公开(公告)号：EP1949770B1

公开(公告)日：2018-12-12

申请号：EP06809714.6

申请日：2006-10-26

申请人： Koninklijke Philips N.V.

发明人： WEEKAMP, Johannes W. ,  VAN DEN ACKERVEKEN, Antonius, C. J. C. ,  ANSEMS, Will J. H.

IPC分类号： B01L3/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/20 ,  H05K7/00 ,  H05K13/04 ,  H05K3/00

CPC分类号： H05K7/00 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0838 ,  H01L2224/85385 ,  H05K1/0284 ,  H05K1/182 ,  H05K3/0014 ,  H05K3/20 ,  H05K13/046 ,  H05K2201/09118 ,  H05K2201/10151 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/4981

摘要： A package carrier enclosing at least one microelectronic element has a pattern of electrically conductive connection pads for electric connection of the package to another device. The package carrier is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern to one side of the carrier; bending the carrier to create a shape having an elevated portion and recessed portions; forming a body member on the carrier at the side where the electrically conductive pattern is present; removing the sacrificial carrier; and placing a microelectronic element in a recess created in the body member at the position where the elevated portion of the carrier has been, and connecting the microelectronic element to the electrically conductive pattern. Furthermore, a hole in the package provides access to a sensitive surface of the microelectronic element.

公开(公告)号：EP2198484B1

公开(公告)日：2018-12-05

申请号：EP08786264.5

申请日：2008-07-18

申请人： Robert Bosch GmbH

发明人： KOPF, Stefan ,  ROHDE, Hartmut

IPC分类号： H01R12/71

CPC分类号： H05K3/368 ,  H01R12/714 ,  H01R13/405 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/181 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10393

公开(公告)号：EP2981507B1

公开(公告)日：2018-06-20

申请号：EP14778389.8

申请日：2014-04-02

申请人： BYD Company Limited

发明人： GONG, Qing ,  ZHOU, Wei ,  MAO, Bifeng ,  MIAO, Weifeng

IPC分类号： C09D11/02 ,  H01B5/14 ,  B01J37/04 ,  C23C18/16 ,  C23C18/20 ,  H05K3/18 ,  C23C18/18 ,  C01G37/00 ,  C01G39/00 ,  C01G49/00 ,  C01G15/00 ,  C09D11/10 ,  C09D11/322 ,  B01J37/08 ,  B01J23/00 ,  B01J23/887 ,  B01J35/02 ,  B01J23/825 ,  B01J37/34 ,  B01J31/06 ,  B01J23/86

CPC分类号： C09D11/322 ,  B01J23/002 ,  B01J23/825 ,  B01J23/868 ,  B01J23/8874 ,  B01J23/8878 ,  B01J31/06 ,  B01J35/023 ,  B01J37/0036 ,  B01J37/04 ,  B01J37/08 ,  B01J37/349 ,  B01J2523/00 ,  C01G15/006 ,  C01G37/006 ,  C01G39/006 ,  C01G49/009 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/60 ,  C01P2006/80 ,  C09D11/10 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1879 ,  C23C18/204 ,  C23C18/206 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0709 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/125 ,  B01J2523/17 ,  B01J2523/31 ,  B01J2523/67 ,  B01J2523/32 ,  B01J2523/842 ,  B01J2523/33 ,  B01J2523/68

摘要： The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0

公开(公告)号：EP3305042A1

公开(公告)日：2018-04-11

申请号：EP16725137.0

申请日：2016-05-26

申请人： Valeo Vision

发明人： HUE, David ,  ZOJCESKI, Zdravko

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K3/32 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/185 ,  H05K3/305 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/1469

摘要： The invention proposes a moulded interconnection device (MID) comprising at least one electronic component, for example a light-emitting diode (LED) light source. The electrical and mechanical connections between the light source and the conductive tracks of the MID do not have intermetallic interfaces and are more durable relative to known devices. The invention also proposes a method for assembling a light source on an MID during the production of the latter. Since all of the steps of the method can be carried out at ambient temperature, the risk of damage to the components used is diminished.

公开(公告)号：EP3196338A4

公开(公告)日：2017-12-13

申请号：EP15849159

申请日：2015-08-28

申请人： BYD CO LTD

发明人： ZHOU WEI ,  MIAO WEIFENG ,  MAO BIFENG ,  ZHOU FANGXIANG

IPC分类号： C23C18/20 ,  B32B15/00 ,  B32B27/06 ,  C23C18/16 ,  C23C18/28 ,  H05K3/18

CPC分类号： C23C18/206 ,  B32B15/00 ,  B32B27/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/20 ,  C23C18/204 ,  C23C18/285 ,  H05K3/185 ,  H05K2201/09118

摘要： A metalized plastic article and a method for selectively metallizing a surface of a plastic substrate are provide. The metalized plastic article includes a plastic substrate and a metal plating layer formed on the surface of the plastic substrate. At least a surface layer of the plastic substrate covered by the metal plating layer is formed by a plastic composition. The plastic composition includes a base resin and a doped tin oxide. A doping element of the doped tin oxide is at least one selected from a group consisting of cerium, lanthanum, fluorine and tantalum. The metalized plastic article of the present disclosure has a good light absorption performance and a high chemical plating activity.

公开(公告)号：EP3250013A1

公开(公告)日：2017-11-29

申请号：EP16758718.7

申请日：2016-02-09

申请人： Omron Corporation

发明人： KAWAI, Wakahiro

IPC分类号： H05K1/18 ,  H05K3/00

CPC分类号： H05K1/0284 ,  H01L2224/20 ,  H01L2224/24195 ,  H05K1/185 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2201/09218 ,  H05K2201/10636 ,  H05K2203/1469

摘要： An electronic component (11) is embedded in an end portion of a surface (P1) and an end portion of a surface (P2) adjacent to each other in a three-dimensional base (2). The portion of an electrode (21) exposed from the surface (P1) and an electrode (101) of a packaged IC (41) are connected to each other via a wiring line (201). The portion of the electrode (21) exposed from the surface (P2) and an electrode (25) of an electronic component (15) are connected to each other via a wiring line (202). Accordingly, it is possible to realize a three-dimensional circuit structure requiring no wiring line spanning over or along an end portion thereof.

摘要翻译： 电子部件（11）嵌入三维基体（2）中的彼此相邻的表面（P1）的端部和表面（P2）的端部。 从表面（P1）露出的电极（21）的一部分和封装IC（41）的电极（101）通过布线（201）相互连接。 电极21的从表面P2露出的部分和电子部件15的电极25经由布线202连接。 因此，可以实现不需要布线跨越或沿着其端部的三维电路结构。

公开(公告)号：EP2981507A4

公开(公告)日：2017-04-26

申请号：EP14778389

申请日：2014-04-02

申请人： BYD CO LTD

发明人： GONG QING ,  ZHOU WEI ,  MAO BIFENG ,  MIAO WEIFENG

IPC分类号： C09D11/02 ,  B01J23/00 ,  B01J23/825 ,  B01J23/86 ,  B01J23/887 ,  B01J35/02 ,  B01J37/00 ,  B01J37/04 ,  B01J37/08 ,  B01J37/34 ,  C01G15/00 ,  C01G37/00 ,  C01G39/00 ,  C01G49/00 ,  C09D11/10 ,  C09D11/322 ,  C23C18/16 ,  C23C18/18 ,  C23C18/20 ,  H01B5/14 ,  H05K3/18

CPC分类号： C09D11/322 ,  B01J23/002 ,  B01J23/825 ,  B01J23/868 ,  B01J23/8874 ,  B01J23/8878 ,  B01J31/06 ,  B01J35/023 ,  B01J37/0036 ,  B01J37/04 ,  B01J37/08 ,  B01J37/349 ,  B01J2523/00 ,  C01G15/006 ,  C01G37/006 ,  C01G39/006 ,  C01G49/009 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/60 ,  C01P2006/80 ,  C09D11/10 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1879 ,  C23C18/204 ,  C23C18/206 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0709 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/125 ,  B01J2523/17 ,  B01J2523/31 ,  B01J2523/67 ,  B01J2523/32 ,  B01J2523/842 ,  B01J2523/33 ,  B01J2523/68

摘要： The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-&bgr; (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0

摘要翻译： 本发明提供的金属化合物。 Cu2AαB2-αO4-的β：所述金属化合物是由式（I）表示 （I）。 A包含选自组6和周期表的第8选择的至少一种元素。 B含有选自周期表的第13，0 <α<2，且0 <测试<1.5中选出的至少一种元素。 因此，提供的聚合物制品包含用于制备聚合物制品以及所述聚合物制品的表面的选择金属化的金属化合物和方法。 另外，本发明提供墨水组合物，以及使用该油墨组合物的绝缘基板的一个表面上的选择性金属。

公开(公告)号：EP1875504B1

公开(公告)日：2017-03-08

申请号：EP06758855.8

申请日：2006-05-01

申请人： Finisar Corporation

发明人： ICE, Donald, A. ,  DOUMA, Darin, J. ,  KIELY, Phillip, Anthony

IPC分类号： H01L23/495

CPC分类号： H01R13/6608 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4279 ,  G02B6/428 ,  H01L23/495 ,  H01L2924/0002 ,  H01R12/7082 ,  H01R13/405 ,  H05K1/023 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2203/302 ,  H01L2924/00

公开(公告)号：EP2265747B1

公开(公告)日：2016-12-21

申请号：EP09722758.1

申请日：2009-02-10

申请人： MacDermid, Incorporated

发明人： WOJTASZEK, Mark ,  HAMILTON, Robert

IPC分类号： C23C18/54 ,  C23C18/16 ,  C23C18/24 ,  C23C18/31 ,  H05K3/18 ,  H05K1/03

CPC分类号： H05K3/182 ,  C23C18/1607 ,  C23C18/1608 ,  C23C18/1641 ,  C23C18/24 ,  C23C18/31 ,  H05K1/0373 ,  H05K2201/09118 ,  H05K2203/0713 ,  Y10T428/31504

公开(公告)号：EP2940806A4

公开(公告)日：2016-08-10

申请号：EP13867126

申请日：2013-12-11

申请人： YOKOWO SEISAKUSHO KK

发明人： YODOGAWA AKIHIRO

IPC分类号： H01R24/42 ,  H01R13/03 ,  H01R13/6473 ,  H01R24/58 ,  H01R107/00 ,  H05K1/02 ,  H05K3/06 ,  H05K3/24

CPC分类号： H01R13/6473 ,  H01R13/035 ,  H01R24/58 ,  H01R2107/00 ,  H05K1/0284 ,  H05K3/06 ,  H05K3/24 ,  H05K2201/09118