公开(公告)号：EP3711461B1

公开(公告)日：2024-10-02

申请号：EP18812505.8

申请日：2018-11-13

IPC分类号： H05K1/14 ,  H01R12/72 ,  H05K1/18 ,  H05K3/40 ,  H05K3/36

CPC分类号： H01R12/722 ,  H05K1/142 ,  H05K1/144 ,  H05K1/148 ,  H05K1/184 ,  H05K3/368 ,  H05K2201/04220130101 ,  H05K2201/0903620130101 ,  H05K2201/0907220130101 ,  H05K2201/0914520130101 ,  H05K2201/091920130101 ,  H05K2201/1018920130101 ,  H05K2201/1040920130101 ,  H05K3/403 ,  H01R12/721 ,  H01R13/415

公开(公告)号：EP2474209B1

公开(公告)日：2018-10-31

申请号：EP10755076.6

申请日：2010-09-01

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： THUMSER, Christoph ,  FREYDL, Gerhard

IPC分类号： H05K1/14

CPC分类号： H05K3/305 ,  H05K1/0269 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0097 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T156/1089

公开(公告)号：EP2120517B1

公开(公告)日：2018-08-01

申请号：EP07702270.5

申请日：2007-02-05

申请人： Princo Corp.

发明人： YANG, Chihkuang

IPC分类号： H05K1/14 ,  H05K3/36 ,  H05K3/46 ,  H01L23/48 ,  H01L23/12 ,  H01L23/50

CPC分类号： H05K1/142 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5385 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19107 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/361 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  H01L2924/00

摘要： A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer.

公开(公告)号：EP2090906B1

公开(公告)日：2018-05-23

申请号：EP09000637.0

申请日：2009-01-17

申请人： Leuze electronic GmbH + Co. KG

发明人： Eisenlauer, Stefan ,  Tkach, Gennadiy

IPC分类号： G01V8/20 ,  H05K1/14

CPC分类号： G01V8/20 ,  H05K1/142 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/10598

公开(公告)号：EP3273156A1

公开(公告)日：2018-01-24

申请号：EP16764917.7

申请日：2016-03-11

申请人： Sharp Kabushiki Kaisha

发明人： SHIMIZU, Takaharu

IPC分类号： F21V23/00 ,  F21S2/00 ,  F21V23/06 ,  G02F1/1333 ,  G02F1/13357 ,  F21Y115/10

CPC分类号： G02B6/0055 ,  F21S2/00 ,  F21V23/00 ,  F21V23/06 ,  G02F1/1333 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133612 ,  H05K1/142 ,  H05K2201/10106

摘要： Provided is an illumination device in which wiring is easily performed, and a display device.
A connector 331 and light sources 34, 34, ... are mounted on one face of a light source substrate 33. Since a power feeding member 4 is formed by using a flexible printed board, and a light source connecting portion 44 provided in the power feeding member 4 is electrically connected to the connector 331, power is fed from a power supply unit to the light source substrate 33. That is, it is possible to easily perform wiring between the power supply unit and the light source substrate 33 using the flexible printed board. Accordingly, wiring becomes simple, compared to a case of electrically connecting a plurality of feeder lines to the light source substrate 33.

摘要翻译： 提供一种容易进行配线的照明装置和显示装置。 连接器331和光源34,34，...安装在光源基板33的一个面上。由于馈电构件4通过使用柔性印刷电路板形成，并且光源连接部分44设置在 供电构件4与连接器331电连接，从电源单元向光源基板33供电。即，能够容易地在电源单元和光源基板33之间使用 柔性印制板。 因此，与将多个馈电线电连接到光源基板33的情况相比，布线变得简单。

公开(公告)号：EP3063829A4

公开(公告)日：2017-06-14

申请号：EP13896519

申请日：2013-11-01

申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)

发明人： ZHOU BO ,  CHEN JUNYOU ,  LIU KUN

IPC分类号： H01Q1/38 ,  H01P5/02

CPC分类号： H05K1/0237 ,  H01L2924/19107 ,  H01P3/081 ,  H01P5/028 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/48 ,  H05K1/0213 ,  H05K1/025 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K3/10 ,  H05K3/4644 ,  H05K2201/04 ,  H05K2201/0979 ,  H05K2203/049

摘要： A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side.

摘要翻译： 宽带宽电路板装置包括由预定间隙分开的两个共面基板，以及至少一根接合线，该至少一根接合线横跨该间隙布置，并且在每个相应基板的第一侧上将相应的导电微带线互连。 此外，该装置包括配置在每个相应衬底的第一侧上的至少一个开路短截线装置，每个开放短线装置包括微带，该微带以与每个相应衬底上的每个导电带的端部成一定角度延伸。 最后，该装置包括在每个相应衬底的第二侧上的接地层以及布置在每个相应衬底的第二侧上并且横向地重叠布置在第一侧上的每个相应开放短截线装置的缺陷接地结构。

公开(公告)号：EP2189707B1

公开(公告)日：2017-03-15

申请号：EP09175596.7

申请日：2009-11-10

申请人： Sinology Enterprise Co., Ltd. ,  China Electric Mfg. Corporation

发明人： Lee, Hsin-Nung

IPC分类号： F21S2/00 ,  G09F13/04 ,  F21K99/00

CPC分类号： G09F13/0409 ,  F21S2/005 ,  F21Y2105/10 ,  F21Y2115/10 ,  G09F13/04 ,  H05K1/142 ,  H05K1/181

公开(公告)号：EP3063829A1

公开(公告)日：2016-09-07

申请号：EP13896519.9

申请日：2013-11-01

申请人： Telefonaktiebolaget LM Ericsson (publ)

发明人： ZHOU, Bo ,  CHEN, Junyou ,  LIU, Kun

IPC分类号： H01Q1/38

CPC分类号： H05K1/0237 ,  H01L2924/19107 ,  H01P3/081 ,  H01P5/028 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/48 ,  H05K1/0213 ,  H05K1/025 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K3/10 ,  H05K3/4644 ,  H05K2201/04 ,  H05K2201/0979 ,  H05K2203/049

摘要： A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side.

摘要翻译： 宽带宽电路板布置包括由预定间隙分开的两个共面基板和布置在间隙上的至少一个接合线，并将相应的导电微带线互连在每个相应基板的第一侧上。 此外，该布置包括配置在每个相应衬底的第一侧上的至少一个开放短截线布置，每个开放短截线布置包括从每个相应衬底上的每个导电带的端部以一定角度延伸的微带。 最后，该布置包括在每个相应基板的第二侧上的接地层和布置在每个相应基板的第二侧上并且横向重叠布置在第一侧上的每个相应的开放短截线布置的缺陷接地结构。

公开(公告)号：EP2899802A1

公开(公告)日：2015-07-29

申请号：EP15150480.0

申请日：2015-01-08

申请人： Honeywell International Inc.

发明人： Wang, Nan ,  Wang, Chao ,  Nyhus, Orville

IPC分类号： H01P3/08 ,  H01P5/02 ,  H01P11/00 ,  H01Q1/50 ,  H01Q21/00 ,  H05K1/14 ,  H05K3/36 ,  H01Q21/08

CPC分类号： H01P5/028 ,  H01P1/047 ,  H01P1/30 ,  H01P3/085 ,  H01Q1/50 ,  H01Q21/0075 ,  H01Q21/08 ,  H02H1/04 ,  H05K1/142 ,  H05K3/36 ,  H05K2201/09181 ,  H05K2201/09845 ,  Y10T29/49126

摘要： An anti-lightning-combined-stripline-circuit system is provided. The anti-lightning-combined-stripline-circuit system includes a stripline board including circuitry, and a metal ground bar attached to the stripline board. The metal ground bar has a geometry configured to function as a ground for the circuitry and simultaneously function as a lightning ground for a linear array of elements driven by the circuitry.

摘要翻译： 提供防雷击组合线路电路系统。 防雷击组合线路电路系统包括带状线板，其包括电路，以及连接到带状线板的金属接地棒。 金属接地棒具有配置为用作电路的接地的几何形状，并且同时用作由电路驱动的元件的线性阵列的雷电接地。

公开(公告)号：EP2880358A1

公开(公告)日：2015-06-10

申请号：EP13744492.3

申请日：2013-07-26

申请人： M.D. SRL

发明人： PIETRELLA, Diego

IPC分类号： F21S6/00 ,  F21V21/26 ,  F21V23/00 ,  H05K1/00 ,  F21Y101/02

CPC分类号： F21V23/06 ,  F21S6/003 ,  F21V21/00 ,  F21V21/26 ,  F21V23/00 ,  F21V23/04 ,  F21Y2115/10 ,  H05K1/116 ,  H05K1/142 ,  H05K2201/09481 ,  H05K2201/10409

摘要： A lamp (100) comprising a base PCB (1), at least one support PCB (2) connected to the base PCB, a lighting assembly (4) connected to the support PCB (2) and at least one light source and power supply connected to conductive tracks of the base PCB (1).

摘要翻译： 灯具有基底PCB，连接到基底PCB的至少一个支撑PCB，连接到支撑PCB的照明组件和连接到基座PCB的导电轨迹的至少一个光源和电源。