公开(公告)号：EP1166352B1

公开(公告)日：2008-04-09

申请号：EP99902030.8

申请日：1999-02-04

申请人： Institute of Microelectronics ,  TYCO Electronics Logistics AG

发明人： UPPILI, Sridhar ,  VICTOR, D., Samper ,  FOO, Pang, Dow ,  WAGENAAR, Dirk ,  KAY, Krupka ,  SCHLAAK, Helmut

IPC分类号： H01L23/00 ,  H01H59/00

CPC分类号： B81C1/00666 ,  B81C2201/0167 ,  H01H59/0009 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microstructure relay comprising an s-shaped support member is provided. The s-shape support member creates over-travel in the relay in order to produce high contact force and low contact resistance over the lifetime of the relay. Compressive and tensile stress-inducing layers on appropriate parts of the support member induce it to bend as desired.

公开(公告)号：EP1166352A1

公开(公告)日：2002-01-02

申请号：EP99902030.8

申请日：1999-02-04

申请人： Institute of Microelectronics ,  TYCO Electronics Logistics AG

发明人： UPPILI, Sridhar ,  VICTOR, D., Samper ,  FOO, Pang, Dow ,  WAGENAAR, Dirk ,  KAY, Krupka ,  SCHLAAK, Helmut

IPC分类号： H01L23/00 ,  H01H59/00

CPC分类号： B81C1/00666 ,  B81C2201/0167 ,  H01H59/0009 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microstructure relay comprising an s-shaped support member is provided. The s-shape support member creates over-travel in the relay in order to produce high contact force and low contact resistance over the lifetime of the relay. Compressive and tensile stress-inducing layers on appropriate parts of the support member induce it to bend as desired.