公开(公告)号：EP1146149A1

公开(公告)日：2001-10-17

申请号：EP00971710.9

申请日：2000-11-01

申请人： JSR Corporation

发明人： ITO, Nobuyuki, c/o JSR Corporation ,  KOYAMA, Kenichi, c/o JSR Microtech Inc.

IPC分类号： C25D9/00 ,  C01B13/14

CPC分类号： C25D9/00 ,  C25D13/00 ,  H05K1/095 ,  H05K3/06 ,  H05K3/245 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4664 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/135 ,  H05K2203/1461

摘要： An aqueous dispersion of the invention has conductive microparticles and organic particles dispersed in an aqueous medium and can form a conductive layer of a volume resistivity of for example 10 -4 Ω·cm or less by electrodeposition. A circuit board of the invention is equipped in an insulating layer and a conducting layer, which includes conducting through parts that pass through the insulating layer, and is favorably manufactured by the invention's method that includes an electrodeposition using an aqueous dispersion of the invention as a electrodeposition solution and using the conductive foil as one of the electrodes after closing the openings at one end of the through holes formed on the insulating layer by means of a conductive foil. A multilayer wiring board of the invention is equipped in a core wiring substrate, having substrate wiring layers that are mutually connected electrically formed on both surfaces of an insulating substrate, an insulating layer that is laminated onto at least one of the surfaces of the core wiring substrate, a wiring layer that is formed on the insulating layer, and interlayer shorting parts that pass through the insulating layer and electrically connect the wiring layer to the abovementioned substrate wiring layer. These interlayer shorting parts are comprised of conductors formed by electrodeposition using an aqueous dispersion of the invention as an electrodeposition solution. Since the conductive layer or the conductor is formed by electrodeposition, the productivity is good and the connection reliability is high.

摘要翻译： 本发明的水分散体具有导电性微粒和在wässrige介质分散在有机颗粒和能够形成对于实施例10 <-4> OMEGA·cm的范围或通过电沉积更小的体积电阻率的导电层。 本发明的电路板在绝缘层和导电层，其包括通过部分导电并穿过绝缘层配备的，并且有利地通过本发明的方法制造的那样在电沉积包括使用水性分散体的本发明的作为的 电沉积溶液和使用所述导电箔作为电极之一通过形成由导电箔的方式在绝缘层上的孔在一端封闭的开口部之后。 本发明的多层布线基板被装备在芯布线基板，具有基板布线层没有相互绝缘的基片的两个表面上电连接形成于绝缘层也被层压到芯布线的表面的至少一个 基板，布线层被形成确实在绝缘层上，并且层间的短路部分并穿过所述绝缘层和电布线层连接到上述的基片布线层。 这些层间的短路部分组成通过使用本发明的水性分散体，以电沉积溶液电沉积形成的导体的。 由于导电层或导体电沉积形成，生产率良好，连接可靠性高。