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1.SYSTEMS AND METHODS FOR DETECTING DEFECTS ON A WAFER 审中-公开
Title translation: 系统维也纳ZUR ERKENNUNG VON DEFEKTEN AUF EINEM WAFER公开(公告)号:EP2389685A4
公开(公告)日:2017-04-19
申请号:EP10733928
申请日:2010-01-22
Applicant: KLA-TENCOR CORP
Inventor: CHEN LU , KIRKWOOD JASON , MAHADEVAN MOHAN , SMITH JAMES A , GAO LISHENG , HUANG JUNQING , LUO TAO , WALLINGFORD RICHARD
CPC classification number: G01N21/9501 , G01N2021/887 , H01L22/12