公开(公告)号：EP3056544B1

公开(公告)日：2018-10-10

申请号：EP14891459.1

申请日：2014-08-11

Applicant: Shengyi Technology Co. Ltd.

Inventor： CHEN, Guangbing ,  ZENG, Xianping

IPC: C08L71/12 ,  C08L83/07 ,  C08J5/24 ,  B32B27/04 ,  B32B15/08 ,  H05K1/03

CPC classification number: C08L71/126 ,  B32B15/08 ,  B32B27/04 ,  C08J5/24 ,  C08J2371/12 ,  C08J2483/04 ,  C08L71/12 ,  C09D171/12 ,  H05K1/03 ,  H05K1/038

Abstract: The present invention discloses a resin composition, comprising an unsaturated thermosetting modified polyphenylether resin and an MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit). The present invention further discloses a high-frequency circuit substrate prepared from the aforesaid resin composition and the uses of the aforesaid resin composition in the art. The high frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interstratified adhesive force, a low dielectric constant and a low dielectric loss tangent, and are very suitable as the circuit substrates of high frequency electronic equipments.

公开(公告)号：EP3309193A1

公开(公告)日：2018-04-18

申请号：EP16807591.9

申请日：2016-06-10

Applicant: KYOCERA Corporation

Inventor： OKAMURA,Kouki ,  IMAGAWA,Kazuki

IPC: C08J5/18 ,  C08L67/02 ,  C08L71/12 ,  H01G4/18 ,  H02M7/48

CPC classification number: C08L71/123 ,  B60L11/1803 ,  B60L2210/40 ,  C08G65/002 ,  C08J5/18 ,  C08J2367/02 ,  C08J2371/12 ,  C08J2467/02 ,  C08J2471/12 ,  C08L67/02 ,  C08L71/12 ,  C08L2203/20 ,  H01G4/14 ,  H01G4/18 ,  H01G4/228 ,  H01G4/33 ,  H01G4/38 ,  H01G4/40 ,  H02M7/48 ,  H02M7/5387 ,  H02P27/06

Abstract: A composite resin material (1) including: a first organic resin having a phenylene ether structure; and a second organic resin having a main skeleton composed of a polyester structure, one of the first organic resin and the second organic resin forming a continuous phase (2), the other one thereof being present within the continuous phase (2), as organic resin particles (3) having an average particle diameter of 1 µm or less.

Abstract translation: 一种复合树脂材料（1），其包含：具有亚苯​​基醚结构的第一有机树脂; 和具有由聚酯结构构成的主骨架的第二有机树脂，第一有机树脂和第二有机树脂中的一种形成连续相（2），另一种存在于连续相（2）内，作为有机物 树脂粒子（3）的平均粒径为1μm以下。

公开(公告)号：EP3127936B1

公开(公告)日：2018-03-21

申请号：EP15772464.2

申请日：2015-04-06

Applicant: Hitachi Chemical Co., Ltd.

Inventor： MIZUNO, Yasuyuki ,  FUKUDA, Tomio ,  TANIGAWA, Takao ,  NAGAI, Yuki ,  MURAI, Hikari

IPC: C08G65/48 ,  C08J5/24 ,  C08K3/00 ,  C08K5/3415 ,  C08L63/00 ,  C08L71/12 ,  C08L79/04 ,  H05K1/03 ,  C08L63/04 ,  C08G73/10 ,  C09D171/12

CPC classification number: C08G65/485 ,  C08G65/48 ,  C08G73/1071 ,  C08J5/24 ,  C08J2371/12 ,  C08J2400/24 ,  C08K3/00 ,  C08K5/3415 ,  C08L63/00 ,  C08L63/04 ,  C08L71/12 ,  C08L71/126 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/20 ,  C09D171/12 ,  H05K1/0326 ,  H05K1/0373

Abstract: A polyphenylene ether derivative having at least one N-substituted maleimide group represented by the following general formula (I) in a molecule, and a heat curable resin composition, a prepreg, a metal-clad laminate, and a multilayer printed wiring board, each of which uses the polyphenylene ether derivative: wherein R 1 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, R 2 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A 1 represents a residual group represented by a specific general formula, m is an integer of 1 or more as the number of the structural unit, and x and y each is an integer of 1 to 4.

公开(公告)号：EP3219758A1

公开(公告)日：2017-09-20

申请号：EP14906062.6

申请日：2014-12-02

Applicant: Shengyi Technology Co., Ltd.

Inventor： LI, Hui ,  FANG, Kehong

IPC: C08L63/00 ,  C08L71/12 ,  C08L35/06 ,  B32B27/04 ,  C08J5/24 ,  H05K1/03

CPC classification number: B32B27/38 ,  B32B27/04 ,  B32B27/285 ,  B32B27/302 ,  B32B2260/046 ,  B32B2307/306 ,  B32B2371/00 ,  B32B2457/08 ,  C08G59/3218 ,  C08G61/02 ,  C08G73/065 ,  C08G2261/724 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2379/04 ,  C08J2425/08 ,  C08J2435/06 ,  C08J2463/00 ,  C08J2471/10 ,  C08J2471/12 ,  C08L61/14 ,  C08L63/00 ,  C08L79/04 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/035 ,  H05K1/024 ,  H05K1/03 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08K3/36 ,  C08L35/06 ,  C08L71/12

Abstract: A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

Abstract translation: 一种热固性树脂组合物和由其制备的预浸料坯和层压板。 该热固性树脂组合物含有以下重量份数的组分：氰酸酯50-150份; 30-100份环氧树脂; 5-70份苯乙烯 - 马来酸酐; 20-100份聚苯醚; 30-100份无卤阻燃剂; 0.05-5份固化促进剂; 和50-200份填料。 从热固性树脂组合物制得的预浸料和层压板具有综合性能，如低介电常数，低介电损耗，优良的阻燃性，耐热性和耐湿性等，并且适合用于在无卤素 高频多层电路板。

公开(公告)号：EP2971434A4

公开(公告)日：2017-03-15

申请号：EP14779751

申请日：2014-03-11

Applicant: BAKER HUGHES INC

Inventor： BENES MICHAL ,  REN JIAXIANG

IPC: E21B10/00 ,  B29C43/00 ,  C08J3/24 ,  C08J3/28 ,  C08J7/12

CPC classification number: C08J7/123 ,  C08J3/243 ,  C08J3/244 ,  C08J3/245 ,  C08J3/28 ,  C08J2365/02 ,  C08J2371/00 ,  C08J2371/12 ,  C08J2379/08 ,  C08J2381/04 ,  C08J2381/06

公开(公告)号：EP3063212A1

公开(公告)日：2016-09-07

申请号：EP14796966.1

申请日：2014-10-28

Applicant: Blue Cube IP LLC

Inventor： SONG, Xiaomei ,  GONG, Yonghua ,  CHEN, Hongyu ,  XIAO, Tianhui ,  MULLINS, Michael J.

IPC: C08J3/24 ,  C08L9/06 ,  C08L35/06 ,  C08L63/00 ,  C08L71/12

CPC classification number: C08L25/16 ,  C08J3/24 ,  C08J5/24 ,  C08J2325/16 ,  C08J2337/00 ,  C08J2371/12 ,  C08J2425/16 ,  C08J2463/00 ,  C08J2471/12 ,  C08L9/06 ,  C08L35/06 ,  C08L37/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/035 ,  C08L2205/04 ,  C08L63/00

Abstract: A curable composition comprising a a) styrene-butadiene vinyl resin containing from 30 weight percent to 85 weight percent of 1, 2-vinyl groups and wherein styrene is present in an amount in the range of from 10 weight percent to 50 weight percent; b) a vinyl poly(phenylene ether) having a number average molecular weight in the range of from 300 to 10000; c) an aniline modified styrene-maleic anhydride copolymer; d) a multifunctional epoxy resin; and e) a flame retardant wherein, upon curing under curing conditions, the curable composition forms at least one interpenetrating network structure, is disclosed. Methods for preparing the curable composition are also disclosed, as are prepregs and laminates made therefrom.

公开(公告)号：EP2940065A4

公开(公告)日：2016-08-24

申请号：EP13868075

申请日：2013-12-06

Applicant: TORAY INDUSTRIES

Inventor： TAKEBE YOSHIKI ,  KIHARA HIROKI ,  HIRANO NORIYUKI

IPC: C08J5/06 ,  B29C43/02 ,  B29C43/18 ,  B29C45/14 ,  B29C65/70 ,  B29C70/34 ,  B29K101/12 ,  B29K105/08 ,  B29K105/12 ,  B29K307/04 ,  B29L31/34 ,  B32B5/02 ,  B32B27/12 ,  B32B27/34 ,  B32B27/36 ,  C08J5/04 ,  C08J5/24 ,  C08K7/06

CPC classification number: C08J5/042 ,  B29C43/18 ,  B29C43/305 ,  B29C45/0005 ,  B29C45/14311 ,  B29C45/14786 ,  B29C70/021 ,  B29C70/345 ,  B29K2101/12 ,  B29K2105/12 ,  B29K2307/04 ,  B29L2031/3481 ,  B32B5/022 ,  B32B27/12 ,  B32B27/34 ,  B32B27/365 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2307/538 ,  B32B2307/542 ,  B32B2605/00 ,  B32B2605/003 ,  C08J5/04 ,  C08J5/24 ,  C08J2300/22 ,  C08J2323/12 ,  C08J2369/00 ,  C08J2371/12 ,  C08J2377/02 ,  C08J2377/06 ,  C08J2381/04 ,  C08K7/06

Abstract: A fiber-reinforced resin sheet and an integrally molded article are provided. The fiber-reinforced resin sheet comprises a nonwoven fabric made of reinforcing fibers having a thermoplastic resin (A) impregnated on one side of the nonwoven fabric. The fiber-reinforced resin sheet satisfies any one of the following conditions (I) and (II): (I) the nonwoven fabric has an area wherein the reinforcing fibers constituting the nonwoven fabric are exposed on the other side in the thickness direction of the nonwoven fabric, and (II) the nonwoven fabric has a thermoplastic resin (B) impregnated on the other side in thickness direction of the nonwoven fabric, and the nonwoven fabric has a reinforcing fiber volume ratio Vfm of up to 20% by volume, and wherein the thermoplastic resin (A) and the thermoplastic resin (B) form an interface layer in the sheet, and the interface layer has a concave-convex shape with a maximum height Ry of at least 50 µm and an average roughness Rz of at least 30 µm.

公开(公告)号：EP2971434A1

公开(公告)日：2016-01-20

申请号：EP14779751.8

申请日：2014-03-11

Applicant: Baker Hughes Incorporated

Inventor： BENES, Michal ,  REN, Jiaxiang

IPC: E21B10/00 ,  B29C43/00

CPC classification number: C08J7/123 ,  C08J3/243 ,  C08J3/244 ,  C08J3/245 ,  C08J3/28 ,  C08J2365/02 ,  C08J2371/00 ,  C08J2371/12 ,  C08J2379/08 ,  C08J2381/04 ,  C08J2381/06

Abstract: A method of forming a modified thermoplastic structure for a down-hole application comprises forming a thermoplastic structure comprising at least one thermoplastic material formulated for crosslinking using an electron beam process. The thermoplastic structure is exposed to at least one electron beam to crosslink polymer chains of the thermoplastic structure. Other methods of forming a modified thermoplastic structure, and a down-hole tool are also described.

公开(公告)号：EP2167572B1

公开(公告)日：2015-08-26

申请号：EP08776477.5

申请日：2008-06-24

Applicant: SABIC Global Technologies B.V.

Inventor： THIAGARAJAN, Chinniah ,  CHATTERJEE, Gautam ,  SRIRAMAN, Ravi ,  RAJENDRAN, Santhosh Kumar ,  VAIDYALINGAM, Anand

IPC: C08J9/04 ,  C08L101/02

CPC classification number: C08J9/04 ,  C08J2201/03 ,  C08J2300/10 ,  C08J2300/106 ,  C08J2367/03 ,  C08J2369/00 ,  C08J2371/12 ,  Y10T428/249921 ,  Y10T428/249978 ,  Y10T428/249979 ,  Y10T428/249986

公开(公告)号：EP2712892A4

公开(公告)日：2015-07-01

申请号：EP12788767

申请日：2012-05-18

Applicant: ASAHI KASEI CHEMICALS CORP

Inventor： EGUCHI YUTAKA ,  SAKATA MINORU ,  FURUKAWA HIROAKI

IPC: C08L71/12 ,  B32B27/00 ,  B32B27/18 ,  C08K5/521 ,  C08L27/12 ,  C08L27/18 ,  H01L31/042 ,  H01L31/049

CPC classification number: C08L27/18 ,  B32B27/285 ,  B32B2307/3065 ,  B32B2457/10 ,  C08J5/18 ,  C08J2371/12 ,  C08J2427/18 ,  C08K5/0066 ,  C08K5/49 ,  C08L71/12 ,  H01L31/049 ,  Y02E10/50

Abstract: An object of the present invention is to provide a flame-retardant resin composition having high flame retardancy, and a flame-retardant resin film having high thickness precision and excellent flame retardancy and a solar battery back sheet. The flame-retardant resin film according to the present invention is a flame-retardant resin film obtained from a resin composition, wherein the resin composition comprises a polyphenylene ether resin (a), a phosphorus flame retardant (b), and a fluorine-containing resin (c); in the resin composition, the content of the component (a) is 75 to 98 parts by mass and the content of the component (b) is 25 to 2 parts by mass, based on 100 parts by mass of the components (a) and (b) in total; the content of a fluorine element in the resin composition is 100 to 1000 mass ppm; and the flame-retardant resin film has a thickness of 20 to 500 µm.