RADIATION-SENSITIVE RESIN COMPOSITION
    1.
    发明公开
    RADIATION-SENSITIVE RESIN COMPOSITION 审中-公开
    辐射敏感性树脂组合物

    公开(公告)号:EP1953595A1

    公开(公告)日:2008-08-06

    申请号:EP06823478.0

    申请日:2006-11-20

    申请人: JSR Corporation

    IPC分类号: G03F7/039 G03F7/20 H01L21/027

    CPC分类号: G03F7/2041 G03F7/0397

    摘要: A radiation-sensitive resin composition for liquid immersion lithography which produces an excellent pattern profile, exhibits excellent resolution, provides sufficient focal depth allowance, and elutes only the minimal amount in the liquid when brought in contact with the liquid during exposure to radiation. The radiation-sensitive resin composition forms a photoresist film in liquid immersion lithography, in which radiation is emitted through a liquid for use in liquid immersion lithography having a refractive index larger than 1.44 and smaller than 1.85 at a wavelength of 193 nm, existing between a lens and a photoresist, the composition comprising a resin having a recurring unit with a lactone structure, which is insoluble or scarcely soluble in alkali, but becomes soluble in alkali by the action of an acid, and a radiation-sensitive acid generator.

    摘要翻译: 用于液体浸没式光刻的辐射敏感性树脂组合物产生优异的图案轮廓,表现出优异的分辨率,提供足够的焦深允许量,并且在暴露于辐射期间与液体接触时仅在液体中洗脱最少量。 辐射敏感树脂组合物在液浸光刻中形成光致抗蚀剂膜,其中辐射通过用于液体浸没光刻的液体发射,该液体具有在193nm波长处大于1.44且小于1.85的折射率,其存在于 透镜和光致抗蚀剂,所述组合物包含具有内酯结构的重复单元的树脂,其不溶于或几乎不溶于碱,但通过酸的作用变得可溶于碱,以及辐射敏感酸发生剂。