公开(公告)号：EP1505121B1

公开(公告)日：2008-01-09

申请号：EP03725638.5

申请日：2003-04-23

申请人： KANEKA CORPORATION

发明人： TSUMURA, Manabu ,  IDE, Masahito ,  OUCHI, Katsuya ,  KURAMOTO, Masafumi, c/o NICHIA CORPORATION ,  MIKI, Tomohide, c/o NICHIA CORPORATION ,  NII, Ikuya, c/o NICHIA CORPORATION

IPC分类号： C08L83/05 ,  C08K5/541 ,  H01L33/00 ,  C08L63/00 ,  C08K5/057 ,  H01L23/29 ,  C08K5/55

CPC分类号： C08L63/00 ,  C08F8/42 ,  C08G77/12 ,  C08G77/42 ,  C08G77/50 ,  C08G77/54 ,  C08K5/54 ,  C08L83/10 ,  C08L83/14 ,  H01L33/56 ,  H01L2924/0002 ,  Y10T428/31663 ,  C08L83/04 ,  H01L2924/00

摘要： A hardenable composition from which a hardening product of high adherence and high transparency or a hardening product of high toughness and high transparency can be produced. In particular, a hardenable composition comprising an organic compound having, per molecule, at least two reactive carbon to carbon double bonds and SiH groups (A), a silicon compound having, per molecule, at least two SiH groups (B), a hydrosilylating catalyst (C), a silane coupling agent and/or an epoxidized compound (D) and a silanol condensation catalyst (E). There is further provided a light emitting diode sealed with the hardening product obtained by hardening the hardenable composition.

公开(公告)号：EP1505121A1

公开(公告)日：2005-02-09

申请号：EP03725638.5

申请日：2003-04-23

申请人： KANEKA CORPORATION

发明人： TSUMURA, Manabu ,  IDE, Masahito ,  OUCHI, Katsuya ,  KURAMOTO, Masafumi, c/o NICHIA CORPORATION ,  MIKI, Tomohide, c/o NICHIA CORPORATION ,  NII, Ikuya, c/o NICHIA CORPORATION

IPC分类号： C08L83/05 ,  C08K5/541 ,  H01L33/00 ,  C08L63/00 ,  C08K5/057 ,  H01L23/29 ,  C08K5/55

CPC分类号： C08L63/00 ,  C08F8/42 ,  C08G77/12 ,  C08G77/42 ,  C08G77/50 ,  C08G77/54 ,  C08K5/54 ,  C08L83/10 ,  C08L83/14 ,  H01L33/56 ,  H01L2924/0002 ,  Y10T428/31663 ,  C08L83/04 ,  H01L2924/00

摘要： The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency.
A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.

摘要翻译： 本发明提供了一种可固化组合物提供具有优良的粘合性能和高透明性，或具有高的韧性和透明性的固化产物的固化产物。 一种固化性组合物含有（A）含有与每个分子中SiH基团反应的至少两个碳 - 碳双键的有机化合物，（B）每个分子中具有至少两个SiH基团的硅化合物，（ C）氢化硅烷化催化剂，（D）硅烷偶联剂和/或含有环氧基的化合物，和（E）硅烷醇缩合催化剂。 通过与固化产物获得一种密封的发光二极管固化所述可固化组合物。