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公开(公告)号:EP3380329A2
公开(公告)日:2018-10-03
申请号:EP16801437.1
申请日:2016-11-23
申请人: Koenig & Bauer AG
IPC分类号: B41F19/00 , B26F1/10 , B41G7/00 , B41F7/06 , B41F19/06 , B41F21/00 , B41F21/10 , B41F27/02 , B41F30/02 , B65H29/24 , B65H5/22 , B26D7/18 , B26F1/38
CPC分类号: B41F19/008 , B26D1/405 , B26D7/018 , B26D7/18 , B26D7/1854 , B26D7/265 , B26D2007/2607 , B26F1/0092 , B26F1/10 , B26F1/384 , B26F2001/4418 , B31B50/146 , B31B50/16 , B31B50/256 , B31B50/83 , B31B50/88 , B31B70/146 , B31B70/16 , B31B70/256 , B31B70/826 , B31B70/83 , B31B70/88 , B31B2120/70 , B31F1/07 , B31F1/10 , B41F7/06 , B41F19/004 , B41F19/062 , B41F21/00 , B41F21/102 , B41F27/02 , B41F30/02 , B41G7/00 , B41G7/006 , B41P2200/22 , B41P2217/11 , B65H3/08 , B65H5/226 , B65H29/242 , B65H29/243 , B65H29/56 , B65H31/10 , B65H33/04 , B65H33/12 , B65H2301/4217 , B65H2301/44735 , B65H2301/4474 , B65H2406/323 , B65H2801/21 , B65H2801/31 , F01L7/02 , B65H2220/01 , B65H2220/02
摘要: The invention relates to a method and a device for treating substrates. The aim of the invention is to provide a method and a device for treating substrates which are modular and versatile in use. The aim is achieved in that a device for treating substrates (1) comprises a feeder (7) and one or more first sub-structure modules (100) which each comprise a pressure cylinder (41) with means for fixing a lift (5) and a sheet-conveying device and one or more second sub-structure modules (101) which respectively have a transport cylinder (3) with openings (12) formed in the cover surface thereof, and means for fixing a lift (5) and a sheet conveying device. All first and second sub-structure modules (100, 101) have the same intersection points for connecting the sub-structure modules (100, 101) on the inlet and/or exit side and can be equipped and/or are equipped with an attachment module.
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公开(公告)号:EP3380285A2
公开(公告)日:2018-10-03
申请号:EP16804728.0
申请日:2016-11-23
申请人: Koenig & Bauer AG
CPC分类号: B26D7/1863 , B26D1/405 , B26D7/018 , B26D7/18 , B26D7/1854 , B26D7/265 , B26D2007/2607 , B26F1/0092 , B26F1/384 , B26F1/44 , B26F2001/4418 , B31B50/146 , B41F19/001 , B41F19/007 , B41F19/008 , B41F19/062 , B65H20/00 , B65H20/12
摘要: The invention relates to a device and a method for processing substrates using a separation system. The problem addressed by the invention is that of providing a device and a method for processing substrates, which permit the separation of processed substrates into one or more waste parts and at least one useful part. In particular, the object of the invention is that of providing a device and a method, which have improved flexibility, for processing substrates. The problem is solved in that: the separation system (2) comprises a transport cylinder (3) and a stripping cylinder (4) associated therewith; the transport cylinder (3) has first openings (12) and a detachably secured pick-up element (5) comprising depressions in which holes are formed, at least one hole covering at least one first opening (12); and the stripping cylinder (4) has a detachably secured pick-up element (5) with protruding regions that correspond to the depressions.
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