ACOUSTIC SENSOR AND CAPACITIVE TRANSDUCER
    1.
    发明公开

    公开(公告)号:EP3334184A1

    公开(公告)日:2018-06-13

    申请号:EP17198739.9

    申请日:2017-10-27

    申请人: Omron Corporation

    发明人: UCHIDA, Yuki

    IPC分类号: H04R19/00 H04R19/01 H04R1/28

    摘要: Provided is a technique by which, when excessive pressure acts on an acoustic sensor, an increase in pressure in a casing is prevented to suppress excessive transformation of a vibration electrode film caused by the increased pressure. An acoustic sensor is provided with: a substrate; a back plate having sound holes that allow passage of air; a vibration electrode film disposed so as to face the back plate; and a package configured to house the substrate, the back plate, and the vibration electrode film, and having a pressure hole that allows inflow of air. The acoustic sensor is further provided with a projection configured to block a flow path for air (inhibit a flow of air) that passes through a gap between the vibration electrode film and the back plate, and a sound hole, when the vibration electrode film is transformed to come close to the back plate.

    MEMS device with central anchor for stress isolation
    8.
    发明公开
    MEMS device with central anchor for stress isolation 有权
    与中央锚应变隔离MEMS器件

    公开(公告)号:EP2514712A3

    公开(公告)日:2014-07-23

    申请号:EP12162868.9

    申请日:2012-04-02

    IPC分类号: B81B3/00

    摘要: A MEMS device (20) includes a proof mass (32) coupled to and surrounding an immovable structure (30). The immovable structure (30) includes fixed fingers (36, 38) extending outwardly from a body (34) of the structure (30). The proof mass (32) includes movable fingers (60), each of which is disposed between a pair (62) of the fixed fingers (36, 38). A central area (42) of the body (34) is coupled to an underlying substrate (24), with the remainder of the immovable structure (30) and the proof mass (32) being suspended above the substrate (24) to largely isolate the MEMS device (20) from package stress. Additionally, the MEMS device (20) includes isolation trenches (80) and interconnects (46, 50, 64) so that the fixed fingers (36), the fixed fingers (38), and the movable fingers (60) are electrically isolated from one another to yield a differential device configuration.

    ABLÖSBARE MIKRO- UND NANOBAUTEILE FÜR PLATZSPARENDEN EINSATZ
    9.
    发明公开
    ABLÖSBARE MIKRO- UND NANOBAUTEILE FÜR PLATZSPARENDEN EINSATZ 审中-公开
    移动微纳米组件节省空间的应用

    公开(公告)号:EP2678265A2

    公开(公告)日:2014-01-01

    申请号:EP12710454.5

    申请日:2012-02-24

    申请人: Harting KGAA

    IPC分类号: B81B3/00

    摘要: The invention relates to space-saving micro- and nano-components and to methods for producing same. The components are characterized in that they do not comprise a rigid substrate having a considerable thickness. The mechanical stresses, which result in deformations and/or warpage within a component, are compensated by means of a mechanically stress-compensated design and/or by means of active mechanical stress compensation by depositing suitable stress compensation layers such that there is no need for relatively thick substrates. Thus, the overall thickness of the components is decreased and the integration options thereof in technical systems are improved. In addition, the field of application of such components is expanded.

    MECHANICAL LAYER AND METHODS OF SHAPING THE SAME
    10.
    发明公开
    MECHANICAL LAYER AND METHODS OF SHAPING THE SAME 审中-公开
    机械层和形成方法

    公开(公告)号:EP2550232A2

    公开(公告)日:2013-01-30

    申请号:EP11714150.7

    申请日:2011-03-15

    IPC分类号: B81B3/00

    摘要: Mechanical layers and methods of shaping mechanical layers are disclosed. In one embodiment, a method includes depositing a support layer (85), a sacrificial layer (84) and a mechanical layer (34) over a substrate (20), and forming a support post (60) from the support layer. A kink (90) is formed adjacent to the support post in the mechanical layer. The kink comprises a rising edge (91) and a falling edge (92), and the kink is configured to control the shaping and curvature of the mechanical layer upon removal of the sacrificial layer.