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公开(公告)号:EP3736560A1
公开(公告)日:2020-11-11
申请号:EP20734314.6
申请日:2020-01-21
发明人: KIM, Jong Hwan , PARK, Juyoun , HWANG, Ye Won , PARK,Jin Man , LEE, Seung Jae , CHOI, Tae Min , YOO, Yong Ho , LEE, Duk Young
摘要: A substrate inspection apparatus generates, when anomalies of a plurality of second solder pastes among a plurality of first solder pastes printed on a first substrate is detected, at least one image indicating a plurality of second solder pastes with anomalies detected by using an image about a first substrate, applies the at least one image to a machine-learning-based model, acquires a plurality of first values indicating relevance of respective first fault types to the at least one image and a plurality of first images indicating regions associated with one of a plurality of first fault types, determines a plurality of second fault types, which are associated with the plurality of second solder pastes by using the plurality of first values and the plurality of first images, and determines at least one third solder paste, which is associated with the respective second fault types.