公开(公告)号：EP3309193A1

公开(公告)日：2018-04-18

申请号：EP16807591.9

申请日：2016-06-10

Applicant: KYOCERA Corporation

Inventor： OKAMURA,Kouki ,  IMAGAWA,Kazuki

IPC: C08J5/18 ,  C08L67/02 ,  C08L71/12 ,  H01G4/18 ,  H02M7/48

CPC classification number: C08L71/123 ,  B60L11/1803 ,  B60L2210/40 ,  C08G65/002 ,  C08J5/18 ,  C08J2367/02 ,  C08J2371/12 ,  C08J2467/02 ,  C08J2471/12 ,  C08L67/02 ,  C08L71/12 ,  C08L2203/20 ,  H01G4/14 ,  H01G4/18 ,  H01G4/228 ,  H01G4/33 ,  H01G4/38 ,  H01G4/40 ,  H02M7/48 ,  H02M7/5387 ,  H02P27/06

Abstract: A composite resin material (1) including: a first organic resin having a phenylene ether structure; and a second organic resin having a main skeleton composed of a polyester structure, one of the first organic resin and the second organic resin forming a continuous phase (2), the other one thereof being present within the continuous phase (2), as organic resin particles (3) having an average particle diameter of 1 µm or less.

Abstract translation: 一种复合树脂材料（1），其包含：具有亚苯​​基醚结构的第一有机树脂; 和具有由聚酯结构构成的主骨架的第二有机树脂，第一有机树脂和第二有机树脂中的一种形成连续相（2），另一种存在于连续相（2）内，作为有机物 树脂粒子（3）的平均粒径为1μm以下。

公开(公告)号：EP3109918A4

公开(公告)日：2017-10-25

申请号：EP15752523

申请日：2015-02-17

Applicant: LG CHEMICAL LTD

Inventor： CHOI BAN SEOK ,  YOO HYUN JEE ,  KIM HYUN SUK ,  LEE SEUNG MIN ,  MOON JUNG OK ,  YANG SE WOO

IPC: H01L51/52 ,  C08J5/18 ,  C09K11/06 ,  H01L51/54 ,  H01L51/56

CPC classification number: H01L51/5253 ,  B32B2457/206 ,  C08J5/18 ,  C08J2363/00 ,  C08J2471/12 ,  C08L63/00 ,  H01L51/0035 ,  H01L51/5012 ,  H01L51/5218 ,  H01L51/5234 ,  H01L51/5243 ,  H01L51/5259 ,  H01L51/5284 ,  H01L51/529 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2251/5392

Abstract: Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

公开(公告)号：EP3219758A1

公开(公告)日：2017-09-20

申请号：EP14906062.6

申请日：2014-12-02

Applicant: Shengyi Technology Co., Ltd.

Inventor： LI, Hui ,  FANG, Kehong

IPC: C08L63/00 ,  C08L71/12 ,  C08L35/06 ,  B32B27/04 ,  C08J5/24 ,  H05K1/03

CPC classification number: B32B27/38 ,  B32B27/04 ,  B32B27/285 ,  B32B27/302 ,  B32B2260/046 ,  B32B2307/306 ,  B32B2371/00 ,  B32B2457/08 ,  C08G59/3218 ,  C08G61/02 ,  C08G73/065 ,  C08G2261/724 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2379/04 ,  C08J2425/08 ,  C08J2435/06 ,  C08J2463/00 ,  C08J2471/10 ,  C08J2471/12 ,  C08L61/14 ,  C08L63/00 ,  C08L79/04 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/035 ,  H05K1/024 ,  H05K1/03 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08K3/36 ,  C08L35/06 ,  C08L71/12

Abstract: A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

Abstract translation: 一种热固性树脂组合物和由其制备的预浸料坯和层压板。 该热固性树脂组合物含有以下重量份数的组分：氰酸酯50-150份; 30-100份环氧树脂; 5-70份苯乙烯 - 马来酸酐; 20-100份聚苯醚; 30-100份无卤阻燃剂; 0.05-5份固化促进剂; 和50-200份填料。 从热固性树脂组合物制得的预浸料和层压板具有综合性能，如低介电常数，低介电损耗，优良的阻燃性，耐热性和耐湿性等，并且适合用于在无卤素 高频多层电路板。

公开(公告)号：EP3093308A4

公开(公告)日：2017-01-18

申请号：EP15768492

申请日：2015-03-19

Applicant: TORAY INDUSTRIES

Inventor： ARAI ATSUHITO ,  FURUKAWA KOJI ,  YAMASHITA NAOFUMI ,  KOCHI SHINJI ,  KUNIMITSU YUMI ,  FUJIOKA YUI ,  TAIKO HIROSHI

IPC: C08J5/24 ,  C08J5/04 ,  C08J5/10 ,  C08K3/04 ,  C08K7/02 ,  C08K7/06 ,  C08L71/12 ,  C08L101/00 ,  H01B1/00 ,  H01B1/24

CPC classification number: C08J5/24 ,  C08J5/042 ,  C08J5/10 ,  C08J2363/00 ,  C08J2471/12 ,  C08J2477/02 ,  C08J2477/04 ,  C08K3/04 ,  C08K7/06 ,  C08L71/12 ,  C08L101/00 ,  H01B1/24

Abstract: The present invention has the following structure to provide a prepreg that makes it possible to produce a fiber-reinforced composite material provided with both exceptional impact resistance and thickness-direction conductivity. A prepreg characterized in containing at least the following components [A] - [F], and further characterized in that the ratio Ne/Nd of the number of structures Ne of component [F] present in a range of outside 110% of the particle diameter of component [E] and the number of structures Nd of component [F] present in a range outside 110% of the particle diameter of component [D] is 0.25 or higher. [A]: Carbon fibers, [B] thermosetting resin, [C] : curing agent, [D] : particles composed mainly of thermoplastic resin having a primary particle number-average particle size of 5-50 µm, [E]: conductive particles different from component [D] and having a primary particle number-average particle size in the range of a specific expression, [F]: filler comprising a carbon material

公开(公告)号：EP3109918A1

公开(公告)日：2016-12-28

申请号：EP15752523.9

申请日：2015-02-17

Applicant: LG Chem, Ltd.

Inventor： CHOI, Ban Seok ,  YOO, Hyun Jee ,  KIM, Hyun Suk ,  LEE, Seung Min ,  MOON, Jung Ok ,  YANG, Se Woo

IPC: H01L51/52 ,  H01L51/54 ,  C09K11/06 ,  H01L51/56

CPC classification number: H01L51/5253 ,  B32B2457/206 ,  C08J5/18 ,  C08J2363/00 ,  C08J2463/04 ,  C08J2471/12 ,  C08L63/00 ,  H01L51/0035 ,  H01L51/5012 ,  H01L51/5218 ,  H01L51/5234 ,  H01L51/5243 ,  H01L51/5259 ,  H01L51/5284 ,  H01L51/529 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2251/5392

Abstract: Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

Abstract translation: 提供了一种封装膜，包括该膜的有​​机电子器件以及该有机电子器件的制造方法。 当使用封装膜封装有机电子器件时，可以实现优异的防潮性，并且通过吸收和阻挡内部或外部光来防止光的反射或散射，可以防止有机电子器件的外部缺陷。

公开(公告)号：EP3093308A1

公开(公告)日：2016-11-16

申请号：EP15768492.9

申请日：2015-03-19

Applicant: Toray Industries, Inc.

Inventor： ARAI, Atsuhito ,  FURUKAWA, Koji ,  YAMASHITA, Naofumi ,  KOCHI, Shinji ,  KUNIMITSU, Yumi ,  FUJIOKA, Yui ,  TAIKO, Hiroshi

IPC: C08J5/24 ,  C08K3/04 ,  C08K7/06 ,  C08L71/12 ,  C08L101/00 ,  H01B1/00 ,  H01B1/24

CPC classification number: C08J5/24 ,  C08J5/042 ,  C08J5/10 ,  C08J2363/00 ,  C08J2471/12 ,  C08J2477/02 ,  C08J2477/04 ,  C08K3/04 ,  C08K7/06 ,  C08K2201/001 ,  C08L71/12 ,  C08L101/00 ,  H01B1/24

Abstract: The present invention has the following structure to provide a prepreg that makes it possible to produce a fiber-reinforced composite material provided with both exceptional impact resistance and thickness-direction conductivity. A prepreg characterized in containing at least the following components [A] - [F], and further characterized in that the ratio Ne/Nd of the number of structures Ne of component [F] present in a range of outside 110% of the particle diameter of component [E] and the number of structures Nd of component [F] present in a range outside 110% of the particle diameter of component [D] is 0.25 or higher. [A]: Carbon fibers, [B] thermosetting resin, [C] : curing agent, [D] : particles composed mainly of thermoplastic resin having a primary particle number-average particle size of 5-50 µm, [E]: conductive particles different from component [D] and having a primary particle number-average particle size in the range of a specific expression, [F]: filler comprising a carbon material

Abstract translation: 本发明具有如下结构，即提供一种能够制造具有优异的耐冲击性和厚度方向导电性的纤维增强复合材料的预浸料坯。 一种预浸料，其特征在于至少包含以下组分[A] - [F]，其特征还在于，组分[F]的结构数Ne的比Ne / Nd存在于颗粒外部的110％范围内 成分[E]的直径以及成分[D]的粒径的110％以外的成分[F]的结构数Nd为0.25以上。 [A]：碳纤维，[B]热固性树脂，[C]：固化剂，[D]：主要由主要粒子数平均粒径为5-50μm的热塑性树脂组成的颗粒，[E]：导电 不同于成分[D]的颗粒并且具有在特定表达范围内的初级粒子数平均粒径[F]：包含碳材料的填料

公开(公告)号：EP3063212A1

公开(公告)日：2016-09-07

申请号：EP14796966.1

申请日：2014-10-28

Applicant: Blue Cube IP LLC

Inventor： SONG, Xiaomei ,  GONG, Yonghua ,  CHEN, Hongyu ,  XIAO, Tianhui ,  MULLINS, Michael J.

IPC: C08J3/24 ,  C08L9/06 ,  C08L35/06 ,  C08L63/00 ,  C08L71/12

CPC classification number: C08L25/16 ,  C08J3/24 ,  C08J5/24 ,  C08J2325/16 ,  C08J2337/00 ,  C08J2371/12 ,  C08J2425/16 ,  C08J2463/00 ,  C08J2471/12 ,  C08L9/06 ,  C08L35/06 ,  C08L37/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/035 ,  C08L2205/04 ,  C08L63/00

Abstract: A curable composition comprising a a) styrene-butadiene vinyl resin containing from 30 weight percent to 85 weight percent of 1, 2-vinyl groups and wherein styrene is present in an amount in the range of from 10 weight percent to 50 weight percent; b) a vinyl poly(phenylene ether) having a number average molecular weight in the range of from 300 to 10000; c) an aniline modified styrene-maleic anhydride copolymer; d) a multifunctional epoxy resin; and e) a flame retardant wherein, upon curing under curing conditions, the curable composition forms at least one interpenetrating network structure, is disclosed. Methods for preparing the curable composition are also disclosed, as are prepregs and laminates made therefrom.

公开(公告)号：EP2712883B1

公开(公告)日：2016-02-24

申请号：EP12776849.7

申请日：2012-04-25

Applicant: Teijin Limited

Inventor： NAKAHIRO, Takashi ,  NAKAGAWA, Dai ,  YOSHIDA, Tetsuo ,  NISHIYAMA, Masanori

IPC: C08J5/18 ,  C08J7/04 ,  B29C55/12 ,  C08L25/04

CPC classification number: C08L25/06 ,  B29C37/0025 ,  B29C55/026 ,  B29C55/143 ,  B29K2025/04 ,  B29K2071/12 ,  C08J5/18 ,  C08J2325/04 ,  C08J2471/12 ,  H01B17/56 ,  Y10T428/265 ,  Y10T428/31663 ,  Y10T428/31801 ,  Y10T428/31938

Abstract: An object of this invention is to provide a highly insulating film, which is excellent in the heat resistance and has increased breakdown voltage. This invention is a highly insulating film, which is characterized by comprising a biaxially stretched film containing a styrene polymer having a syndiotactic structure as a main component, containing a thermoplastic amorphous resin Y having a glass transition temperature Tg by DSC of 130°C or higher in an amount of 5% by mass or more and 48% by mass or less, and having a plane orientation coefficient (”P) represented by the following equation (1) of -0.027 or less. ”P=(Nx+Ny)/2-Nz (1) (Here, in the equation (1), Nx represents the minimum value of the refractive index in the plane direction of the film, Ny represents the refractive index in the direction perpendicular to Nx in the plane direction of the film, and Nz represents the refractive index in the thickness direction of the film.)

Abstract translation: 本发明的目的是提供一种耐热性优异并且具有增加的击穿电压的高绝缘性膜。 本发明是一种高度绝缘的膜，其特征在于包括含有间同立构结构作为主要成分的苯乙烯聚合物的双轴拉伸膜，其含有DSC为130℃以上的玻璃化转变温度Tg的热塑性非晶性树脂Y 其量为5质量％以上且48质量％以下，并且具有-0.027以下的由下式（1）表示的面取向系数（“P”）。 “P =（Nx + Ny）/ 2-Nz（1）（这里，在式（1）中，Nx表示膜的平面方向的折射率的最小值，Ny表示膜的折射率 在膜的平面方向垂直于Nx，Nz表示膜的厚度方向的折射率。）

公开(公告)号：EP2753657A1

公开(公告)日：2014-07-16

申请号：EP12753913.8

申请日：2012-09-04

Applicant: SAUDI BASIC INDUSTRIES CORPORATION (SABIC)

Inventor： GHAMDI, Ghurmallah ,  JANSEN, Martinus Adrianus Gertrudus ,  NELISSENM Laurentius Nicolaas Ida Hubertus

IPC: C08J9/12 ,  C08J9/20 ,  C08L25/06 ,  C08K3/34 ,  C08L71/12

CPC classification number: C08J9/20 ,  C08J9/0061 ,  C08J9/008 ,  C08J2325/06 ,  C08J2471/12 ,  C08K3/346 ,  C08L25/06 ,  C08L25/14 ,  C08L71/12

Abstract: The present invention relates to a process for the emulsifier-free preparation of water expandable polymer beads, which process comprises the steps of: a) providing an emulsifier-free starting composition comprising styrene and a polyphenylene ether resin, b) prepolymerizing the starting composition to obtain a prepolymer composition, c) adding an aqueous dispersion of a modifier-free nanoclay to the prepolymer composition to obtain an inverse emulsion, d) suspending the inverse emulsion obtained by step c) in an aqueous medium to yield an aqueous suspension of suspended droplets and e) polymerizing the monomers in the droplets of the suspension obtained by step d) to obtain the water expandable polymer beads.

公开(公告)号：EP2096646A1

公开(公告)日：2009-09-02

申请号：EP07849963.9

申请日：2007-11-26

Applicant: Sumitomo Chemical Company, Limited

Inventor： NODONO, Mitsunori

IPC: H01B13/00 ,  C08G75/23 ,  C08G81/00 ,  C08J5/22 ,  H01B1/06 ,  H01M8/02 ,  H01M8/10

CPC classification number: H01B1/122 ,  C08G65/4012 ,  C08G75/23 ,  C08J5/2256 ,  C08J2381/06 ,  C08J2387/00 ,  C08J2471/12 ,  C08L2205/05 ,  H01M8/1004 ,  H01M8/1025 ,  H01M8/1027 ,  H01M8/1032 ,  H01M8/1039 ,  H01M8/1067 ,  H01M8/1088 ,  H01M2008/1095 ,  H01M2300/0082 ,  Y02P70/56

Abstract: A method for producing a polymer electrolyte membrane including:
(i) a preparation step for preparing a polymer electrolyte solution by dissolving a polymer electrolyte containing an ion conductive polymer having an ion-exchange group in an organic solvent capable of dissolving the polymer electrolyte,
(ii) a coating step for obtaining a polymer electrolyte membrane intermediate containing the ion conductive polymer by a solution casting method using the polymer electrolyte solution obtained in the step (i), and
(iii) a washing step for washing the polymer electrolyte membrane intermediate obtained in the step (ii) by bringing the polymer electrolyte membrane intermediate into contact with a washing solvent; wherein
the concentration of the organic solvent in the washing solvent brought into contact with the polymer electrolyte membrane intermediate in the washing step (iii) is 2500 ppm by weight or lower.

Abstract translation: 一种聚合物电解质膜的制造方法，其特征在于，具备：（i）通过将含有离子交换基团的离子传导性聚合物的聚合物电解质溶解在能够溶解聚合物电解质的有机溶剂中而制备高分子电解质溶液的制备工序（ ii）通过使用在步骤（i）中获得的聚合物电解质溶液的溶液流延法获得含有离子导电聚合物的聚合物电解质膜中间体的涂覆步骤，和（iii）洗涤步骤，用于洗涤所获得的聚合物电解质膜中间体 在步骤（ii）中使聚合物电解质膜中间体与洗涤溶剂接触; 其中在洗涤步骤（iii）中与所述聚合物电解质膜中间体接触的洗涤溶剂中的有机溶剂的浓度为2500ppm重量或更低。