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公开(公告)号：EP2232592A2
公开(公告)日：2010-09-29
申请号：EP08858951.0
申请日：2008-12-12
申请人： Innotec Corporation
IPC分类号： H01L33/00
CPC分类号： B60Q1/2696 , B60Q3/217 , F21K9/00 , F21V19/001 , H05K1/142 , H05K1/148 , H05K1/185 , H05K1/189 , H05K3/202 , H05K3/284 , H05K3/3405 , H05K5/064 , H05K2201/0108 , H05K2201/0129 , H05K2201/09118 , H05K2201/10106 , H05K2201/10151 , H05K2201/1034 , H05K2201/10689 , H05K2203/1316 , H05K2203/1476 , Y10T29/49002 , Y10T29/49146
摘要： An electrical device includes a circuit board having one or more electrical components mounted to the circuit board. At least a portion of the circuit board is encapsulated in a thermoplastic polymer material to encapsulate the electrical components. The device may be fabricated by at least partially shielding the electrical components with polymer material, followed by overmolding the polymer material with thermoplastic polymer material. The shielding material may comprise a pre-formed component, or it may comprise thermoplastic polymer material that is molded around the electrical components in a first molding step or 'shot'.
摘要翻译： 电气设备包括具有安装到电路板的一个或多个电气部件的电路板。 电路板的至少一部分被封装在热塑性聚合物材料中以封装电气部件。 该装置可以通过用聚合物材料至少部分地屏蔽电气部件，然后用热塑性聚合物材料包覆模制聚合物材料来制造。 屏蔽材料可以包括预成型部件，或者它可以包括在第一模制步骤或“射击”中围绕电气部件模制的热塑性聚合物材料。
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公开(公告)号：EP2232592B1
公开(公告)日：2013-07-17
申请号：EP08858951.0
申请日：2008-12-12
申请人： Innotec Corporation
CPC分类号： B60Q1/2696 , B60Q3/217 , F21K9/00 , F21V19/001 , H05K1/142 , H05K1/148 , H05K1/185 , H05K1/189 , H05K3/202 , H05K3/284 , H05K3/3405 , H05K5/064 , H05K2201/0108 , H05K2201/0129 , H05K2201/09118 , H05K2201/10106 , H05K2201/10151 , H05K2201/1034 , H05K2201/10689 , H05K2203/1316 , H05K2203/1476 , Y10T29/49002 , Y10T29/49146
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