WHITE-LIGHT LIGHT-EMITTING DIODE LAMP WITH A REMOTE REFLECTIVE PHOTOLUMINESCENT CONVERTER

    公开(公告)号:EP2665099A4

    公开(公告)日:2017-11-22

    申请号:EP11872178

    申请日:2011-12-20

    摘要: The invention relates to white-light lamps based on semiconductor light-emitting diodes with remote photoluminescent converters. The essence of the invention is that the lamp comprises a heat-removing base with a radiation output orifice, and light-emitting diodes secured about the periphery of the orifice, with, arranged in series at a distance from said light-emitting diodes, a radiation converter in the form of a concave layer of photoluminescent material, and a light reflector with a concave light-reflecting surface, wherein the concavities of the radiation converter and the light reflector are oriented towards the light-emitting diodes and the exit opening. When primary radiation from the light-emitting diodes falls on the surface of the converter, white light generated as a result of the mixing of the reflected primary radiation with secondary radiation from the photoluminescent material exits via the orifice in the heat-removing base. The surfaces of the converter and the reflector may be in the form of a truncated ellipsoid of revolution, in particular a sphere, or a paraboloid, with a main axis perpendicular to the plane of the orifice in the heat-removing base, or a cylinder which is truncated by the plane of the output orifice. In order to improve the dissipation of heat, thermal contact is provided between the convex surface of the converter and the concave inside surface of the reflector, the outside surface of which can be in the form of a ribbed heat radiator associated with the heat-removing base.

    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING A LIGHT EMITTING DEVICE
    8.
    发明授权
    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING A LIGHT EMITTING DEVICE 有权
    发光装置和用于制造发光装置的方法

    公开(公告)号:EP2823226B1

    公开(公告)日:2017-05-10

    申请号:EP13717567.5

    申请日:2013-03-06

    摘要: A light emitting device comprising a substrate (6) having an electrically conducting circuit layer (8), a LED package (7) surface mounted on the substrate (6) and electrically connected to the circuit layer (8), and a heat sink element, surface mounted on the substrate (6) separately from the LED package (7), the heat sink element having a body (2) of a heat conductive material surrounding the LED package (7), the body being thermally connected to the circuit layer (8), and being adapted to provide heat dissipation from the circuit layer (8) to a surrounding environment, wherein a surface (3) of the heat sink element facing the LED package is adapted to form part of a beam shaping optics for shaping light emitted from the LED package. Since the heat sink body is in thermal contact with the circuit layer, the heat resistance from the LED package to the heat sink body via the circuit layer is minimized.

    摘要翻译: 一种发光器件,包括具有导电电路层(8)的基板(6),表面安装在基板(6)上并电连接到电路层(8)的LED封装(7),以及散热器元件 ,与所述LED封装(7)分开地表面安装在所述基板(6)上,所述散热器元件具有围绕所述LED封装(7)的导热材料的本体(2),所述本体热连接至所述电路层 (8),并且适于提供从所述电路层(8)到周围环境的散热,其中面向所述LED封装的所述散热器元件的表面(3)适于形成用于成形的光束成形光学器件的一部分 从LED封装发射的光。 由于散热器本体与电路层热接触,所以经由电路层从LED封装件到散热器本体的热阻被最小化。