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公开(公告)号：EP1012547A1
公开(公告)日：2000-06-28
申请号：EP98908587.3
申请日：1998-02-19
IPC分类号： G01H11/06
CPC分类号： B81B3/0072 , B81B2201/0257 , B81B2203/0127 , G01H11/06 , H04R7/16 , H04R19/005 , H04R31/006
摘要： Multiple embodiments of a solid state condenser transducer, and methods of manufacture, are disclosed. The transducer (10) comprises a semi-conductor substrate forming a frame (11) and having an opening, a thin-film cantilever structure (12) forming a diaphragm extending over a portion of the opening, the structure having a proximal portion and a distal portion. The proximal portion is attached to the frame, and the distal portion extends over a portion of the frame. A variable gap capacitor (14) having a movable plate and a fixed plate is provided, wherein the movable plate is disposed on the distal portion of the structure and the fixed plate is disposed on the frame adjacent the movable plate.
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公开(公告)号：EP0940059B1
公开(公告)日：2005-01-26
申请号：EP97948325.2
申请日：1997-11-20
CPC分类号： H04R17/02 , H04R25/604 , H04R2225/49
摘要： A housing for shielding a transducer of the type mounted on a silicon die attached to a flexible circuit. The housing provides a jacket which protects the silicon die from physical damage. The jacket, in cooperation with the top and bottom cups, further provides a shield for the silicon die from light and electromagnetic interferences. An acoustic port located on the top portion of the jacket furnishes the means by which acoustic energy enters the jacket to contact the transducer. A back cavity, formed between the bottom cup and the silicon die, serves as the acoustic pressure reference which allows the microphone to function properly.
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公开(公告)号：EP1466500A1
公开(公告)日：2004-10-13
申请号：EP02797046.6
申请日：2002-10-15
CPC分类号： B81B3/0072 , B81B2201/0257 , B81B2203/0127 , H04R19/005
摘要： A solid-state transducer is disclosed. The transducer comprises a semi-conductor substrate forming a support structure and having an opening. A thin-film structure forming a diaphragm responsive to fluid-transmitted acoustic pressure is disposed over the opening. The transducer further includes a plurality of semi-conductor supports and tangential arms extending from the diaphragm edge for connecting the periphery of the diaphragm to the supports. The tangential arms permit the diaphragm to rotate relative to the supports to relieve film stress in the diaphragm. The transducer still further includes a plurality of stop bumps disposed between the substrate the diaphragm. The stop bumps determine the separation of the diaphragm from the substrate when the transducer is biased.
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4.发明公开
公开(公告)号：EP1183906A1
公开(公告)日：2002-03-06
申请号：EP00919700.5
申请日：2000-03-27
CPC分类号： H04R19/04 , H04R25/00 , H04R2225/49
摘要： A microphone is disclosed having a case (512, 514), a motor die (518), and an integrated circuit die (526). The case defines a chamber. The motor die (518) is operably attached to the case within the chamber and partitions the chamber into a first compartment and a second compartment wherein the volume of the first compartment is larger than the volume of the second compartment. Furthermore, the integrated circuit die (526) is housed within the first compartment and operably connected to the motor die (518).
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公开(公告)号：EP0760179B1
公开(公告)日：2004-04-14
申请号：EP95920472.8
申请日：1995-05-19
CPC分类号： H03F3/183 , H03F3/505 , H03F2200/03 , H03F2200/222 , H03H11/28 , H03H11/30 , H04R25/502
摘要： An impedance matching, reducing, or buffering circuit for permitting smooth signal flow from a first transmission medium to a second transmission medium. The circuit provides a first node adapted for coupling to the first transmission medium and for receiving a signal from the first transmission medium. The circuit further provides a buried channel transistor, that is coupled to the first node and that is biased by additional circuit devices, for transforming the impedance imposed on the signal. The use of the buried mode transistor reduces noise on the surface of the transistor while at the same time keeps other performance standards high. The circuit additionally provides a second node that is coupled to the buried channel transistor and that is adapted for coupling to the second transmission medium for conveying the signal to the second transmission medium.
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公开(公告)号：EP1310136A2
公开(公告)日：2003-05-14
申请号：EP01959715.2
申请日：2001-08-10
IPC分类号： H04R19/00
CPC分类号： H04R19/005 , H04R31/00 , H04R31/006
摘要： Multiple embodiments of solid state micro-structures, such as a condenser microphone, are disclosed. According to one embodiment, the transducer a fixed perforated member, a freely movable diaphragm spaced from the perforated member, a support ring in the perforated member maintaining the proper spacing between the diaphragm and the perforated member near the perimeter; and compliant suspension springs allowing the diaphragm to rest freely on the support ring and yet mechanically decouples the diaphragm from the perforated member. According to another embodiment, a raised micro-structure is disclosed for use in a silicon based device. The raised micro-structure comprises a generally planar film having a ribbed sidewall supporting the film.
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公开(公告)号：EP3039885A1
公开(公告)日：2016-07-06
申请号：EP14839160.0
申请日：2014-08-28
发明人： LOEPPERT, Peter, V. , LEE, Sung
IPC分类号： H04R19/04
CPC分类号： H04R7/08 , H04R7/20 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2307/027
摘要： The claim invention is directed at a MEMS microphone die fabricated using CMOS-based technologies. In particular, the claims are directed at various aspects of a MEMS microphone die having anisotropic springs, a backplate, a diaphragm, mechanical stops, and a support structure, all of which are fabricated as stacked metallic layers separated by vias using CMOS fabrication technologies.
摘要翻译： 本发明涉及使用基于CMOS的技术制造的MEMS麦克风模具。 特别地，权利要求涉及具有各向异性弹簧，背板，隔膜，机械止动件和支撑结构的MEMS麦克风管芯的各个方面，所有这些都被制造为使用CMOS制造技术由通孔隔开的堆叠金属层。
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公开(公告)号：EP1466500B1
公开(公告)日：2009-02-11
申请号：EP02797046.6
申请日：2002-10-15
CPC分类号： B81B3/0072 , B81B2201/0257 , B81B2203/0127 , H04R19/005
摘要： A solid-state transducer is disclosed. The transducer comprises a semi-conductor substrate forming a support structure and having an opening. A thin-film structure forming a diaphragm responsive to fluid-transmitted acoustic pressure is disposed over the opening. The transducer further includes a plurality of semi-conductor supports and tangential arms extending from the diaphragm edge for connecting the periphery of the diaphragm to the supports. The tangential arms permit the diaphragm to rotate relative to the supports to relieve film stress in the diaphragm. The transducer still further includes a plurality of stop bumps disposed between the substrate the diaphragm. The stop bumps determine the separation of the diaphragm from the substrate when the transducer is biased.
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公开(公告)号：EP1310136B1
公开(公告)日：2006-03-22
申请号：EP01959715.2
申请日：2001-08-10
IPC分类号： H04R19/00
CPC分类号： H04R19/005 , H04R31/00 , H04R31/006
摘要： Multiple embodiments of solid state micro-structures, such as a condenser microphone, are disclosed. According to one embodiment, the transducer a fixed perforated member, a freely movable diaphragm spaced from the perforated member, a support ring in the perforated member maintaining the proper spacing between the diaphragm and the perforated member near the perimeter; and compliant suspension springs allowing the diaphragm to rest freely on the support ring and yet mechanically decouples the diaphragm from the perforated member. According to another embodiment, a raised micro-structure is disclosed for use in a silicon based device. The raised micro-structure comprises a generally planar film having a ribbed sidewall supporting the film.
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公开(公告)号：EP1012547B1
公开(公告)日：2004-05-06
申请号：EP98908587.3
申请日：1998-02-19
IPC分类号： G01H11/06
CPC分类号： B81B3/0072 , B81B2201/0257 , B81B2203/0127 , G01H11/06 , H04R7/16 , H04R19/005 , H04R31/006
摘要： Multiple embodiments of a solid state condenser transducer, and methods of manufacture, are disclosed. The transducer (10) comprises a semi-conductor substrate forming a frame (11) and having an opening, a thin-film cantilever structure (12) forming a diaphragm extending over a portion of the opening, the structure having a proximal portion and a distal portion. The proximal portion is attached to the frame, and the distal portion extends over a portion of the frame. A variable gap capacitor (14) having a movable plate and a fixed plate is provided, wherein the movable plate is disposed on the distal portion of the structure and the fixed plate is disposed on the frame adjacent the movable plate.
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