公开(公告)号：EP2973625A4

公开(公告)日：2017-02-22

申请号：EP14774544

申请日：2014-03-13

Applicant: HIQ SOLAR INC

Inventor： WILLIS ANDRE P

IPC: H05K1/11 ,  H01G2/06 ,  H01G4/12 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/0311 ,  H05K2201/0394 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

公开(公告)号：EP2997627A2

公开(公告)日：2016-03-23

申请号：EP14797227.7

申请日：2014-05-14

Applicant: MC10, INC.

Inventor： HSU, Yung-Yu ,  WORK, John ,  DOWLING, Kevin J.

IPC: H01R9/00

CPC classification number: H05K1/0283 ,  A61B5/0059 ,  A61B5/6846 ,  A61B2562/164 ,  H01L23/145 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2924/15791 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration.

Abstract translation: 描述了一个示例性可拉伸装置，其包括电触点和耦合电触点的互连。 互连具有曲折形状，其包括至少一个嵌套的蛇形特征。 互连可以是导电的或不导电的。 曲折形状可以是蛇形结构，提供蛇形蛇形结构。

公开(公告)号：EP1890872A4

公开(公告)日：2015-04-22

申请号：EP06760562

申请日：2006-05-31

Applicant: TEXAS INSTRUMENTS INC

Inventor： EDWARDS DARVIN R ,  CHIU TZ-CHENG ,  ZENG KEJUN

IPC: B32B15/08 ,  B32B15/20 ,  H01L23/532

CPC classification number: H05K3/3436 ,  H01L21/4846 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/09 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T428/12715 ,  Y10T428/1291 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A metal interconnect structure ( 100 ) comprising a bond pad ( 101 ), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 mum in their main direction, and 30 or less volume percent composed of crystal grains, which expand less than 1 mum in their main crystal direction. A body ( 102 ) of tin alloy is in contact with the bond pad.

公开(公告)号：EP2467004B1

公开(公告)日：2014-04-30

申请号：EP12159297.6

申请日：2001-12-13

Applicant: DENSO CORPORATION

Inventor： Kondo, Koji ,  Kamiya, Tetsuaki ,  Harada, Toshikazu ,  Onoda, Ryuichi ,  Kamiya, Yasutaka ,  Masuda, Gentaro ,  Yazaki, Yoshitaro ,  Yokochi, Tomohiro

IPC: H05K3/46

CPC classification number: H05K3/4638 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09245 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/063 ,  H05K2203/065 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T156/1064

公开(公告)号：EP2656700A1

公开(公告)日：2013-10-30

申请号：EP11799281.8

申请日：2011-12-14

Applicant: Linxens Holding

Inventor： LECHLEITER, François ,  WELSCH, Pierre-Aloïs ,  DE MAQUILLE, Yannick

IPC: H05K1/18

CPC classification number: H01L33/486 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0393 ,  H05K1/183 ,  H05K1/184 ,  H05K1/189 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: The inventions relates to a method of manufacturing a circuit incorporating a solid state light emitting component (50), the method comprising providing an insulating layer (8), producing at least one through hole (20) in the insulating layer (8), providing a conductive layer (10), bonding a main surface (24) of the conductive layer (10) to the insulating layer (8), and positioning at least one solid state light emitting component (50,100) in the hole (20) of the insulating layer (8) and connecting this component to the conductive layer (10).

Abstract translation: 本发明涉及一种制造包含固态发光元件的电路的方法，所述方法包括提供绝缘层，在所述绝缘层中产生至少一个通孔，提供导电层，将所述导电层的主表面 并且将至少一个固态发光部件定位在绝缘层的孔中并将该部件连接到导电层。

公开(公告)号：EP2467004A3

公开(公告)日：2013-07-17

申请号：EP12159297.6

申请日：2001-12-13

Applicant: Denso Corporation

Inventor： Kondo, Koji ,  Kamiya, Tetsuaki ,  Harada, Toshikazu ,  Onoda, Ryuichi ,  Kamiya, Yasutaka ,  Masuda, Gentaro ,  Yazaki, Yoshitaro ,  Yokochi, Tomohiro

IPC: H05K3/46

CPC classification number: H05K3/4638 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09245 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/063 ,  H05K2203/065 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T156/1064

Abstract: A manufacturing method of a multilayer substrate (101) is provided, comprising: laminating single-sided conductor patterned films (21, 21 a, 21 b), each of which has a resin film (23), a conductor pattern (22, 22a) formed only on a single side of the resin film, and a via hole (24, 24a, 24b) formed at a predetermined location and filled with an interlayer connection material (50); and adhering the single-sided conductor patterned films to each other to form a multilayer substrate; wherein an arbitrary two of single-sided conductor patterned films (21 a, 21 b) are laminated so that surfaces thereof on which the conductor patterns (22) are not formed face with each other, while remaining single-sided conductor patterned films (21) are laminated in such a manner that a surface on which the conductor pattern (22) is formed and a surface on which the conductor pattern (22) is not formed face with each other, whereby electrodes (32, 37) are formed by the conductive patterns (22) at both sides of the multilayer substrate (101).

公开(公告)号：EP2333787B1

公开(公告)日：2013-04-03

申请号：EP11150365.2

申请日：2005-09-26

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Oka, Yoshio ,  Takii, Hitoshi ,  Hayashi, Noriki

IPC: H01B1/22 ,  H01B1/00 ,  H05K3/46

CPC classification number: H01B1/22 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0245 ,  H05K2201/0394

公开(公告)号：EP2114579A4

公开(公告)日：2013-03-27

申请号：EP07863298

申请日：2007-12-28

Applicant: ORMET CIRCUITS INC

Inventor： HOLCOMB KEN

IPC: B05C1/00 ,  B05D5/12 ,  H05K3/46

CPC classification number: H05K3/4614 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/10378 ,  H05K2203/061 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T156/1056

Abstract: The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.

公开(公告)号：EP2515352A1

公开(公告)日：2012-10-24

申请号：EP10852393.7

申请日：2010-08-25

Applicant: Foshan Nationstar Optoelectronics Co., Ltd ,  Zhu Hai Bontech Electronic Technology Co., Ltd.

Inventor： YU, Binhai ,  SUN, Bairong ,  LI, Weiping ,  XIA, Xunli ,  LI, Cheng ,  LONG, Menghua ,  LIANG, Lifang

IPC: H01L33/48

CPC classification number: F21V21/00 ,  B23P11/00 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K1/183 ,  H05K2201/0394 ,  H05K2201/10106 ,  Y10T29/49996 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A manufacture method for a surface mounted power LED support comprises steps: providing a wiring board (1) having both sided metal layers (11, 12); forming a hole (13); setting a metal layer (131) in the surface of the hole; thickening the metal layer (11, 12) of the wiring board; etching the metal layer of the wiring board; cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board (10, 11, 12), a hole (13) formed in the wiring board and wiring layers (16, 17) set on the surface of the wiring board. The invention can increase the heat dissipation effect of the chip.

Abstract translation: 用于表面安装的功率的制造方法的LED支撑件包括步骤：提供具有两个面的金属层（11，12）（1）的布线基板; 形成孔（13）; 设置的金属层中的所述表面（131）孔; 加厚布线基板的金属层（11，12）; 蚀刻所述布线基板的金属层; 切割布线板，以形成单个支撑单元。 表面安装的LED功率支撑件包括两个单面布线基板（10，11，12），在布线板的表面上设置的布线基板及布线层（16，17）形成的孔（13）。 本发明可以提高芯片的散热效果。

公开(公告)号：EP2312923B1

公开(公告)日：2012-09-12

申请号：EP11001003.0

申请日：2006-07-07

Applicant: Ibiden Co., Ltd.

Inventor： Takahashi, Michimasa ,  Mikado, Yukinobu ,  Nakamura, Takenobu ,  Aoyama, Masakazu

IPC: H05K3/46 ,  H05K1/11

CPC classification number: H01L23/48 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/00 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09827 ,  Y10T29/49124 ,  H01L2924/00