公开(公告)号：EP1841558A2

公开(公告)日：2007-10-10

申请号：EP05852628.6

申请日：2005-12-02

申请人： International Business Machines Corporation

发明人： ANDRICACOS, Panayotis, C. ,  CANAPERI, Donald, F. ,  COOPER, Enamuel, I. ,  COTTE, John, M. ,  DELIGIANNI, Hariklia ,  ECONOMIKOS, Laertis ,  EDELSTEIN, Daniel, C. ,  FRANZ, Silvia ,  PRANATHARTHIHARAN, Balasubramanian ,  KRISHNAN, Mahadevaiyer ,  MANSSON, Andrew, P. ,  WALTON, Erick, G. ,  WEST, Alan, C.

IPC分类号： B23H3/00

CPC分类号： C25F3/02 ,  B23H5/08 ,  C09G1/04 ,  H01L21/32125

摘要： Methods and compositions for electro-chemical-mechanical polishing (e-CMP) of silicon chip interconnect materials, such as copper, are provided. The methods include the use of compositions according to the invention in combination with pads having various configurations.