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1.发明公开
公开(公告)号：EP3736560A1
公开(公告)日：2020-11-11
申请号：EP20734314.6
申请日：2020-01-21
发明人： KIM, Jong Hwan , PARK, Juyoun , HWANG, Ye Won , PARK,Jin Man , LEE, Seung Jae , CHOI, Tae Min , YOO, Yong Ho , LEE, Duk Young
摘要： A substrate inspection apparatus generates, when anomalies of a plurality of second solder pastes among a plurality of first solder pastes printed on a first substrate is detected, at least one image indicating a plurality of second solder pastes with anomalies detected by using an image about a first substrate, applies the at least one image to a machine-learning-based model, acquires a plurality of first values indicating relevance of respective first fault types to the at least one image and a plurality of first images indicating regions associated with one of a plurality of first fault types, determines a plurality of second fault types, which are associated with the plurality of second solder pastes by using the plurality of first values and the plurality of first images, and determines at least one third solder paste, which is associated with the respective second fault types.
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公开(公告)号：EP3993591A1
公开(公告)日：2022-05-04
申请号：EP21169281.9
申请日：2021-04-20
发明人： LEE, Duk Young , LEE, Jae Hwan , TAK, Jin Hyung , PARK, Chan Woo , HAN, Guk
摘要： The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.
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3.发明公开
公开(公告)号：EP3634101A1
公开(公告)日：2020-04-08
申请号：EP19812895.1
申请日：2019-06-28
摘要： A method for determining a cause of a mounting failure for a component mounted on a substrate, which is performed by an electronic apparatus, comprises: receiving an inspection result of a mounting failure for each of a plurality of first components determined by inspecting a plurality of substrates of a first type; calculating a mounting failure rate of each of the plurality of first components using the inspection result; determining a plurality of second components in which a mounting failure has occurred based on the mounting failure rate; and determining a cause of the mounting failure for each of the plurality of second components as at least one of a component mounting position setting error, a mounting condition setting error according to a component type and a defect of a nozzle, based on the mounting failure rate of each of the plurality of first components.
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公开(公告)号：EP3530463A1
公开(公告)日：2019-08-28
申请号：EP18215551.5
申请日：2018-12-21
发明人： LEE, Duk Young , PARK, Chan Woo , CHOI, Tae Min , HONG, Joanna
摘要： An apparatus, a recording medium, and a method for generating a control parameter of a screen printer (110) are disclosed. The apparatus includes a memory (122) that stores a simulation model configured to derive predictive inspection information on a printed state of solder paste based on a plurality of control parameters of the screen printer; a communication circuit (123) configured to receive first inspection information on a plurality of solder pastes printed by the screen printer based on a first control parameter, and a processor (124) electrically connected to the memory and the communication circuit. The processor obtains first predictive inspection information by applying the first control parameter to the simulation model, generates a plurality of candidate control parameters based on the first predictive inspection information, determines a plurality of second control parameters among the candidate control parameters, and transmits the plurality of second control parameters to the screen printer via the communication circuit.
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公开(公告)号：EP4068137A1
公开(公告)日：2022-10-05
申请号：EP21812422.0
申请日：2021-05-31
发明人： HAN, Guk , LEE, Jae Hwan , LEE, Duk Young , PARK, Chan Woo
IPC分类号： G06F30/20 , G06F119/22 , G06F115/12
摘要： An electronic apparatus according to various embodiments of the present disclosure may include: a communication circuit that is communicatively connected to a solder printing apparatus and a measurement apparatus; one or more memories; and one or more processors. One or more processors may be configured to: acquire a first control parameter set of the solder printing apparatus for printing solder on a first substrate; transmit information indicating the first control parameter set to the solder printing apparatus; acquire first solder measurement information indicating a state of the solder printed on the first substrate; determine a first yield for the first substrate based on the first solder measurement information; and generate a model for searching for an optimal control parameter set based on a first data pair including the first control parameter set and the first yield.
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6.发明公开
公开(公告)号：EP3993593A1
公开(公告)日：2022-05-04
申请号：EP21163897.8
申请日：2021-03-22
发明人： LEE, Duk Young , LEE, Jun Ho , LEE, Jae Hwan
IPC分类号： H05K13/08
摘要： The apparatus according to various embodiments includes one or more processors, and one or more memories operatively connected to the one or more processors. The one or more memories may store instructions that, when executed, cause the one or more processors to acquire a plurality of first position offsets of a plurality of first components respectively mounted on a plurality of first substrates with respect to a plurality of pads of the plurality of first substrates corresponding to the plurality of first components from the optical measurement device, set a range of a normal state for a component position offset based on the plurality of first position offsets, generate a control signal for adjusting at least one control parameter of the component mounting device associated with a component mounting position based on the range of the normal state, and transmit the control signal to the component mounting device.
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公开(公告)号：EP3687272A1
公开(公告)日：2020-07-29
申请号：EP19817118.3
申请日：2019-11-27
IPC分类号： H05K13/08
摘要： An electronic apparatus including a display and one or more processor is disclosed. The one or more processor is configured to: divide a first error value of each of a plurality of first components with respect to a mounting position acquired through inspection of a plurality of substrates of a first type, into a plurality of error values, generate a graph of a tree structure including a plurality of nodes corresponding to the plurality of first components, component types of each of the plurality of first components and a plurality of components included in a mounter, adjust attributes of each of the plurality of nodes using the plurality of error values divided from the first error value of each of the plurality of first components, and display the graph in which the attributes of each of the plurality of nodes are adjusted, on the display.
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公开(公告)号：EP3501828B1
公开(公告)日：2020-02-12
申请号：EP17210425.9
申请日：2017-12-22
发明人： NOH, Jeong Kyu , LEE, Jae Hwan , LEE, Duk Young
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公开(公告)号：EP3501829A1
公开(公告)日：2019-06-26
申请号：EP17210436.6
申请日：2017-12-22
发明人： KIM, Jae Hyung , NOH, Jeong Kyu , LEE, Jae Hwan , LEE, Duk Young
摘要： A printed circuit board inspection apparatus (100) generates at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board, obtains at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, and determines a fault type associated with the at least one solder paste in which the anomaly is detected from at least one fault type, based on the obtained at least one value.
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10.发明公开
公开(公告)号：EP3501828A1
公开(公告)日：2019-06-26
申请号：EP17210425.9
申请日：2017-12-22
发明人： NOH, Jeong Kyu , LEE, Jae Hwan , LEE, Duk Young
CPC分类号： G01R31/28 , B41F15/26 , B41F33/0027 , B41F33/0036 , B41F33/0045 , G01N21/8806 , G06T7/0004 , G06T2207/20081 , G06T2207/30141 , G06T2207/30152 , H05K1/0268 , H05K1/0269 , H05K3/34 , H05K3/3484 , H05K13/08
摘要： A printed circuit board inspection apparatus (100) obtains measurement shape information about each of a plurality of solder pastes printed on a first printed circuit board through a plurality of apertures and aperture shape information about each of the plurality of apertures, obtains probability values that a first solder paste printed through a first aperture of the plurality of apertures and each of a plurality of second solder pastes printed through second apertures other than the first aperture of the plurality of apertures have the measurement shape information when the first solder paste and the plurality of second solder pastes are printed on the first printed circuit board, by applying the measurement shape information and the aperture shape information to a machine-learning based model, and detects whether an anomaly in the first solder paste occurred based on the probability values.
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