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1.发明授权
公开(公告)号：EP0247413B1
公开(公告)日：1991-09-11
申请号：EP87106699.9
申请日：1987-05-08
CPC分类号： C23C14/3414 , C23C14/0688 , H01H1/023 , Y10T428/261
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2.发明公开Methods for monitoring metal ion concentrations in plating baths 失效一种用于监测在Metallisierbädern金属离子的浓度的方法。
公开(公告)号：EP0151926A2
公开(公告)日：1985-08-21
申请号：EP85100107.3
申请日：1985-01-11
IPC分类号： G01N27/416 , G01N27/48 , G01N27/49
摘要： A rotating disk electrode system operates at constant speed in a solution whose metal ion concentration is held constant at multiple concentrations within a range of concentration. The current at the working electrode (16) is recorded, while the potential at the working electrode is swept by potential source (20) at a predetermined rate for each of the concentration values. The diffusion limiting current is determined by recorder (24) for each of the concentration values. Then the rotating disk electrode system is operated continuously in a metal plating bath (12) whose metal ion concentration can vary. A voltage applied to the working electrode produces a current at the electrode whose magnitude is compared to the values of the previous calibration to determine the current metal ion concentration. Alternatively, a rotating disk electrode system is operated over a range of speeds in a solution whose ion concentration is held constant over a range of concentration. Current at the working electrode is measured for a given electric potential applied to the working electrode. In this way, a calibration relationship between the current at the electrode and the range of metal ion concentrations is established which can be used with current measured in the plating bath under the same conditions as those that established the calibration curve to predict the concentration of the bath. ;
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公开(公告)号：EP0151926B1
公开(公告)日：1992-08-05
申请号：EP85100107.3
申请日：1985-01-11
IPC分类号： G01N27/416 , G01N27/48 , G01N27/49
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公开(公告)号：EP0151926A3
公开(公告)日：1988-08-31
申请号：EP85100107
申请日：1985-01-11
IPC分类号： G01N27/46
摘要： A rotating disk electrode system operates at constant speed in a solution whose metal ion concentration is held constant at multiple concentrations within a range of concentration. The current at the working electrode (16) is recorded, while the potential at the working electrode is swept by potential source (20) at a predetermined rate for each of the concentration values. The diffusion limiting current is determined by recorder (24) for each of the concentration values. Then the rotating disk electrode system is operated continuously in a metal plating bath (12) whose metal ion concentration can vary. A voltage applied to the working electrode produces a current at the electrode whose magnitude is compared to the values of the previous calibration to determine the current metal ion concentration. Alternatively, a rotating disk electrode system is operated over a range of speeds in a solution whose ion concentration is held constant over a range of concentration. Current at the working electrode is measured for a given electric potential applied to the working electrode. In this way, a calibration relationship between the current at the electrode and the range of metal ion concentrations is established which can be used with current measured in the plating bath under the same conditions as those that established the calibration curve to predict the concentration of the bath. ;
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5.发明公开Electrical resistant composition, substrates coated therewith, and process for preparing such 失效耐磨电组合物涂覆的基材和它们的制备方法。
公开(公告)号：EP0247413A1
公开(公告)日：1987-12-02
申请号：EP87106699.9
申请日：1987-05-08
CPC分类号： C23C14/3414 , C23C14/0688 , H01H1/023 , Y10T428/261
摘要： A composition of a metallic compound represented by the formula MT, and G is provided by sputtering an M x G 100-x target. M is a metal selected from the group of titanium, hafnium, zirconium, and mixtures thereof. T is selected from the group of N, C, and mixtures thereof. G is a metal selected from the group of gold, platinum, and palladium. X is an integer from about 65 to about 95. Also provided are substrates coated with the composition and process for depositing the composition on substrates.
摘要翻译： 的金属化合物的一种组合物，由式MT表示，G由在MxG100-X靶溅射提供。 M是选自钛，铪，锆，以及它们的混合物中的金属。 T被选自N，C，以及它们的混合物。 G是选自金，铂，和钯中选出的金属。 X是从约65至涂覆有组合物和方法用于沉积在基板上的组合物约95因此被设置基板的整数。
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