公开(公告)号：EP1038315A1

公开(公告)日：2000-09-27

申请号：EP98957755.6

申请日：1998-11-10

申请人： Irvine Sensors Corporation

发明人： ALBERT, Douglas, M. ,  OZGUZ, Volkan, H.

IPC分类号： H01L21/77 ,  H01L21/78

CPC分类号： H01L21/6836 ,  H01L2221/68327 ,  H01L2924/30105

摘要： Thinned and/or flexible integrated circuit chips (34) are fabricated by defining a plurality of grooves (30) into the front surface of a semiconductor wafer (22). The grooves (30) isolate each integrated circuit into a separate die. The prescribed grooves extend only partially into the front surface in which the circuits are formed, typically 50 microns or less (32). A polyimide planarizing and stress relieving layer is disposed on the front surface before the grooves are grooved. A low viscosity low stress adhesive is disposed on the grooved polyimide coated surface. The wafer is then bonded to the scored surface of an optically flat glass substrate under pressure and at a curing temperature. The assembly is then mounted into a grinder which removes the backside portion of the wafer until the grooves are exposed. Grinding is achieved by advancing at a decreasing grind rate followed by periods of dwell. The grooves in the semiconductor wafer tend to inhibit crack formation. The assembly is then placed backside down on a pin block in a solvent bath. The solvent dissolves the adhesive layer leaving the separated dies of the pin block for mounting on a flexible film. The dies are coupled to metalizations on the flexible film by means of a conductive epoxy and sealed using a flexible coating.

公开(公告)号：EP1451873A2

公开(公告)日：2004-09-01

申请号：EP02805694.3

申请日：2002-07-16

申请人： Irvine Sensors Corporation

发明人： OZGUZ, Volkan, H. ,  KHASHAYAR, Abbas

IPC分类号： H01L27/14 ,  H01L29/417 ,  H01L23/02 ,  H01L23/12 ,  H01L29/40 ,  H01L21/00 ,  H01L21/44 ,  H01L21/46

CPC分类号： A61B5/6833 ,  A61B5/0002 ,  A61B5/0006 ,  A61B5/0488 ,  A61B5/0492 ,  A61B2560/0412 ,  H01L23/5388 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sensor system (30) has a sensor module (10) and a receiver module (45). The sensor module (10) functions as a wireless data collection device and has a flexible thin sheet of silicon (60, 65, 70) comprising circuitry (71, 72, 73), a flexible power source (105), and a flexible support substrate (55). The silicon, power source, and flexible support substrate are integrated as layers of the sensor module (10). The layers are placed together in the form of an adhesive bandage (10). A plurality of electrodes (80) are connected to the sensor module (10) and protrude from the flexible substrate (55) for contacting the skin of a subject body (20). The receiver module (45) includes one of an RF receiver with a wireless port for continuously receiving data (40), or a physical I/O port (87) to which the sensor module (10) can be physically connected for downloading stored data from the sensor module (10).

公开(公告)号：EP1436834A2

公开(公告)日：2004-07-14

申请号：EP02798173.7

申请日：2002-09-09

申请人： Irvine Sensors Corporation

发明人： YAMAGUCHI, James, Satsuo ,  PEPE, Angel, Antonio ,  OZGUZ, Volkan, H. ,  CAMIEN, Andrew, Nelson

IPC分类号： H01L23/02 ,  H05K1/11

CPC分类号： H01L25/50 ,  H01L23/3735 ,  H01L23/3737 ,  H01L25/0652 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/0129 ,  H05K2203/1105 ,  H05K2203/1536 ,  H05K2203/167 ,  H01L2924/00

摘要： Each multilayer module (10) of a plurality of multilayer modules has a plurality of layers (20) wherein each layer has a substrate (22) therein. The plurality of multilayer modules (10) includes a first multilayer module (10) including a first layer (20) and a second multilayer (10) module including a second layer (20) each having a top side and bottom side. The first layer (20) and second layer (20) each includes a substrate (22), at least one electronic element (26), and a plurality of electrically-conductive traces (28). The plurality of multilayer modules (10) further includes a heat-separating layer (40) disposed between the top side of the first layer (20) and the bottom side of the second layer (20). The first multilayer module (10) is adhered to the second multilayer module (10) and the first multilayer module (10) can be detached from the second multilayer module (10) by applying heat to the heat-separating layer (40).