Abstract:
Provided is a two-part thermally conductive resin composition that can be cured at normal temperature and of which a cured product has a sufficient resin elongation percentage. A two-part thermally conductive resin composition comprising a component (A) to a component (F): component (A): an epoxy resin (excluding epoxy resins having a (meth)acrylic-based polymer skeleton); component (B): a metal catalyst; component (C): an acrylic-based polymer and/or a polyether polyol (excluding component (D)); component (D): a crosslinkable silyl-containing organic polymer; component (E): an epoxy curing agent; and component (F): a heat dissipating filler.
Abstract:
Verfahren zur Herstellung von einem oder mehreren Alkoxysiloxanen durch thermische Umsetzung von mindestens einem Siloxangrundkörper mit mindestens einem Alkalimetallalkoholat und mindestens einem Alkohol, wobei man in einem ersten Schritt den mindestens einen Siloxangrundkörper unter Durchmischung mit mindestens einem Alkohol und mindestens einem Alkalimetallalkoholat unter Wärmeeintrag umsetzt, und zwar ohne Entfernung von etwaig auftretendem Wasser aus der Reaktionsmischung, und danach die aus dem ersten Schritt hervorgegangene Reaktionsmischung in einem zweiten Schritt durch Hinzufügen mindestens einer Brönstedtsäure neutralisiert, vorzugsweise feste Bestandteile abfiltriert und danach das oder die Alkoxysiloxane durch thermisches Abtrennen flüchtiger Verbindungen isoliert, wobei der mindestens eine Siloxangrundkörper ausgewählt ist aus der Gruppe bestehend aus Hexamethylcyclotrisiloxan (D 3 ), Octamethylcyclotetrasiloxan (D 4 ), Dekamethylcyclopentasiloxan (D 5 ), Dodekamethylcyclohexasiloxan (D 6 ), Mischungen zyklischer-verzweigter Siloxane vom D/T-Typ, Silikonöle, Polydimethylsiloxandiole und α,ω-Divinytsitoxane.
Abstract:
A curable composition including a perfluoro(poly)ether group-containing silane compound which is a compound having two or more Si atoms each bonding to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, and a perfluoro(poly)ether group, wherein the perfluoro(poly)ether group is a group represented by formula: -(OC 6 F 12 ) a -(OC 5 F 10 ) b -(OC 4 F 8 ) c -(OC 3 X 10 6 ) d -(OC 2 F 4 ) e -(OCF 2 ) f -, wherein a, b, c and d are each independently an integer of 0 or more and 30 or less, e and f are each independently an integer of 1 or more and 200 or less, the sum of a, b, c, d, e and f is at least 5 or more, the occurrence order of the respective repeating units in parentheses with the subscript a, b, c, d, e or f is not limited in the formula, a ratio of e to f is 1.0 or more, and each X 10 , at each occurrence, is independently a hydrogen atom, a fluorine atom or a chlorine atom; an organosilicon compound having at least two -O-R g3 (s) each bonding to a Si atom, wherein each R g3 , at each occurrence, is independently a hydrogen atom or a monovalent organic group; and a catalyst.
Abstract:
Provided is a two-part curable composition which has excellent curability, and exhibits flexibility and adhesion durability. The two-part curable composition comprises a first reagent containing at least a 2-cyanoacrylic acid ester and a second reagent containing at least a polymer having a hydrolyzable silyl group, in which an elastomer and a curing catalyst for the above polymer are each contained in at least one of the first and second reagents in predetermined amounts. A preferable curing catalyst is a compound having a metal element and an organic group bonded to the metal element via oxygen, or an acid having a pKa of 4 or lower at 25°C. Preferably, a curing accelerator for 2-cyanoacrylic acid ester is contained in at least one of the first and second reagents.
Abstract:
A silicone gel composition for use in sealing or filling of electrical or electronic parts comprising at least one adhesion promoter (Z), and by curing to form a silicone gel having, at 25° C. and a shear frequency of 0.1 Hz, a loss elastic modulus of from 5.0×103 to 1.0×105 dyne/cm2, a complex elastic modulus of from 5.0×104 to 1.0×106 dyne/cm2, and a loss tangent of 0.3 or less. The silicone gel composition is provided, which can suppress the occurrence of air bubbles or cracks in silicone gel that seals or fills an electrical or electronic part and has excellent bonding to the electrical or electronic part even when used under high-temperature conditions as in a power device; and a silicone gel is provided, which can suppress the occurrence of air bubbles or cracks when it seals or fills an electrical or electronic part.
Abstract:
The present invention provides a primer for adhesive tapes with improved adhesion-promoting properties. This is achieved with a primer comprising a mixture G, which is dissolved or dispersed in one or more solvents, consisting of at least one co-polymer obtained by co-polymerization of a monomer mixture, comprising an amount of at least 90 wt% of the following monomers: vinylcaprolactam and/or vinylpyrrolidone; - one or more of the monomers a) and/or b): a) acrylic acid ester of a linear, primary alcohol having 2 to 10 carbon atoms in the alkyl group of the alcohol, b) acrylic acid ester of a branched, non-cyclic alcohol having 3 to 12 carbon atoms in the alkyl group of the alcohol, - at least one chlorinated polyolefin, and at least one metal compound selected from the group consisting of metal acetylacetonates, metal alkoxides and alkoxy-metal acetylacetonates.
Abstract:
Even when a tin-based polymerization catalyst and a phosphorus-based compound are present in a poly-L-lactic acid (A) and a poly-D-lactic acid (B), by using a specific proportion of an organic acid metal salt or an organic metal salt for stereocomplex crystallization, a stereocomplex polylactic acid composition having a high stereocomplex crystallinity and a high stereocomplex crystal melting point, a small stereocomplex crystal melting point depression even after remelting, a small decrease in the molecular weight, excellent forming processability, and also heat resistance can be provided.