公开(公告)号：EP3276632A1

公开(公告)日：2018-01-31

申请号：EP16768265.7

申请日：2016-02-23

Applicant: Kyocera Corporation

Inventor： OKOUCHI,Akira ,  IMAGAWA,Kazuki

IPC: H01B3/42 ,  C08J5/18 ,  C08K5/00 ,  C08L23/18 ,  C08L65/00 ,  C08L67/03 ,  H01B3/44 ,  H01G2/04 ,  H01G4/18

CPC classification number: H01G4/18 ,  B60L11/1803 ,  B60L2210/40 ,  C08J5/18 ,  C08J2365/02 ,  C08J2367/03 ,  C08K5/00 ,  C08K5/005 ,  C08L23/18 ,  C08L65/00 ,  C08L65/02 ,  C08L67/03 ,  H01B3/42 ,  H01B3/44 ,  H01B3/441 ,  H01G2/04 ,  H01G4/005 ,  H01G4/206 ,  H01G4/32 ,  H01G4/33 ,  H01G4/38 ,  H02P27/06

Abstract: A dielectric film includes an organic resin polymer, and an organic resin monomer. The organic resin polymer includes at least one of polyarylate and cycloolefin polymer, the organic resin monomer includes at least one of phenol monomer, sulfur monomer, and phosphorus monomer, and a total content of the organic resin monomer falls in a range of 0.01 to 7.6 parts by mass based on of 100 parts by mass the organic resin polymer.

Abstract translation: 介电膜包括有机树脂聚合物和有机树脂单体。 有机树脂聚合物包括聚芳酯和环烯烃聚合物中的至少一种，有机树脂单体包括苯酚单体，硫单体和磷单体中的至少一种，并且有机树脂单体的总含量落入0.01至7.6 质量份，基于100质量份有机树脂聚合物。

公开(公告)号：EP3480827A1

公开(公告)日：2019-05-08

申请号：EP17820193.5

申请日：2017-06-28

Applicant: Kyocera Corporation

Inventor： IMAGAWA,Kazuki

IPC: H01B3/00 ,  B32B27/36 ,  H01B3/30 ,  H01B3/42 ,  H01B5/14 ,  H01B7/02

Abstract: There is provided an insulating material including a composite resin material comprising an organic resin (5) and minute particles (6) containing a metal element. The organic resin (5) includes a resin material including polyester as a main backbone thereof and having an alkoxy group. The minute particles (6) have an average particle size of greater than or equal to 0.5 nm but less than or equal to 50 nm. Such an insulating material is used as an insulating layer (2) of a wiring member (wiring board, covered electric wire, etc.) including a conductor (1) and the insulating layer (2) which covers the conductor (1).

公开(公告)号：EP3309193A1

公开(公告)日：2018-04-18

申请号：EP16807591.9

申请日：2016-06-10

Applicant: KYOCERA Corporation

Inventor： OKAMURA,Kouki ,  IMAGAWA,Kazuki

IPC: C08J5/18 ,  C08L67/02 ,  C08L71/12 ,  H01G4/18 ,  H02M7/48

CPC classification number: C08L71/123 ,  B60L11/1803 ,  B60L2210/40 ,  C08G65/002 ,  C08J5/18 ,  C08J2367/02 ,  C08J2371/12 ,  C08J2467/02 ,  C08J2471/12 ,  C08L67/02 ,  C08L71/12 ,  C08L2203/20 ,  H01G4/14 ,  H01G4/18 ,  H01G4/228 ,  H01G4/33 ,  H01G4/38 ,  H01G4/40 ,  H02M7/48 ,  H02M7/5387 ,  H02P27/06

Abstract: A composite resin material (1) including: a first organic resin having a phenylene ether structure; and a second organic resin having a main skeleton composed of a polyester structure, one of the first organic resin and the second organic resin forming a continuous phase (2), the other one thereof being present within the continuous phase (2), as organic resin particles (3) having an average particle diameter of 1 µm or less.

Abstract translation: 一种复合树脂材料（1），其包含：具有亚苯​​基醚结构的第一有机树脂; 和具有由聚酯结构构成的主骨架的第二有机树脂，第一有机树脂和第二有机树脂中的一种形成连续相（2），另一种存在于连续相（2）内，作为有机物 树脂粒子（3）的平均粒径为1μm以下。