公开(公告)号：EP4006964A1

公开(公告)日：2022-06-01

申请号：EP21207688.9

申请日：2021-11-11

申请人： InnoLux Corporation

发明人： TING, Chin-Lung ,  CHI, Jen-Hai ,  TSENG, Chia-Ping ,  YEH, Chen-Lin ,  WEI, Chung-Kuang ,  CHOU, Cheng-Hsu

IPC分类号： H01L21/8252 ,  H01L27/06 ,  H01L27/07 ,  H01L29/93

摘要： The disclosure provides an electronic device. The electronic device includes a substrate (110), a transistor (120), and a variable capacitor (130). The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

公开(公告)号：EP3995880A1

公开(公告)日：2022-05-11

申请号：EP21203383.1

申请日：2021-10-19

申请人： InnoLux Corporation

发明人： LIOU, Hao-Yu ,  WENG, Ruey-Jer ,  SUMI, Naoki ,  HSIEH, Chih-Yung ,  WEI, Chung-Kuang

IPC分类号： G02B27/01

摘要： A display method of an image is disclosed. A first vergence plane (Pvl) of two eyes (1021, 1023) of a user is located at a first position when the user views a first image (V1). A second vergence plane (Pv2) of the two eyes (1021, 1023) is located at a second position when the user views an object in the environmental scene. A first distance (D1) existing between the first position and the user and a second distance (D2) existing between the second position and the user satisfy a first relation: Dn ∗ {tan[tan -1 (2 ∗ D2/De)-δ]}-D2, Δf=(De/2) ∗ {tan[tan -1 (2 ∗ D2/De)+δ]}-D2, De represents a distance (De) between the two eyes (1021, 1023), δ represents an eye angular resolution of the two eyes (1021, 1023), and δ=0.02 degrees.

公开(公告)号：EP3657483A1

公开(公告)日：2020-05-27

申请号：EP19209112.2

申请日：2019-11-14

申请人： InnoLux Corporation

发明人： SHIH, Ming-Chia ,  TSENG, Ming-Chun ,  WEI, Chung-Kuang ,  TING, Chin-Lung

IPC分类号： G09G3/3233

摘要： An electronic device includes a power source unit and an electronic unit. The electronic unit includes a first switch, a light-emitting unit, and a plurality of pulse switches. The first switch is coupled to the power source unit, and the first switch has a gate electrode. The light-emitting unit is coupled to the first switch. The plurality of pulse switches are coupled to the gate electrode of the first switch. Therefore, the brightness of the light-emitting unit may be effectively controlled to improve the quality of the electronic device.

公开(公告)号：EP4231344A3

公开(公告)日：2023-11-01

申请号：EP22215289.4

申请日：2022-12-21

申请人： InnoLux Corporation

发明人： TING, Chin-Lung ,  WEI, Chung-Kuang ,  WANG, Cheng-Chi ,  CHEN, Yeong-E ,  LIN, Yi-Hung

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/473

摘要： An electronic device (100, 200, 300) is disclosed. The electronic device (100, 200, 300) includes a circuit layer (110), an electronic element (120) and a thermal conducting element (130). The electronic element (120) is disposed on the circuit layer (110) and electrically connected to the circuit layer (110). The thermal conducting element (130) is disposed between the circuit layer (110) and the electronic element (120). The thermal conducting element (130) is used for performing heat exchange with the electronic element (120).

公开(公告)号：EP4231344A2

公开(公告)日：2023-08-23

申请号：EP22215289.4

申请日：2022-12-21

申请人： InnoLux Corporation

发明人： TING, Chin-Lung ,  WEI, Chung-Kuang ,  WANG, Cheng-Chi ,  CHEN, Yeong-E ,  LIN, Yi-Hung

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/473

摘要： An electronic device (100, 200, 300) is disclosed. The electronic device (100, 200, 300) includes a circuit layer (110), an electronic element (120) and a thermal conducting element (130). The electronic element (120) is disposed on the circuit layer (110) and electrically connected to the circuit layer (110). The thermal conducting element (130) is disposed between the circuit layer (110) and the electronic element (120). The thermal conducting element (130) is used for performing heat exchange with the electronic element (120).

公开(公告)号：EP4109500A3

公开(公告)日：2023-04-05

申请号：EP22174505.2

申请日：2022-05-20

申请人： InnoLux Corporation

发明人： LIN, Yi Hung ,  TSAI, Hsiu-Yi ,  TING, Chin-Lung ,  WEI, Chung-Kuang

IPC分类号： H01L21/66 ,  H01L33/00

摘要： A manufacturing method of an electronic device (100, 300, 400, 500, 600, 700) is provided. The manufacturing method includes following steps: providing a substrate (101, 301, 401, 501, 601, 701); bonding at least one electronic component (110, 310, 410, 510, 610, 710, 810, 910_1, 910_2, 1010, 1110_1, 1110_2, 1210) to the substrate (101, 301, 401, 501, 601, 701); applying a forward bias to the at least one electronic component (110, 310, 410, 510, 610, 710, 810, 910_1, 910_2, 1010, 1110_1, 1110_2, 1210), and determining whether the at least one electronic component (110, 310, 410, 510, 610, 710, 810, 910_1, 910_2, 1010, 1110_1, 1110_2, 1210) is normal or failed; and transporting the substrate (101, 301, 401, 501, 601, 701) to a next production site or repairing the at least one electronic component (110, 310, 410, 510, 610, 710, 810, 910_1, 910_2, 1010, 1110_1, 1110_2, 1210).

公开(公告)号：EP4020075A1

公开(公告)日：2022-06-29

申请号：EP21214007.3

申请日：2021-12-13

申请人： InnoLux Corporation

发明人： YEH, Chen-Lin ,  WEI, Chung-Kuang ,  CHI, Jen-Hai ,  WU, Yan-Zheng

IPC分类号： G02F1/1333 ,  G02F1/13 ,  H01Q3/44 ,  H01Q3/34 ,  H01G7/06

摘要： An electronic device (1, 1A) and a manufacturing method thereof are provided. The manufacturing method of the electronic device (1, 1A) includes: providing a substrate (SUB); providing an adjustable element (10, 10A, 10B, 10C), including a liquid crystal layer (LC); and bonding the adjustable element (10, 10A, 10B, 10C) onto the substrate (SUB).

公开(公告)号：EP4109500A2

公开(公告)日：2022-12-28

申请号：EP22174505.2

申请日：2022-05-20

申请人： InnoLux Corporation

发明人： LIN, Yi Hung ,  TSAI, Hsiu-Yi ,  TING, Chin-Lung ,  WEI, Chung-Kuang

IPC分类号： H01L21/66

摘要： A manufacturing method of an electronic device (100, 300, 400, 500, 600, 700) is provided. The manufacturing method includes following steps: providing a substrate (101, 301, 401, 501, 601, 701); bonding at least one electronic component (110, 310, 410, 510, 610, 710, 810, 910_1, 910_2, 1010, 1110_1, 1110_2, 1210) to the substrate (101, 301, 401, 501, 601, 701); applying a forward bias to the at least one electronic component (110, 310, 410, 510, 610, 710, 810, 910_1, 910_2, 1010, 1110_1, 1110_2, 1210), and determining whether the at least one electronic component (110, 310, 410, 510, 610, 710, 810, 910_1, 910_2, 1010, 1110_1, 1110_2, 1210) is normal or failed; and transporting the substrate (101, 301, 401, 501, 601, 701) to a next production site or repairing the at least one electronic component (110, 310, 410, 510, 610, 710, 810, 910_1, 910_2, 1010, 1110_1, 1110_2, 1210).

公开(公告)号：EP4060653A1

公开(公告)日：2022-09-21

申请号：EP22167704.0

申请日：2019-11-14

申请人： InnoLux Corporation

发明人： SHIH, Ming-Chia ,  TSENG, Ming-Chun ,  WEI, Chung-Kuang ,  TING, Chin-Lung

IPC分类号： G09G3/3233 ,  G09G3/3258

摘要： An electronic device includes a power source unit and an electronic unit. The electronic unit includes a first switch, a light-emitting unit, and a plurality of pulse switches. The first switch is coupled to the power source unit, and the first switch has a gate electrode. The light-emitting unit is coupled to the first switch. The plurality of pulse switches are coupled to the gate electrode of the first switch. Therefore, the brightness of the light-emitting unit may be effectively controlled to improve the quality of the electronic device.

公开(公告)号：EP4027458A1

公开(公告)日：2022-07-13

申请号：EP22150111.7

申请日：2022-01-04

申请人： InnoLux Corporation

发明人： YEH, Chen-Lin ,  TING, Chin-Lung ,  WEI, Chung-Kuang ,  CHI, Jen-Hai ,  LIN, Yi-Hung ,  WU, Yan-Zheng

IPC分类号： H01Q15/00 ,  H01Q1/22

摘要： Disclosed is an electronic device (1), including a substrate (10), a first electrode (11), a second electrode (12), a modulation element (13), a first solder (14), and a switch element (15). The first electrode (11) is disposed on the substrate (10). The second electrode (12) is disposed on the substrate (10). The modulation element (13) is disposed on the substrate (10) and includes at least two connecting pads (PI, P2). The first solder (14) is disposed between the first electrode (11) and one connecting pad (PI) of the modulation element (13). The switch element (15) is disposed on the substrate (10). The one connecting pad (PI) of the modulation element (13) is electrically connected to the switch element (15) sequentially through the first solder (14), the first electrode (11), and the second electrode (12).