公开(公告)号：EP3159606B1

公开(公告)日：2018-08-22

申请号：EP16192681.1

申请日：2016-10-06

Applicant: LG Innotek Co., Ltd.

Inventor： KIM, Min Hak ,  KIM, Do Yub ,  SONG, Myung Jin

IPC: F21V23/00 ,  F21V29/77 ,  F21S8/02 ,  H05K1/00 ,  F21Y115/10

CPC classification number: H01L33/644 ,  F21S8/026 ,  F21S8/06 ,  F21V15/01 ,  F21V21/0832 ,  F21V23/005 ,  F21V29/503 ,  F21V29/773 ,  F21Y2115/10 ,  H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H05K1/0209 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10106

Abstract: Embodiments provide an illumination apparatus (100) including a light emitting module (110) including a board (112), at least one light emitting device (114) disposed in a first region (112a) of the board and drive devices (116) disposed in a second region (112b) of the board, a heat dissipation member (120), and dummy pads (119-1 to 119-6) disposed around the at least one light emitting device (114), the heat dissipation member (120) including a base (122a), a core (122b), and heat dissipation fins (122c) connected to the side surface of the core and the lower surface of the base. The first region (112a) is one region of the upper surface of the board, located within a designated range from the center (101) of the board, and the second region (112b) is another region of the upper surface of the board, spaced apart from the first region by a first distance (d1) and spaced apart from the edge of the upper surface of the board by a second distance (d2).

公开(公告)号：EP3357307A1

公开(公告)日：2018-08-08

申请号：EP16781690.9

申请日：2016-09-27

Applicant: LightnTec GmbH & Co. KG

Inventor： HÜBNER, Manuel ,  KALL, Florian

IPC: H05K1/02

CPC classification number: G09G3/32 ,  G09G2320/0626 ,  G09G2380/02 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2201/10522 ,  H05K2203/0143 ,  H05K2203/1545

Abstract: The invention relates to a luminous display (10) having a plurality of lighting means, in particular a plurality of light-emitting diodes, which are arranged on a transparent main body. The transparent main body reduces visible light by at most 40% on average. The transparent main body is preferably in the form of a film, more preferably in the form of a plastic film. The lighting means are supplied with voltage by means of conducting tracks. The conducting tracks are electrically connected preferably to a control unit (26a-g) at one end and to at least one lighting means at the other end.

公开(公告)号：EP3291656A1

公开(公告)日：2018-03-07

申请号：EP17183661.2

申请日：2017-07-28

Applicant: Samsung Display Co., Ltd.

Inventor： Lee, Ye-Bin ,  Lee, Hyun-Jae ,  Lee, Kang-Won ,  Kim, Young-Sik ,  Cho, Won-Gu

IPC: H05K1/11 ,  G02F1/1333 ,  G06F3/041

CPC classification number: H05K1/189 ,  G02F1/13338 ,  G06F3/041 ,  G06F3/0416 ,  G06F2203/04103 ,  H05K1/0218 ,  H05K1/111 ,  H05K1/118 ,  H05K1/147 ,  H05K3/281 ,  H05K3/361 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2203/1178

Abstract: A display device includes a first substrate, a flexible printed circuit, and a film. The flexible printed circuit is disposed on a first area of the first substrate. The film is disposed on the first substrate and the flexible printed circuit. The flexible printed circuit includes a second substrate, a pad area, and a dummy pad. The pad area comprises pads disposed on the second substrate. The pads extend in a first direction and are spaced apart from one another in a second direction crossing the first direction. The dummy pad is disposed on the second substrate. The dummy pad is spaced apart from the pad area.

Abstract translation: 显示装置包括第一基板，柔性印刷电路和膜。 柔性印刷电路设置在第一基板的第一区域上。 该膜布置在第一基板和柔性印刷电路上。 柔性印刷电路包括第二基板，焊盘区域和虚拟焊盘。 焊盘区域包括设置在第二基板上的焊盘。 垫在第一方向上延伸并且在与第一方向交叉的第二方向上彼此间隔开。 虚拟焊盘设置在第二基板上。 虚拟焊盘与焊盘区域分隔开。

公开(公告)号：EP3219178A1

公开(公告)日：2017-09-20

申请号：EP15825948.1

申请日：2015-11-04

Applicant: Alcatel Lucent

Inventor： BROWN, Paul James ,  CHAN, Alex

IPC: H05K3/42 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0251 ,  G06F17/5077 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/112 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/09454 ,  H05K2201/09781 ,  H05K2203/0207

Abstract: Disclosed is a multilayer printed circuit board (PCB) (300) having backdrill reliability anchors (314, 326, 328, 340) comprising nonfunctional pads to provide mechanical reinforcement for signal pads (310, 322, 326) on backdrilled plated through hole (PTH) vias (304, 316, 330), as well as associated method and machine readable storage medium.

Abstract translation: 公开了一种具有反钻可靠性锚定器的印刷电路板（PCB），其包括用于为背钻钻孔（PTH）通孔上的信号焊盘提供机械增强的非功能焊盘，以及相关联的方法和机器可读存储介质。

公开(公告)号：EP3214642A1

公开(公告)日：2017-09-06

申请号：EP15748148.2

申请日：2015-02-10

Applicant: BOE Technology Group Co., Ltd.

Inventor： NING, Ce ,  GAO, Tao

IPC: H01L21/50

CPC classification number: H05K1/028 ,  H05K1/0306 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/16 ,  H05K3/467 ,  H05K2201/09781 ,  H05K2203/016 ,  H05K2203/167

Abstract: The present disclosure relates to the technical field of flexible substrate processing, and discloses a flexible substrate attaching method. The flexible substrate attaching method comprises the steps of: pre-fixing a flexible substrate on a carrier substrate with a first fixation structure; forming a thin film on the flexible substrate, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously to play the function of consolidating the flexible substrate onto the carrier substrate. In this flexible substrate attaching method, a flexible substrate can be fixed on a carrier substrate in good effect and the flexible panel can be easily detached after the manufacture is completed. The present disclosure further provides a flexible substrate attachment structure.

Abstract translation: 本发明涉及柔性基板处理技术领域，公开了一种柔性基板贴附方法。 柔性基板贴附方法包括以下步骤：利用第一固定结构将柔性基板预固定在载体基板上; 在柔性基板上形成薄膜，并通过构图工艺形成薄膜的图案; 同时接触柔性基板的至少一部分和载体基板的至少一部分的薄膜的图案起到将柔性基板固结到载体基板上的功能。 在这种柔性基板附着方法中，柔性基板可以良好地固定在载体基板上，并且柔性面板在制造完成之后可以容易地拆卸。 本公开还提供了一种柔性基板附接结构。

公开(公告)号：EP3200570A1

公开(公告)日：2017-08-02

申请号：EP17153635.2

申请日：2017-01-27

Applicant: At&S (China) Co., Ltd.

Inventor： Bauer-Öppinger, Nikolaus ,  Chen, ZhaoJian ,  Dou, Yucun ,  Tamm, Wilhelm

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0206 ,  H05K1/0209 ,  H05K1/09 ,  H05K1/112 ,  H05K1/181 ,  H05K3/0026 ,  H05K3/0035 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/107 ,  H05K2203/1476

Abstract: The present invention relates to a component carrier (100) comprising a layer stack (101) formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore (110) extends into the layer stack (101) and has a first bore section (111) with a first diameter (D1) and a connected second bore section (112) with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material (102) fills substantially the entire bore (110). The bore is in particular formed by laser drilling.

Abstract translation: 本发明涉及包括由电绝缘结构和导电结构形成的叠层（101）的部件载体（100）。 此外，孔（110）延伸到层叠体（101）中并具有具有第一直径（D1）的第一孔部分（111）和具有不同于第二直径（D2）的第二直径（D2）的连接的第二孔部分 第一直径（D1）。 导热材料（102）基本填充整个孔（110）。 孔特别是通过激光钻孔形成。

公开(公告)号：EP2410827A4

公开(公告)日：2017-07-12

申请号：EP10753334

申请日：2010-02-03

Applicant: MURATA MANUFACTURING CO

Inventor： KATO NOBORU

IPC: H05K3/46 ,  H01L23/12 ,  H05K1/02

CPC classification number: H05K1/118 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/141 ,  H05K3/4632 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2924/00

Abstract: A circuit board to be mounted on a printed circuit board and a mother laminated body are provided, the circuit board being capable of suppressing detachment thereof from the printed circuit board even if the printed circuit board is deformed. A laminated body (11) is configured by induing insulation layers (16) composed of a flexible material that are stacked on one another. External electrodes are provided on a bottom surface of the laminated body (11). Ground conductors (18a, 18b) are provided in the laminated body (11) and harder than the insulation layers (16). The laminated body (11) includes a flexible region (E2) and a rigid region (E1) that is adjacent to the flexible region (E2) when viewed in a plan from a z-axis direction, The rigid region (E1) is defined by the ground conductors (18a, 18b) when viewed in a plan from the z-axis direction, The external electrodes are provided within the flexible region (E2) when viewed in a plan from the z-axis direction.

Abstract translation: 提供了将要安装在印刷电路板和母层叠体上的电路板，即使印刷电路板变形，电路板也能够抑制其从印刷电路板上的分离。 通过将由柔性材料构成的绝缘层（16）堆叠在一起而构成层叠体（11）。 外部电极设置在层压体（11）的底面上。 接地导体（18a，18b）设置在层叠体（11）中并且比绝缘层（16）更硬。 层叠体（11）具有挠性区域（E2）和从z轴方向俯视时与挠性区域（E2）相邻的刚性区域（E1），刚性区域（E1）被限定 在从z轴方向俯视时，通过接地导体（18a，18b），从z轴方向俯视时，在挠性区域（E2）内设置外部电极。

公开(公告)号：EP2786592B1

公开(公告)日：2017-03-22

申请号：EP12821118.2

申请日：2012-11-28

Applicant: Soundchip SA

Inventor： DARLINGTON, Paul ,  DONALDSON, Mark

IPC: H04R1/06 ,  H04R11/02 ,  H01R12/71 ,  H04R25/00 ,  H04R31/00 ,  H05K3/30

CPC classification number: H04R1/06 ,  H04R11/02 ,  H04R25/604 ,  H04R25/608 ,  H04R2400/13 ,  H05K1/0272 ,  H05K3/30 ,  H05K3/3431 ,  H05K2201/09072 ,  H05K2201/09781 ,  H05K2201/10083

公开(公告)号：EP2634480B1

公开(公告)日：2016-09-28

申请号：EP12834577.4

申请日：2012-10-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： UENOYAMA, Koji ,  OOTUBO, Atusi ,  MATSUMOTO, Hiroyuki

IPC: F21K9/90 ,  F21V29/503 ,  H05K1/02 ,  H05B33/08 ,  F21Y105/10 ,  F21Y115/10 ,  F21V29/70

CPC classification number: F21V29/004 ,  F21K9/23 ,  F21K9/27 ,  F21S8/04 ,  F21V3/00 ,  F21V29/508 ,  F21Y2103/33 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05B33/0821 ,  H05K1/0201 ,  H05K1/0209 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/09136 ,  H05K2201/09781 ,  H05K2201/10106

Abstract: A light-emitting device includes: a board (18); light-emitting elements (60a and 60b) interconnected in parallel and provided above a top face (65) of the board (18); light-emitting elements (60e and 60f), one of which is connected in series with the light-emitting element (60a) and the other of which is connected in series with the light-emitting element (60b), the light-emitting elements (60e and 60f) being interconnected in parallel; a metal pattern (67a) provided continuously under the light-emitting elements (60a and 60b), on an undersurface (28) of the board (18); and a metal pattern (67b) provided continuously under the light-emitting elements (60e and 60f), and isolated from the first metal pattern (67a).

Abstract translation: 发光装置包括：板（18）; 并联连接并设置在板（18）的顶面（65）上方的发光元件（60a和60b）; 发光元件（60e和60f），其中一个与发光元件（60a）串联连接，另一个与发光元件（60b）串联连接，发光元件 （60e和60f）并联连接; 在所述基板（18）的下表面（28）上连续设置在所述发光元件（60a和60b）下方的金属图案（67a）。 以及连续设置在发光元件（60e，60f）下方并与第一金属图案（67a）隔离的金属图案（67b）。

公开(公告)号：EP2999316A3

公开(公告)日：2016-03-30

申请号：EP15157827.5

申请日：2015-03-05

Applicant: VIA Technologies, Inc.

Inventor： Lee, Sheng-Yuan

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/02 ,  H01R12/62

CPC classification number: H01R12/771 ,  H01R13/6471 ,  H01R13/6473 ,  H05K1/025 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/09781 ,  H05K2201/10189

Abstract: A pin arrangement adapted to a FPC connector is provided. The pin arrangement includes a pin lane (110). The pin lane (110) includes a pair of ground pins (112), a pair of differential pins (114) and at least one not-connected (NC) pin (116). The differential pins (114) are located between the pair of ground pins (112). The at least one NC pin (116) is located between the pair of differential pins (114) and optionally there is a pair of NC pins (118) respectively located between one of the pair of ground pins (112) and one of the pair of differential pins (114) adjacent thereto. By adding the at least one NC pin (116) between the pair of differential pins (114), and optionally between the differential pin (114) and the ground pin (112) adjacent thereto, a distance between each of the pair of the differential pins (114), and optionally between the differential pin (114) and the ground pin (112) is increased, and thus a differential characteristic impedance of the pair of differential pins (114) is raised to reduce the impact of impedance mismatch.