公开(公告)号：EP2952072A1

公开(公告)日：2015-12-09

申请号：EP14705893.7

申请日：2014-01-30

申请人： Yissum Research Development Company of The Hebrew University of Jerusalem Ltd.

发明人： MAGDASSI, Shlomo ,  SHAPIRA, Amir ,  LAYANI, Michael ,  COOPERSTEIN, Ido

IPC分类号： H05K1/09 ,  H05K3/24 ,  B22F1/00 ,  B29C67/00 ,  C09D11/00 ,  H01B1/22 ,  H05K3/12

CPC分类号： H05K3/125 ,  B22F1/0022 ,  B22F3/008 ,  B22F3/1055 ,  B29C64/112 ,  B29C64/135 ,  B29C67/0059 ,  B29C67/0066 ,  B29K2105/0002 ,  B29K2995/0005 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H05K1/0296 ,  H05K1/097 ,  H05K3/1283 ,  H05K3/245 ,  H05K2201/09218 ,  H05K2203/1131 ,  H05K2203/1157 ,  H05K2203/1476 ,  Y02P10/295

摘要： The invention generally relates to polymerizable conductive ink formulations comprising at least one metal source, at least one monomer and/or oligomer and a polymerization initiator, and uses thereof for printing three-dimensional functional structures. In particular a method of fabricating a three-dimensional conductive pattern on a substrate is disclosed, the method comprising: a) forming a pattern on a surface region of a substrate by using an ink comprising at least one metal source, at least one liquid polymerizable monomer and/or oligomer, and at least one polymerization initiator; b) polymerizing at least a portion of said liquid monomer and/or oligomer; c) rendering the metal source a continuous percolation path for electrical conductivity (sintering); d) repeating steps (a), (b) and optionally (c) to obtain a three- dimensional conductive pattern.

公开(公告)号：EP2741591A1

公开(公告)日：2014-06-11

申请号：EP13193771.6

申请日：2013-11-21

申请人： ROBERT BOSCH GMBH

发明人： Vogelgesang, Michael

IPC分类号： H05K1/02 ,  H05K3/12 ,  H05K3/24 ,  H05K3/34

CPC分类号： H05K1/0265 ,  H05K3/245 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/0305 ,  H05K2201/035 ,  H05K2203/042 ,  H05K2203/043 ,  H05K2203/1484

摘要： Verfahren zum Herstellen einer Leiterplatte (1), umfassend die Schritte Bereitstellen eines Substrats (2), Vorsehen von zumindest einer Leiterbahn (31) und zumindest einer Anschlussfläche (32) auf dem Substrat (2), und Aufbringen zumindest eines ersten Lots (42) und zumindest einer elektronischen Komponente (5) auf die Anschlussfläche (32), gekennzeichnet dadurch, dass auf oder an zumindest einen Teil der Leiterbahn (31) ein zweites Lot (41) aufgebracht wird, und das erste Lot (42) auf der Anschlussfläche (32) und das zweite Lot (41) auf der Leiterbahn (32) gemeinsam bis mindestens zu einem Schmelzpunkt des ersten Lots (42) und des zweiten Lots (41) erhitzt wird, wobei ein Querschnitt von zumindest einem Bereich der Leiterbahn (31) durch das zweite Lot (41) vergrößert wird.

摘要翻译： 该方法包括在衬底（2）上提供带状导体（31）和衬垫。 第一焊料和电子部件被施加在焊盘上。 第二焊料（41）被施加在带状导体的一部分上。 焊盘上的第一焊料和带状导体上的第二焊料通常被加热到第一焊料和第二焊料的熔点，使得带状导体的区域的横截面被第二焊料扩大。 将焊锡膏形式的第一焊料和/或第二焊料施加在焊盘和/或带状导体上。

公开(公告)号：EP2709208A1

公开(公告)日：2014-03-19

申请号：EP11865870.7

申请日：2011-08-04

申请人： Shuhou Co., Ltd.

发明人： MURAOKA, Kouji

IPC分类号： H01Q1/38 ,  H01P11/00 ,  H01Q1/24 ,  H05K3/18 ,  H05K3/24

CPC分类号： H01Q1/38 ,  H01Q1/243 ,  H01Q1/27 ,  H01Q1/36 ,  H01Q1/364 ,  H05K3/18 ,  H05K3/182 ,  H05K3/245 ,  H05K3/246 ,  H05K2201/0266 ,  H05K2203/0709

摘要： An antenna 10 includes a base print layer 2 printed in a predetermined antenna pattern on a surface of a workpiece 1, and an electroless plating layer 3 disposed on the surface of the base print layer 2. The base print layer 2 is formed of an ink 2a and metal particles 2b. The ink 2a has been printed with a substantially uniform thickness to form an ink layer, in which some of particles of the metal particles 2b are buried. The metal particles having a large diameter are partially protrudent from the ink layer, and part of the ink 2a covering the protrudent portions have been removed.

摘要翻译： 天线10包括印刷在工件1的表面上的预定天线图案的基底印刷层2和设置在基底印刷层2的表面上的化学镀层3.基底印刷层2由墨水 2a和金属颗粒2b。 油墨2a已印刷成基本均匀的厚度，以形成其中一些金属颗粒2b的颗粒被埋入的油墨层。 具有大直径的金属颗粒部分地从油墨层突出，并且已经去除了覆盖突出部分的部分油墨2a。

公开(公告)号：EP2474208A1

公开(公告)日：2012-07-11

申请号：EP10747871.1

申请日：2010-09-02

申请人： Applied Materials, Inc.

发明人： GALIAZZO, Marco ,  BACCINI, Andrea ,  CELLERE, Giorgio ,  DE SANTI, Luigi ,  PASQUALIN, Gianfranco ,  VERCESI, Tommaso

IPC分类号： H05K1/02 ,  H05K3/12 ,  H01L31/0224

CPC分类号： H05K3/12 ,  H01L31/022425 ,  H01L31/1876 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/245 ,  H05K2203/1476 ,  H05K2203/163 ,  Y02E10/50 ,  Y02P70/521

摘要： Printing method to print one or more print tracks on a print support, or substrate, comprising two or more printing steps in each of which, by means of printing means, a layer of material is deposited on the print support according to a predetermined print profile. In each printing step, subsequent to the first, each layer of material is deposited at least partially on top of the layer of material printed in the preceding printing step, so that each layer of printed material has an identical print profile or different with respect to at least a layer of material underneath so as to achieve an area of contact equal to or different from at least an area previously printed, the material deposited in each printing step being equal to or different from the material deposited in at least one of the prints underneath.

公开(公告)号：EP2255408B1

公开(公告)日：2012-07-04

申请号：EP09721532.1

申请日：2009-03-13

申请人： Günther Heisskanaltechnik GmbH

发明人： GÜNTHER, Herbert ,  SOMMER, Siegrid ,  KRETZSCHMAR, Christel ,  PARTSCH, Uwe

IPC分类号： H05K3/32 ,  H01R4/62

CPC分类号： H01R4/625 ,  H05K1/092 ,  H05K3/245 ,  H05K3/321 ,  H05K2201/10992 ,  H05K2203/1131

摘要： The invention relates to an electrical connection (50; 60) between a first electrically conductive component (44) made of a first material and a second electrically conductive component (48; 62; 70) made of a second material. According to the invention, said electrical connection comprises between the electrically conductive components (44, 48; 62; 70) at least two electrically conductive adhesive layers (52, 54, 56) made of different adhesive layer materials and generating said electrical connection.

公开(公告)号：EP1737284A3

公开(公告)日：2008-06-04

申请号：EP06012739.6

申请日：2006-06-21

申请人： CANON KABUSHIKI KAISHA

发明人： Furukawa, Masao Canon K.K. ,  Tsuruoka, Yuji Canon K.K. ,  Mori, Takashi Canon K.K. ,  Yamaguchi, Nobuhito Canon K.K. ,  Kamiya, Seiichi Canon K.K.

IPC分类号： H05K3/12

CPC分类号： H05K3/125 ,  H05K3/245 ,  H05K3/4664 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/1476 ,  Y10S428/901

摘要： A circuit pattern forming method is provided which can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern and thereby can form a highly reliable printed circuit board. To that end, this invention overlappingly draws a conductive pattern (11) and an insulating pattern (13) of a predetermined thickness by scanning a liquid ejection head and a substrate (10) relative to each other a plurality of times while ejecting droplets of a conductive pattern forming solution (11) and an insulating pattern forming solution (13). When forming the conductive pattern and the insulating pattern that adjoin each other on the substrate, the step of forming the insulating pattern of at least one scan is executed between the conductive pattern forming steps that are executed the plurality of times until the conductive pattern has a predetermined thickness.

公开(公告)号：EP1388186A4

公开(公告)日：2005-08-17

申请号：EP02753858

申请日：2002-03-25

申请人： LUCH DANIEL

发明人： LUCH DANIEL

IPC分类号： H01Q13/08 ,  C25D5/56 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/18 ,  H05K3/18 ,  H05K3/24 ,  H01Q1/00 ,  C25D5/02

CPC分类号： H01Q1/2208 ,  G06K19/07779 ,  G06K19/07783 ,  H01L2224/16225 ,  H01Q1/22 ,  H01Q1/2225 ,  H01Q1/243 ,  H01Q1/38 ,  H05K1/182 ,  H05K3/188 ,  H05K3/245

摘要： The invention teaches improved, novel methods and materials for the production of electrically conductive patterns, antennas and complex circuitry. The invention contemplates the use of directly electroplateable resins for production of these article. The unique suitability of directly electroplateable resins to allow facile manufacture of the electrically conductive patterns desired using a broad range of processing and manufacturing approaches is demonstrated.

公开(公告)号：EP1300377A3

公开(公告)日：2004-03-31

申请号：EP02022298.0

申请日：2002-10-07

申请人： NGK SPARK PLUG CO., LTD

发明人： Makino, Yusuke

IPC分类号： C04B41/90 ,  C04B37/02 ,  C04B37/00

CPC分类号： C04B37/006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/32 ,  B32B18/00 ,  B32B2311/12 ,  B32B2311/22 ,  B32B2311/30 ,  C04B37/026 ,  C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  C04B2235/3418 ,  C04B2235/656 ,  C04B2235/658 ,  C04B2235/96 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/40 ,  C04B2237/403 ,  C04B2237/404 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/72 ,  H01H33/66207 ,  H01H33/66261 ,  H01H2033/66215 ,  H05K1/092 ,  H05K3/245 ,  Y10T428/12535 ,  Y10T428/12771 ,  Y10T428/24917 ,  Y10T428/24926 ,  C04B41/4539 ,  C04B41/5035 ,  C04B41/5133 ,  C04B41/5138 ,  C04B41/5144 ,  C04B41/5127 ,  C04B35/10 ,  C04B35/00

摘要： A process for producing a ceramic member for bonding, which comprises: a first step of preparing a lower layer paste with the use of a first mixture comprising nickel, tungsten and molybdenum, applying the lower layer paste to a surface of a ceramic base which is a sintered ceramic, and drying the resultant coating layer to form a lower layer after the applying; a second step of preparing an upper layer paste with the use of a second mixture comprising one of nickel and nickel oxide and at least one of copper, copper oxide, manganese and manganese oxide, applying the upper layer paste to the lower layer, and drying the resultant coating layer to form an upper layer after the applying; and a third step of heating the lower layer and the upper layer to bake the lower layer and the upper layer.

公开(公告)号：EP1397946A1

公开(公告)日：2004-03-17

申请号：EP02719412.5

申请日：2002-04-01

申请人： Nashua Corporation

发明人： LOCHUN, Darren ,  IRELAND, John, J.

IPC分类号： H05K3/22 ,  H05K3/38 ,  H05K1/03

CPC分类号： H05K3/246 ,  G08B13/244 ,  H01F5/003 ,  H01F41/041 ,  H01F2017/006 ,  H05K1/036 ,  H05K1/095 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/245 ,  H05K3/38 ,  H05K2201/0129 ,  H05K2201/0347 ,  H05K2203/0278 ,  H05K2203/107 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2982 ,  Y10T428/31645 ,  Y10T428/31721 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T428/31928 ,  Y10T428/31931 ,  Y10T428/31935

摘要： Diclosed is a circuit element (200) that includes a thermoplastic substrate (210) and a conductive trace (220) at least partially embedded in the thermoplastic substrate (210). Also disclosed is a method of forming a circuit element (200). The method includes the steps of providing a thermoplastic substrate (210) having a softening temperature, printing a conductive ink onto the thermoplastic substrate to form a trace (220), and embedding the trace into the thermoplastic substrate (210) by heating the thermoplastic substrate (210) to a temperature above about the softening temperature about the trace (220).

公开(公告)号：EP0680660B1

公开(公告)日：1997-03-05

申请号：EP94901759.4

申请日：1993-12-15

申请人： Siemens Nixdorf Informationssysteme AG

发明人： GUTMANN, Klaus ,  LÜCKEHE, Hans-Werner

IPC分类号： H01H13/70

CPC分类号： H01H13/785 ,  H01H13/7006 ,  H01H2201/026 ,  H01H2201/03 ,  H01H2203/038 ,  H01H2203/054 ,  H05K1/11 ,  H05K3/245 ,  H05K2201/0323 ,  H05K2201/09418 ,  H05K2201/0979 ,  H05K2201/10053

摘要： Two pairs of diagonally linked squares with rounded edges are used as fixed contacts in the production of keyboards. A direct connection is ensured in the diagonal direction; the squares consist of conductive lacquer (carbon lacquer) and cover copper pads on a printed circuit board.

摘要翻译： 在键盘制作中，使用两对带有圆边的对角连接方块作为固定触点。 在对角线方向上确保直接连接; 正方形由导电漆（碳漆）和覆盖在印刷电路板上的铜焊盘组成。