PRIMER COMPOSITION AND METHOD OF BONDING THEREWITH
    7.
    发明公开
    PRIMER COMPOSITION AND METHOD OF BONDING THEREWITH 审中-公开
    引物和使用胶粘

    公开(公告)号:EP1403352A4

    公开(公告)日:2005-10-26

    申请号:EP02726459

    申请日:2002-05-22

    Applicant: KANEKA CORP

    Abstract: The invention provides a primer composition excellent in adhesion to porous substrates and a method of bonding, particularly, a primer composition characterized by containing (A) a vinyl copolymer obtained by copolymerizing a monomer component essentially comprising (a) 5 to 80 wt% of a monomer having a silicon-containing group which bears a hydroxyl or hydrolyzable group bonded to the silicon atom and causes crosslinking via the formation of a siloxane linkage and (b) 20 to 95 wt% of an alkyl (meth)acrylate monomer wherein the alkyl has 1 to 8 carbon atoms and (B) a vinyl copolymer obtained by copolymerizing a monomer component essentially comprising (a) 5 to 80 wt% of a monomer having a silicon-containing group which bears a hydroxyl or hydrolyzable group bonded to the silicon atom and causes crosslinking via the formation of a siloxane linkage and (c) 20 to 95 wt% of an alkyl (meth)acrylate monomer wherein the alkyl has 10 or more carbon atoms; and a method of bonding a sealant to a substrate, characterized by applying the primer composition onto a substrate and then making a sealant adhere to the resulting coated surface of the substrate.

    CURABLE RESIN COMPOSITION CONTAINING POLYMER FINE PARTICLES AND HAVING IMPROVED STORAGE STABILITY
    8.
    发明公开
    CURABLE RESIN COMPOSITION CONTAINING POLYMER FINE PARTICLES AND HAVING IMPROVED STORAGE STABILITY 有权
    HÄRTBAREHARZZUSAMMENSETZUNG MIT POLYMERFEINPARTIKELN UND VERBESSERTERLAGERSTABILITÄT

    公开(公告)号:EP3064520A4

    公开(公告)日:2017-08-16

    申请号:EP14857842

    申请日:2014-10-28

    Applicant: KANEKA CORP

    Abstract: A curable resin composition of the present invention contains 1 to 100 parts by mass of a polymer fine particle (B) relative to 100 parts by mass of an epoxy resin (A), wherein the polymer fine particle has a core-shell structure, the core layer of the polymer fine particle is diene rubber, the content of the epoxy group of the polymer fine particle (B) is 0.01 to 0.15 mmol/g. A curable resin composition (I) of the first embodiment contains 0.5 to 30 parts by mass of fumed silica as an inorganic filler (C). In addition, a curable resin composition (II) of the second embodiment contains bisphenol A epoxy resin and rubber-modified epoxy resin and/or urethane-modified epoxy resin as the epoxy resin (A).

    Abstract translation: 本发明的固化性树脂组合物,相对于环氧树脂(A)100质量份,含有1〜100质量份的聚合物微粒(B),所述聚合物微粒具有核壳结构, 聚合物微粒的芯层为二烯橡胶,聚合物微粒(B)的环氧基含量为0.01〜0.2mmol / g。 第一实施方式的固化性树脂组合物(I)含有0.5〜30质量份的气相二氧化硅作为无机填料(C)。 另外,第二实施方式的固化性树脂组合物(II)含有双酚A型环氧树脂和橡胶改性环氧树脂和/或氨基甲酸酯改性环氧树脂作为环氧树脂(A)。

    ADHESIVE-BONDED STRUCTURE COMPRISING BOTH ADHESIVE COMPOSITION AND WOOD MATERIAL
    9.
    发明公开
    ADHESIVE-BONDED STRUCTURE COMPRISING BOTH ADHESIVE COMPOSITION AND WOOD MATERIAL 有权
    EINEM HOLZMATERIAL的HAFTGEBUNDENE STRUKTUR AUS EINER HAFTSTOFFZUSAMMENSETZZEN

    公开(公告)号:EP2684690A4

    公开(公告)日:2014-11-26

    申请号:EP12754979

    申请日:2012-03-07

    Applicant: KANEKA CORP

    Abstract: The present invention provides a bonded structure that includes a wood material and a curable composition prepared from a reactive silyl group-containing polymer and that has high strength and boiling water resistance. The reactive silyl group-containing polymer is an environmentally friendly material having less toxicity. The use of a reactive silyl group-containing organic polymer containing a (meth)acrylate polymer and a polyoxyalkylene polymer with specific structures provides a curable composition having high strength and a high modulus, leading to the formation of a bonded structure including the composition and a wood material, which is excellent in strength and boiling water resistance. Thus, the above problem can be solved.

    Abstract translation: 本发明提供了一种粘合结构,其包括木质材料和由含反应性甲硅烷基的聚合物制备并具有高强度和耐沸水性的可固化组合物。 含有反应性甲硅烷基的聚合物是具有较小毒性的环保材料。 含有具有特定结构的(甲基)丙烯酸酯聚合物和聚氧化烯聚合物的含活性甲硅烷基的有机聚合物的使用提供了具有高强度和高模量的可固化组合物,导致形成包含该组合物的粘合结构和 木材材料,其强度和耐沸水性优异。 因此,可以解决上述问题。

    CURABLE COMPOSITION
    10.
    发明公开

    公开(公告)号:EP2682432A4

    公开(公告)日:2014-08-20

    申请号:EP12752103

    申请日:2012-02-22

    Applicant: KANEKA CORP

    Abstract: The present invention provides a curable composition useful as a contact adhesive which has a high rate of initial tack development, high tack strength, and long retention time of the developed tack. The curable composition includes an organic polymer (Q) containing a reactive silyl group, and a linear organic polymer (P) having a number average molecular weight larger than that of the polymer (Q) and having a reactive silyl group containing three hydrolyzable groups at only one terminal. The organic polymer (P) and the organic polymer (Q) are mixed at a mixing ratio (P):(Q), in terms of parts by weight, of 60:40 to 5:95.

Patent Agency Ranking