MEASURING SENSOR PACKAGE AND MEASUREMENT SENSOR

    公开(公告)号:EP4026493A1

    公开(公告)日:2022-07-13

    申请号:EP21205560.2

    申请日:2016-11-10

    摘要: A measurement sensor package may comprise a substrate body including a first surface, a second surface opposite to the first surface, a first opening and a second opening which open in the first surface, a first recess recessed from the first opening, and a second recess recessed from the second opening, the first recess including a first bottom surface on which a light emitter is mountable, and a first step surface located closer to the first opening than the first bottom surface, the second recess including a second bottom surface on which a light receiver is mountable, and a second step surface located closer to the second opening than the second bottom surface, the first step surface being located farther from the second recess than the first bottom surface, the second step surface being located farther from the first recess than the second bottom surface.

    RFID TAG
    3.
    发明公开
    RFID TAG 审中-公开

    公开(公告)号:EP3889838A1

    公开(公告)日:2021-10-06

    申请号:EP19889371.1

    申请日:2019-11-22

    摘要: The present invention provides an RFID tag with which it is possible to extend a communicatable distance by a simple and highly reliable antenna connection. This RFID tag (1) comprises an RFID tag device (20) created by mounting an IC for RFID tags on a substrate, and a sheet antenna (10) which includes an antenna conductor (12) and to which the RFID tag device is secured. The substrate of the RFID tag device (20) has a first surface conductor, a second surface conductor arranged between the first surface conductor and the antenna conductor, and a short-circuit conductor for short-circuiting the first surface conductor and the second surface conductor together, the direction of the second surface conductor that faces the center of the second surface conductor from the connecting part of the short-circuit conductor facing the longitudinal direction (X0) of the antenna conductor.

    MEASUREMENT SENSOR PACKAGE AND MEASUREMENT SENSOR

    公开(公告)号:EP3440998A1

    公开(公告)日:2019-02-13

    申请号:EP17778883.3

    申请日:2017-02-22

    IPC分类号: A61B5/0285 A61B5/026

    摘要: A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package (11) includes a substrate (2), a lid (3), a ground conductor layer (4), a metallic thin layer (5), and a bond (6). The ground conductor layer (4) and the metallic thin layer (5) are arranged inside the bond (6) that extends continuously as viewed through from above. The bond (6) directly bonds a first main surface (21) of a substrate body (20) and a facing surface (3a) of the lid (3) together along the entire periphery. This improves the reliability in strength.