公开(公告)号：EP2195834A4

公开(公告)日：2017-12-27

申请号：EP08831947

申请日：2008-09-22

Applicant: KLA-TENCOR CORP

Inventor： BHASKAR KRIS ,  BHASKAR CHETANA ,  KULKARNI ASHOK ,  ROSENGAUS ELIEZER ,  CAMPOCHIARO CECELIA ,  MAHER CHRIS ,  DUFFY BRIAN ,  KHULLAR ANEESH ,  KOHLI ALPA ,  BALASUBRAMANIAN LALITA ,  BHATTACHARYYA SANTOSH ,  MAHADEVAN MOHAN

IPC: H01L21/66 ,  G06T1/20 ,  G06T7/00

CPC classification number: G06T7/001 ,  G06T1/20 ,  G06T2207/30148

Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.

公开(公告)号：EP2457251A4

公开(公告)日：2017-11-08

申请号：EP10802700

申请日：2010-07-16

Applicant: KLA-TENCOR CORP

Inventor： ZHAO GUOHENG ,  VAEZ-IRAVANI MEHDI ,  YOUNG SCOTT ,  BHASKAR KRIS

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2021/8822

Abstract: A dark field inspection system that minimizes the speckle noise due to sample surface roughness can include a plurality of beam shaping paths for generating a composite, focused illumination line on a wafer. Each beam shaping path can illuminate the wafer at an oblique angle. The plurality of beam shaping paths can form a ring illumination. This ring illumination can reduce the speckle effect, thereby improving SNR. An objective lens can capture scattered light from the wafer and an imaging sensor can receive an output of the objective lens. Because the wafer illumination occurs at oblique angles, the objective lens can have a high NA, thereby improving optical resolution of the imaging sensor, and the resulting signal level.