LIGHT-EMITTING ARRANGEMENT
    3.
    发明公开
    LIGHT-EMITTING ARRANGEMENT 审中-公开
    LICHTEMITTIERENDE ANORDNUNG

    公开(公告)号:EP2337986A1

    公开(公告)日:2011-06-29

    申请号:EP09787151.1

    申请日:2009-09-09

    IPC分类号: F21K99/00

    摘要: The invention relates to a light-emitting arrangement comprising a printed circuit board, PCB, having at least one electrically and thermally conductive portion, a light-emitting diode, LED, being thermally connected to the at least one electrically and thermally conductive portion by at least one contact of the LED, and a heat release member for dissipating heat generated by the LED, the heat release member being thermally connected to the at least one electrically and thermally conductive portion, wherein the heat generated by the LED is transferred along a heat transfer path extending from the LED via the at least one contact and the at least one electrically and thermally conductive portion to the heat release member. The light-emitting arrangement according to the invention provides greatly improved heat removal from the LED while using a low-cost glass-epoxy material for the PCB.

    摘要翻译: 本发明涉及一种发光装置,其包括具有至少一个导电和导热部分的印刷电路板,PCB,发光二极管,LED,通过以下方式与所述至少一个导电和导热部分热连接 LED的至少一个触点和用于散发由LED产生的热量的散热构件,散热构件热连接到至少一个导热部分,其中由LED产生的热量沿着热量传递 从LED经由至少一个触点和至少一个导电和导热部分延伸到散热构件的传送路径。 根据本发明的发光装置提供了大大改进的从LED的散热,同时使用低成本的玻璃环氧材料用于PCB。