公开(公告)号：EP4246817A1

公开(公告)日：2023-09-20

申请号：EP23158993.8

申请日：2023-02-28

申请人： InnoLux Corporation

发明人： CHI, Jen-Hai ,  YEH, Chen-Lin ,  TING, Chin-Lung

IPC分类号： H04B1/04 ,  H04B1/18

摘要： An electronic device (1) including a tuning element (10) is provided. The tuning element (10) includes a first capacitor element (100) including a first switch (T1) and a first capacitor (C1) electrically coupled to the first switch (T1) and a second capacitor element (102) including a second capacitor (C2). The first capacitor element (100) is electrically connected in parallel with the second capacitor element (102).

公开(公告)号：EP4006964A1

公开(公告)日：2022-06-01

申请号：EP21207688.9

申请日：2021-11-11

申请人： InnoLux Corporation

发明人： TING, Chin-Lung ,  CHI, Jen-Hai ,  TSENG, Chia-Ping ,  YEH, Chen-Lin ,  WEI, Chung-Kuang ,  CHOU, Cheng-Hsu

IPC分类号： H01L21/8252 ,  H01L27/06 ,  H01L27/07 ,  H01L29/93

摘要： The disclosure provides an electronic device. The electronic device includes a substrate (110), a transistor (120), and a variable capacitor (130). The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

公开(公告)号：EP4020075A1

公开(公告)日：2022-06-29

申请号：EP21214007.3

申请日：2021-12-13

申请人： InnoLux Corporation

发明人： YEH, Chen-Lin ,  WEI, Chung-Kuang ,  CHI, Jen-Hai ,  WU, Yan-Zheng

IPC分类号： G02F1/1333 ,  G02F1/13 ,  H01Q3/44 ,  H01Q3/34 ,  H01G7/06

摘要： An electronic device (1, 1A) and a manufacturing method thereof are provided. The manufacturing method of the electronic device (1, 1A) includes: providing a substrate (SUB); providing an adjustable element (10, 10A, 10B, 10C), including a liquid crystal layer (LC); and bonding the adjustable element (10, 10A, 10B, 10C) onto the substrate (SUB).

公开(公告)号：EP4040481A1

公开(公告)日：2022-08-10

申请号：EP22153616.2

申请日：2022-01-27

申请人： InnoLux Corporation

发明人： CHI, Jen-Hai ,  YEH, Chen-Lin ,  HSIEH, Chih-Yung

IPC分类号： H01L23/498 ,  H01L23/495 ,  H01L23/538 ,  H01L25/16

摘要： The disclosure provides an electronic device, including a substrate, a first conductor layer, a first insulating layer, an electronic component, and a driving structure. The first conductor layer is arranged on the substrate. The first insulating layer is disposed on the first conductor layer. The electronic component is arranged on the first insulating layer and coupled to the first conductor layer. The driving structure is coupled to the electronic component. The electronic device in the disclosure can have improved structural reliability.

公开(公告)号：EP4030554A1

公开(公告)日：2022-07-20

申请号：EP21213990.1

申请日：2021-12-13

申请人： InnoLux Corporation

发明人： YEH, Chen-Lin ,  LAI, Ming-Sheng ,  WU, Yan-Zheng

IPC分类号： H01P1/20 ,  H01P1/203 ,  H01P5/04 ,  H01Q15/10 ,  H01Q3/46 ,  H01Q19/06

摘要： An electronic device (1) includes a substrate (10), a plurality of conductive patterns (11), and a tunable element (12). The plurality of conductive patterns (11) are disposed on the substrate (10). The tunable element (12) is disposed on at least one conductive pattern (11-1, 11-2) in the plurality of conductive patterns (11) and includes a first pad (PI), a second pad (P2), and a third pad (P3). The first pad (PI), the second pad (P2), and the third pad (P3) are separated from each other. The first pad (P1) and the second pad (P2) are overlapped with the at least one conductive pattern (11-1, 11-2) in the plurality of conductive patterns (11). The third pad (P3) is disposed between the first pad (P1) and the second pad (P2).

公开(公告)号：EP4027458A1

公开(公告)日：2022-07-13

申请号：EP22150111.7

申请日：2022-01-04

申请人： InnoLux Corporation

发明人： YEH, Chen-Lin ,  TING, Chin-Lung ,  WEI, Chung-Kuang ,  CHI, Jen-Hai ,  LIN, Yi-Hung ,  WU, Yan-Zheng

IPC分类号： H01Q15/00 ,  H01Q1/22

摘要： Disclosed is an electronic device (1), including a substrate (10), a first electrode (11), a second electrode (12), a modulation element (13), a first solder (14), and a switch element (15). The first electrode (11) is disposed on the substrate (10). The second electrode (12) is disposed on the substrate (10). The modulation element (13) is disposed on the substrate (10) and includes at least two connecting pads (PI, P2). The first solder (14) is disposed between the first electrode (11) and one connecting pad (PI) of the modulation element (13). The switch element (15) is disposed on the substrate (10). The one connecting pad (PI) of the modulation element (13) is electrically connected to the switch element (15) sequentially through the first solder (14), the first electrode (11), and the second electrode (12).