate and the lid at least partially define an air cavity within which the first and the second die are mounted, an active surface of the second die being exposed to the air cavity.

公开(公告)号：EP4156261B1

公开(公告)日：2024-10-09

申请号：EP20947073.1

申请日：2020-07-31

IPC分类号： H01L23/66 ,  H01L21/60 ,  H01L25/18 ,  H01Q1/22 ,  H01L25/10 ,  H01Q21/06

CPC分类号： H01L23/66 ,  H01L2223/667720130101 ,  H01L2223/661620130101 ,  H01L23/3677 ,  H01L24/96 ,  H01L2224/1210520130101 ,  H01L2224/251820130101 ,  H01L2224/0618120130101 ,  H01L2924/1032920130101 ,  H01L2924/103320130101 ,  H01L2924/1025320130101 ,  H01L25/18 ,  H01L25/0652 ,  H01L25/105 ,  H01L2225/103520130101 ,  H01L2225/105820130101 ,  H01L2225/109420130101 ,  H01L2224/0822520130101 ,  H01Q1/2283 ,  H01Q3/26 ,  H01Q21/065

公开(公告)号：EP3103138B1

公开(公告)日：2024-07-03

申请号：EP15714453.6

申请日：2015-03-30

IPC分类号： H01L21/60 ,  H01L21/50 ,  H01L23/498 ,  H01L23/10 ,  H01L23/488 ,  H01L23/473

CPC分类号： H01L23/10 ,  H01L23/473 ,  H01L23/49833 ,  H01L21/50 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2911120130101 ,  H01L2224/2911620130101 ,  H01L2224/2933920130101 ,  H01L2224/3222520130101 ,  H01L2224/3318120130101 ,  H01L2224/75320130101 ,  H01L2224/8319220130101 ,  H01L2224/8343920130101 ,  H01L2224/8344420130101 ,  H01L2224/8344720130101 ,  H01L2224/838220130101 ,  H01L2224/838420130101 ,  H01L2924/1025320130101 ,  H01L2924/1027220130101 ,  H01L2924/1032920130101 ,  H01L2924/103320130101 ,  H01L2924/1519220130101 ,  H01L2924/1615220130101 ,  H01L2924/1623520130101 ,  H01L2924/1625120130101 ,  H01L2924/1678720130101 ,  H01L2924/167920130101 ,  H01L2924/16520130101 ,  H01L2224/2929420130101 ,  H01L23/3735

公开(公告)号：EP2650906B1

公开(公告)日：2024-10-09

申请号：EP13003427.5

申请日：2005-06-02

IPC分类号： H01L21/308 ,  H01L21/208 ,  H01L21/326 ,  H01L21/4763 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08 ,  H01L23/00 ,  H01L29/786 ,  H01L27/12 ,  H01L31/18 ,  H01L21/683

CPC分类号： B81C2201/018520130101 ,  B82Y10/00 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/1804 ,  H01L2924/1204120130101 ,  Y10S977/724 ,  Y10S977/707 ,  Y02E10/547 ,  H01L2224/8300520130101 ,  H01L2224/0361420130101 ,  H01L2224/8086220130101 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L21/6835 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L2221/6836820130101 ,  H01L2221/6838120130101 ,  H01L2224/033220130101 ,  H01L2224/034520130101 ,  H01L2224/036220130101 ,  H01L2224/0507320130101 ,  H01L2224/0508220130101 ,  H01L2224/0512420130101 ,  H01L2224/0514420130101 ,  H01L2224/0515520130101 ,  H01L2224/0516620130101 ,  H01L2224/0555220130101 ,  H01L2224/0555320130101 ,  H01L2224/0555420130101 ,  H01L2224/0555520130101 ,  H01L2224/0564420130101 ,  H01L2224/0566620130101 ,  H01L2224/0822520130101 ,  H01L2224/291920130101 ,  H01L2224/3222520130101 ,  H01L2224/8000620130101 ,  H01L2224/8012120130101 ,  H01L2224/8089520130101 ,  H01L2224/8312120130101 ,  H01L2224/8319220130101 ,  H01L2224/8319320130101 ,  H01L2224/838520130101 ,  H01L2224/8386220130101 ,  H01L2224/920220130101 ,  H01L2224/9420130101 ,  H01L2224/9720130101 ,  H01L2924/1025320130101 ,  H01L2924/1032920130101 ,  H01L2924/1515920130101 ,  H01L2924/1516220130101 ,  H01L2924/157920130101 ,  H01L27/1285 ,  H01L27/1292 ,  H01L2924/1309120130101 ,  H01L2924/130620130101 ,  H01L2924/146120130101 ,  H01L21/02628 ,  H01L2924/130520130101 ,  H01L2924/1203220130101 ,  H01L2924/1578820130101 ,  H01L31/03926 ,  H01L31/1864 ,  H01L31/1896 ,  H01L2924/1204220130101 ,  H01L2924/1204420130101 ,  H01L2924/1203620130101 ,  H01L2924/1204320130101 ,  H01L2224/9520130101 ,  H01L2924/1306320130101 ,  H01L2924/1420130101 ,  H01L2924/1305520130101 ,  H01L21/02603 ,  Y02P70/50

公开(公告)号：EP4432348A1

公开(公告)日：2024-09-18

申请号：EP23161841.4

申请日：2023-03-14

申请人： Infineon Technologies Austria AG

发明人： TAN, Joon Shyan ,  WANG, Lee Shuang ,  KASSIM, Azlina ,  LEE, Teck Sim ,  CHUA, Kok Yau ,  LEE, Chee Hong ,  YUAN, Zhihui

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49562 ,  H01L23/49589 ,  H01L2224/060320130101 ,  H01L2224/4824720130101 ,  H01L2224/490320130101 ,  H01L2224/4911220130101 ,  H01L2924/1904120130101 ,  H01L2924/1904320130101 ,  H01L2924/1910520130101 ,  H01L2924/1025320130101 ,  H01L2924/1027220130101 ,  H01L2924/1027120130101 ,  H01L2924/1032920130101 ,  H01L2924/103320130101 ,  H01L2224/0404220130101 ,  H01L2224/4024720130101 ,  H01L2224/3224520130101 ,  H01L2224/7326520130101 ,  H01L24/06 ,  H01L24/48 ,  H01L24/73 ,  H01L24/49

摘要： A power semiconductor package comprises: a first power semiconductor die arranged on and electrically coupled to a first side of a first die pad, a first passive electronic component comprising a first end and an opposite second end, wherein the first end is arranged on and coupled to the first side of the first die pad and the second end is coupled to an internal ledge of a first external contact, a second passive electronic component connected in series with the first passive electronic component, and an encapsulation encapsulating the first power semiconductor die and the first and second passive electronic components, wherein the first external contact is exposed from a first lateral side of the encapsulation.

公开(公告)号：EP4409634A1

公开(公告)日：2024-08-07

申请号：EP22786042.6

申请日：2022-09-27

申请人： Commissariat à l'énergie atomique et aux énergies alternatives

发明人： BELOT, Didier ,  BOUTRY, Hervé ,  DORE, Jean-Baptiste ,  VALORGE, Olivier

IPC分类号： H01L23/522 ,  H01L21/8258 ,  H01L23/64 ,  H01L23/66 ,  H01L23/00 ,  H01L25/065 ,  H01L27/06

CPC分类号： H01L23/522 ,  H01L23/66 ,  H01L25/0657 ,  H01L2225/0651320130101 ,  H01L2225/0653120130101 ,  H01L2225/0656520130101 ,  H01L2223/667720130101 ,  H01L2223/664420130101 ,  H01L2924/14220130101 ,  H01L2224/130820130101 ,  H01L2224/1314720130101 ,  H01L2224/9420130101 ,  H01L2224/1614520130101 ,  H01L2224/3214520130101 ,  H01L2224/7320420130101 ,  H01L2924/1032920130101 ,  H01L2924/1025320130101 ,  H01L2224/8119320130101 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/94 ,  H01L2224/13120130101