公开(公告)号：EP1728059A1

公开(公告)日：2006-12-06

申请号：EP05731265.4

申请日：2005-03-18

申请人： Intel Corporation

发明人： ARANA, Leonel ,  ZOU, Yuelin, Lee ,  HECK, John

IPC分类号： G01L11/00 ,  G01L21/12 ,  G01M3/32 ,  H05K5/06

CPC分类号： G01L11/002 ,  G01L21/12 ,  G01M3/186 ,  G01M3/3272 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microfabricated vacuum sensor may be formed using semiconductor integrated circuit processes. The sensor may be formed inside an enclosure with a microfabricated component. The sensor may then be used to measure the pressure within the enclosure.