摘要:
In a method of manufacturing a green light emitting diode, an included angle (ϑ] defined by a line extending along the longitudinal direction of light and dark stripes of an oxide region (7) formed on a cleavage surface (6) of a GaP single crystal wafer (1) and a (111) surface of the wafer (1) is set to be a predetermined angle, and a liquid phase epitaxial layer having a p-n junction is formed on the (111) surface (8) of the GaP single crystal wafer (1).
摘要:
In a method of manufacturing a green light emitting diode, an included angle (ϑ] defined by a line extending along the longitudinal direction of light and dark stripes of an oxide region (7) formed on a cleavage surface (6) of a GaP single crystal wafer (1) and a (111) surface of the wafer (1) is set to be a predetermined angle, and a liquid phase epitaxial layer having a p-n junction is formed on the (111) surface (8) of the GaP single crystal wafer (1).