公开(公告)号：EP2195834A4

公开(公告)日：2017-12-27

申请号：EP08831947

申请日：2008-09-22

Applicant: KLA-TENCOR CORP

Inventor： BHASKAR KRIS ,  BHASKAR CHETANA ,  KULKARNI ASHOK ,  ROSENGAUS ELIEZER ,  CAMPOCHIARO CECELIA ,  MAHER CHRIS ,  DUFFY BRIAN ,  KHULLAR ANEESH ,  KOHLI ALPA ,  BALASUBRAMANIAN LALITA ,  BHATTACHARYYA SANTOSH ,  MAHADEVAN MOHAN

IPC: H01L21/66 ,  G06T1/20 ,  G06T7/00

CPC classification number: G06T7/001 ,  G06T1/20 ,  G06T2207/30148

Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.

公开(公告)号：EP3111468A4

公开(公告)日：2017-08-09

申请号：EP15755638

申请日：2015-02-25

Applicant: KLA - TENCOR CORP

Inventor： VAJARIA HIMANSHU ,  JAHANBIN SINA ,  RIES BRADLEY ,  MAHADEVAN MOHAN

IPC: H01L21/66 ,  G06T7/00

CPC classification number: G06T7/0004 ,  G01N21/9503 ,  G06K9/481 ,  G06K9/6204 ,  G06K2209/19 ,  G06T7/0006 ,  G06T7/13 ,  G06T7/62 ,  G06T2207/10024 ,  G06T2207/30148

公开(公告)号：EP3105780A4

公开(公告)日：2017-10-11

申请号：EP15748438

申请日：2015-02-12

Applicant: KLA - TENCOR CORP

Inventor： VAJARIA HIMANSHU ,  TORELLI TOMMASO ,  RIES BRADLEY ,  MAHADEVAN MOHAN

IPC: H01L21/66 ,  G06T7/00

CPC classification number: G06T7/0004 ,  G06T2207/20076 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/20 ,  Y02P90/14

公开(公告)号：EP2389685A4

公开(公告)日：2017-04-19

申请号：EP10733928

申请日：2010-01-22

Applicant: KLA-TENCOR CORP

Inventor： CHEN LU ,  KIRKWOOD JASON ,  MAHADEVAN MOHAN ,  SMITH JAMES A ,  GAO LISHENG ,  HUANG JUNQING ,  LUO TAO ,  WALLINGFORD RICHARD

IPC: H01L21/66 ,  G01N21/88 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

公开(公告)号：EP3117453A4

公开(公告)日：2017-11-01

申请号：EP15809587

申请日：2015-06-19

Applicant: KLA-TENCOR CORP

Inventor： NICOLAIDES LENA ,  TSAI BEN-MING BENJAMIN ,  AJI PRASHANT A ,  GASVODA MICHAEL ,  STOKOWSKI STANLEY E ,  ZHAO GUOHENG ,  WEN YOUXIAN ,  MAHADEVAN MOHAN ,  HORN PAUL D ,  VOLLRATH WOLFGANG

IPC: H01L21/66 ,  G01N21/95 ,  G03F7/20 ,  H01L21/027

CPC classification number: G01N21/9503 ,  G01N2201/06113 ,  G03F7/7085 ,  H01L22/12

公开(公告)号：EP3100032A4

公开(公告)日：2017-08-30

申请号：EP15749379

申请日：2015-02-11

Applicant: KLA-TENCOR CORP

Inventor： NICOLAIDES LENA ,  MAHADEVAN MOHAN ,  SALNIK ALEX ,  YOUNG SCOTT A

IPC: G01N21/95 ,  G01N21/17 ,  G01N21/39 ,  G01N21/88 ,  H01L21/66

CPC classification number: G01N21/9505 ,  G01N21/1717 ,  G01N21/9501 ,  G01N2021/8825 ,  G01N2201/06113

Abstract: Disclosed are methods and apparatus for detecting defects or reviewing defects in a semiconductor sample. The system has a brightfield (BF) module for directing a BF illumination beam onto a sample and detecting an output beam reflected from the sample in response to the BF illumination beam. The system has a modulated optical reflectance (MOR) module for directing a pump and probe beam to the sample and detecting a MOR output beam from the probe spot in response to the pump beam and the probe beam. The system includes a processor for analyzing the BF output beam from a plurality of BF spots to detect defects on a surface or near the surface of the sample and analyzing the MOR output beam from a plurality of probe spots to detect defects that are below the surface of the sample.

Abstract translation: 公开了用于检测缺陷或检查半导体样品中的缺陷的方法和设备。 该系统具有明场（BF）模块，用于将BF照明光束引导到样本上，并响应于BF照明光束检测从样本反射的输出光束。 该系统具有调制的光学反射（MOR）模块，用于将泵浦和探测光束引导至样品，并响应于泵浦光束和探测光束从探测点探测MOR输出光束。 该系统包括处理器，用于分析来自多个BF点的BF输出束以检测样品的表面上或附近的缺陷并分析来自多个探针点的MOR输出束以检测低于表面的缺陷 的样本。