公开(公告)号：EP2939265B1

公开(公告)日：2018-10-31

申请号：EP13822065.2

申请日：2013-12-26

申请人： Flir Systems, Inc.

发明人： SCHWEIKERT, Paul ,  SHARPE, Andrew ,  CARLSON, Gregory A. ,  MATSON, Alex ,  VILANDER, Scott ,  ZAHUTA, Bob ,  GOEDEN, Richard M.

IPC分类号： H01L21/50 ,  H01L21/67 ,  H01L23/00 ,  B81C1/00 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L31/0203 ,  H01L31/09

CPC分类号： H01L21/50 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67757 ,  H01L21/681 ,  H01L21/6831 ,  H01L24/94 ,  H01L31/0203 ,  H01L31/09 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/16235 ,  Y10T29/41 ,  H01L2924/00

摘要： An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

公开(公告)号：EP1884994B1

公开(公告)日：2018-10-10

申请号：EP07015307.7

申请日：2007-08-03

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Murayama, Kei ,  Taguchi, Yuichi ,  Koizumi, Naoyuki ,  Sunohara, Masahiro ,  Shiraishi, Akinori ,  Higashi, Mitsutoshi

IPC分类号： H01L23/498 ,  H01L23/13 ,  H01L23/14 ,  H01L23/055 ,  B81C1/00

CPC分类号： H01L23/055 ,  B81B2207/012 ,  B81C1/0023 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device includes a laminated substrate (104; 204) formed by laminating a plurality of semiconductor substrates (101, 103; 201, 203), a concave part (103B; 208) formed in the laminated substrate, and a semiconductor element (109; 211, 213) mounted in the concave part. A method of manufacturing a semiconductor device includes a first step of forming a laminated substrate by laminating a plurality of semiconductor substrates, a second step of forming a concave part by etching the laminated substrate, and a third step of mounting a semiconductor element in the concave part.

公开(公告)号：EP2035327B1

公开(公告)日：2018-09-26

申请号：EP07777193.9

申请日：2007-05-21

申请人： Akustica Inc.

发明人： GOODELLE, Jason, P. ,  GABRIEL, Kaigham, J.

IPC分类号： B81C1/00 ,  H04R31/00

CPC分类号： B81C1/00333 ,  B81B2201/0257 ,  B81B2207/096 ,  B81C2203/0109 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/1461 ,  H04R1/04 ,  H04R19/016 ,  H04R31/006 ,  H01L2924/00014 ,  H01L2924/00

摘要： A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier and encapsulating the MEMS die.

公开(公告)号：EP2406815B1

公开(公告)日：2018-07-18

申请号：EP10708971.6

申请日：2010-03-09

申请人： 3D Plus

发明人： VAL, Christian

IPC分类号： H01L21/56 ,  H01L23/00 ,  B81C1/00 ,  H01L23/433 ,  H01L21/683 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/6836 ,  H01L23/4334 ,  H01L24/24 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/24137 ,  H01L2224/24998 ,  H01L2224/32245 ,  H01L2224/73217 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/1094 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

公开(公告)号：EP2789578B1

公开(公告)日：2018-06-20

申请号：EP14160818.2

申请日：2014-03-20

申请人： ROBERT BOSCH GMBH

发明人： Hoefer, Holger ,  Solf, Christian ,  Ehrenpfordt, Ricardo ,  Pantel, Daniel ,  Ante, Frederik ,  Offterdinger, Klaus ,  Grabmaier, Florian

IPC分类号： B81B7/00

CPC分类号： B81B7/0016 ,  B81B2207/015 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP3273467A3

公开(公告)日：2018-05-30

申请号：EP17175835.2

申请日：2017-06-13

申请人： General Electric Company

发明人： GOWDA, Arun Virupaksha ,  TUOMINEN, Risto llkka

IPC分类号： H01L21/60 ,  H01L23/522 ,  G01N27/12 ,  B81C1/00 ,  G06K19/077 ,  H01L27/06 ,  G02B6/42 ,  H01L23/58

CPC分类号： H01L23/5389 ,  B81C1/00246 ,  B81C2203/0735 ,  G02B6/4201 ,  G06K19/07745 ,  H01L23/34 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/57 ,  H01L23/58 ,  H01L24/02 ,  H01L24/19 ,  H01L24/20 ,  H01L25/16 ,  H01L27/0694 ,  H01L2223/54446 ,  H01L2224/02371 ,  H01L2224/02375 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104

摘要： A die (102) for a semiconductor chip package includes a first surface (104) including an integrated circuit (106) formed therein. The die also includes a backside surface (108) opposite the first surface. The backside surface has a total surface area (206) defining a substantially planar region (302) of the backside surface. The die further includes at least one device (132) formed on the backside surface. The at least one device includes at least one extension (136) extending from the at least one device beyond the total surface area.

公开(公告)号：EP2993156B1

公开(公告)日：2018-05-16

申请号：EP15191198.9

申请日：2006-11-21

申请人： Murata Electronics Oy

发明人： Kuisma, Heikki

IPC分类号： B81C1/00 ,  B81B7/02 ,  G01C19/5783 ,  G01L9/00 ,  G01C19/56 ,  G01P1/02 ,  G01P15/08

CPC分类号： G01C19/56 ,  B81B7/02 ,  B81B2207/012 ,  B81B2207/015 ,  B81C1/0023 ,  B81C2203/0792 ,  G01C19/5783 ,  G01L9/0042 ,  G01P1/023 ,  G01P15/0802 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part (46), sealed by means of a cover part (24), (28), (33), (41), (47), (48), and an electronic circuit part (64), (74), suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

公开(公告)号：EP3195358A4

公开(公告)日：2018-04-25

申请号：EP14901871

申请日：2014-09-17

申请人： INTEL CORP

发明人： LEE KEVIN J ,  SARASWAT RUCHIR ,  ZILLMANN UWE ,  RAO VALLURI BOB ,  LUND-LARSEN TOR ,  COWLEY NICHOLAS P

IPC分类号： H01L27/04 ,  B81B7/02 ,  H01L21/60

CPC分类号： H04R1/04 ,  B81B7/02 ,  B81B2201/0257 ,  B81B2207/096 ,  B81C1/00158 ,  B81C2201/0132 ,  B81C2203/0109 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/27002 ,  H01L2224/27618 ,  H01L2224/27848 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/3201 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/83005 ,  H01L2224/83193 ,  H01L2224/83438 ,  H01L2224/8346 ,  H01L2224/83488 ,  H01L2224/8359 ,  H01L2224/83688 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/9222 ,  H01L2224/92225 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/161 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/166 ,  H04R1/406 ,  H04R19/005 ,  H04R19/04 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2221/68304

摘要： Embodiments of the present disclosure describe a die with integrated microphone device using through-silicon vias (TSVs) and associated techniques and configurations. In one embodiment, an apparatus includes an apparatus comprising a semiconductor substrate having a first side and a second side disposed opposite to the first side, an interconnect layer formed on the first side of the semiconductor substrate, a through-silicon via (TSV) formed through the semiconductor substrate and configured to route electrical signals between the first side of the semiconductor substrate and the second side of the semiconductor substrate, and a microphone device formed on the second side of the semiconductor substrate and electrically coupled with the TSV. Other embodiments may be described and/or claimed.

公开(公告)号：EP2171755A4

公开(公告)日：2018-04-04

申请号：EP08782059

申请日：2008-07-18

申请人： ALPHA ASSEMBLY SOLUTIONS INC

发明人： BOUREGHDA MONNIR ,  DESAI NITIN ,  LIFTON ANNA ,  KHASELEV OSCAR ,  MARCZI MICHAEL T ,  SINGH BAWA

IPC分类号： H01L23/488 ,  B22F1/02 ,  H01L21/60

CPC分类号： H05K13/0465 ,  B22F1/0062 ,  H01L23/373 ,  H01L24/03 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0381 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/8321 ,  H01L2224/83211 ,  H01L2224/83438 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/8393 ,  H01L2224/83931 ,  H01L2224/8584 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/203 ,  H01L2924/3512 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T428/24893 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/01014

摘要： Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.

公开(公告)号：EP3291575A1

公开(公告)日：2018-03-07

申请号：EP17190816.3

申请日：2010-12-22

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： TANAKA, Fuminori ,  HORIBE, Ryusuke ,  UMEDA, Shuji ,  INODA, Takeshi

IPC分类号： H04R1/38 ,  H04R1/02 ,  H04R3/00 ,  H04R19/04 ,  H04R1/40

CPC分类号： H04R19/04 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R1/38 ,  H04R1/406 ,  H04R3/005 ,  H04R2499/11 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microphone unit (1) comprises a first vibrating part (14), a second vibrating part (15), and a case (10) for accommodating the first vibrating part (14) and the second vibrating part (15), the case being provided with a first sound hole (132) and a second sound hole (133). The case (10) is provided with a first sound channel (41) for transmitting acoustic pressure inputted from the first sound hole (132) to one surface (142a) of a first diaphragm (142) and to one surface (152a) of a second diaphragm (152), a second sound channel (42) for transmitting acoustic pressure inputted from the second sound hole (133) to the other surface (152b) of the second diaphragm (152), and a sealed space (S) that faces the other surface (142b) of the first diaphragm (142).

摘要翻译： 麦克风单元（1）包括第一振动部分（14），第二振动部分（15）和用于容纳第一振动部分（14）和第二振动部分（15）的壳体（10），壳体 设有第一音孔（132）和第二音孔（133）。 壳体（10）设置有第一声音通道（41），用于将从第一音孔（132）输入的声压传递到第一膜片（142）的一个表面（142a）以及第一声音孔（132a）的一个表面（152a） 第二振动板152，将从第二音孔133输入的声压传递到第二振动板152的另一个面152b的第二声音通道42以及密封空间S 第一隔膜（142）的另一表面（142b）。