公开(公告)号：EP3307033A4

公开(公告)日：2018-08-01

申请号：EP16807762

申请日：2016-06-08

申请人： LG CHEMICAL LTD

发明人： JEONG HYE WON ,  SHIN BO RA ,  KIM KYUNGJUN ,  MYUNG JI EUN ,  SON YONG GOO

IPC分类号： H05K1/03 ,  B32B15/088 ,  C08G73/10 ,  H05K1/02 ,  H05K3/38

CPC分类号： H05K3/386 ,  B32B15/088 ,  C08G73/10 ,  C08G73/1007 ,  H05K1/02 ,  H05K1/03 ,  H05K3/103 ,  H05K3/38 ,  H05K2203/016

摘要： The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation. The embedding of the metal wires in the flexible substrate layer decreases the sheet resistance of an electrode and can protect the metal wires from damage or disconnection even when the flexible substrate is deformed in shape.

公开(公告)号：EP3147311A4

公开(公告)日：2018-03-14

申请号：EP15835521

申请日：2015-08-28

申请人： LG CHEMICAL LTD

发明人： PARK SANG JUN ,  LEE YEON KEUN ,  KIM YONG NAM ,  JEONG HYE WON ,  SHIN BO RA

IPC分类号： H01L51/52 ,  C08J5/18 ,  C08K3/22 ,  C08K7/00 ,  C08L79/08 ,  C08L101/00

CPC分类号： H01L51/5268 ,  C08J5/00 ,  C08J5/18 ,  C08J2379/08 ,  C08K3/22 ,  C08K7/00 ,  C08K2003/2241 ,  C08L79/08 ,  C08L101/00 ,  H01L51/0034 ,  H01L51/0096 ,  H01L51/0097 ,  H01L2251/5369 ,  Y02E10/549

摘要： The present application relates to a plastic substrate, a method for producing same, an organic electronic device, and display light source and lighting apparatus. The plastic substrate according to the present application has superb light extraction efficiency and exhibits an excellent surface roughness characteristic. Furthermore, the method for producing the plastic substrate according to the present application can produce the plastic substrate by means of a process in which scattering components are added secondarily. Moreover, the plastic substrate according to the present application can be utilized as a substrate for an organic electronic device, and the organic electronic device can be utilized as display light source and lighting apparatus.