公开(公告)号：EP4170710A1

公开(公告)日：2023-04-26

申请号：EP22196757.3

申请日：2022-09-21

申请人： InnoLux Corporation

发明人： TING, Chin-Lung ,  KAO, Ker-Yih ,  WANG, Cheng-Chi ,  FAN, Kuang-Ming ,  CHEN, Chun-Hung ,  LIAO, Wen-Hsiang ,  SHIH, Ming-Hsien

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00

摘要： An electronic device including a connection element is provided. The connection element includes a first insulation layer and a second insulation layer. The first insulation layer has a first opening. A sidewall of the first insulation layer at the first opening has roughness different from roughness of a top surface of the first insulation layer. The second insulation layer is disposed on the first insulation layer, and the second insulation layer has a second opening. The sidewall of the first insulation layer at the first opening is exposed by the second opening. A method of fabricating an electronic device is also provided.

公开(公告)号：EP4170709A1

公开(公告)日：2023-04-26

申请号：EP22196104.8

申请日：2022-09-16

申请人： InnoLux Corporation

发明人： TING, Chin-Lung ,  KAO, Ker-Yih ,  WANG, Cheng-Chi ,  FAN, Kuang-Ming ,  CHEN, Chun-Hung ,  LIAO, Wen-Hsiang ,  SHIH, Ming-Hsien

IPC分类号： H01L23/498 ,  H01L23/538

摘要： An electronic device including a connection element is provided. The connection element includes a first metal layer, a first insulation layer, and a second insulation layer. The first insulation layer is disposed on the first metal layer and has a first hole and a second hole. The second insulation layer is disposed on the first insulation layer. The first hole exposes a portion of the first metal layer, and the second insulation layer extends into the second hole. A method of fabricating an electronic device is also provided.

公开(公告)号：EP4231344A3

公开(公告)日：2023-11-01

申请号：EP22215289.4

申请日：2022-12-21

申请人： InnoLux Corporation

发明人： TING, Chin-Lung ,  WEI, Chung-Kuang ,  WANG, Cheng-Chi ,  CHEN, Yeong-E ,  LIN, Yi-Hung

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/473

摘要： An electronic device (100, 200, 300) is disclosed. The electronic device (100, 200, 300) includes a circuit layer (110), an electronic element (120) and a thermal conducting element (130). The electronic element (120) is disposed on the circuit layer (110) and electrically connected to the circuit layer (110). The thermal conducting element (130) is disposed between the circuit layer (110) and the electronic element (120). The thermal conducting element (130) is used for performing heat exchange with the electronic element (120).

公开(公告)号：EP4231344A2

公开(公告)日：2023-08-23

申请号：EP22215289.4

申请日：2022-12-21

申请人： InnoLux Corporation

发明人： TING, Chin-Lung ,  WEI, Chung-Kuang ,  WANG, Cheng-Chi ,  CHEN, Yeong-E ,  LIN, Yi-Hung

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/473

摘要： An electronic device (100, 200, 300) is disclosed. The electronic device (100, 200, 300) includes a circuit layer (110), an electronic element (120) and a thermal conducting element (130). The electronic element (120) is disposed on the circuit layer (110) and electrically connected to the circuit layer (110). The thermal conducting element (130) is disposed between the circuit layer (110) and the electronic element (120). The thermal conducting element (130) is used for performing heat exchange with the electronic element (120).

公开(公告)号：EP4343836A3

公开(公告)日：2024-04-10

申请号：EP23193386.2

申请日：2023-08-25

申请人： InnoLux Corporation

发明人： HUANG, Yu-Chia ,  WANG, Ju-Li ,  HSU, Nai-Fang ,  WANG, Cheng-Chi ,  YUEH, Jui-Jen

IPC分类号： H01L23/538

摘要： An electronic device (100) and a related tiled electronic device (DE) are disclosed. The electronic device (100) includes a protective layer (110), a circuit structure (120), a sensing element (130) and a control unit (140). The circuit structure (120) is disposed on the protective layer (110) and surrounds the sensing element (130). The control unit (140) is disposed between the circuit structure (120) and the protective layer (110) and electrically connected to the sensing element (130). The protective layer (110) surrounds the control unit (140) and contacts a surface of the circuit structure (120).

公开(公告)号：EP4343836A2

公开(公告)日：2024-03-27

申请号：EP23193386.2

申请日：2023-08-25

申请人： InnoLux Corporation

发明人： HUANG, Yu-Chia ,  WANG, Ju-Li ,  HSU, Nai-Fang ,  WANG, Cheng-Chi ,  YUEH, Jui-Jen

IPC分类号： H01L23/538

摘要： An electronic device (100) and a related tiled electronic device (DE) are disclosed. The electronic device (100) includes a protective layer (110), a circuit structure (120), a sensing element (130) and a control unit (140). The circuit structure (120) is disposed on the protective layer (110) and surrounds the sensing element (130). The control unit (140) is disposed between the circuit structure (120) and the protective layer (110) and electrically connected to the sensing element (130). The protective layer (110) surrounds the control unit (140) and contacts a surface of the circuit structure (120).

公开(公告)号：EP4293708A1

公开(公告)日：2023-12-20

申请号：EP23174318.8

申请日：2023-05-19

申请人： InnoLux Corporation

发明人： WANG, Cheng-Chi ,  YUEH, Jui-Jen ,  LEE, Kuan-Feng

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/18

摘要： An electronic device (1) including a chip (10), an element structure layer (11), a redistribution structure layer (12) and a protective layer (13) is provided. The chip (10) has an active surface (S10A) and a plurality of contacts (100) disposed on the active surface (S10A). The element structure layer (11) is disposed adjacent to the active surface (S10A) and has a switch element (SW). The switch element (SW) is electrically connected to the chip (10) through at least one of the plurality of contacts (100). The redistribution structure layer (12) is disposed adjacent to the active surface (S10A) and is electrically connected to the chip (10) through at least one of the plurality of contacts (100). The protective layer (13) includes a first portion (130) and a second portion (131). The first portion (130) surrounds the chip (10), and the second portion (131) surrounds the element structure layer (11) and the redistribution structure layer (12). A manufacturing method of an electronic device (1) is also provided.