公开(公告)号：EP3992245A1

公开(公告)日：2022-05-04

申请号：EP21843865.3

申请日：2021-07-08

申请人： LG Chem, Ltd.

发明人： CHOI, Gi Dae ,  KIM, Jinseon ,  HAM, Myong Jo ,  LEE, Hyun Jin

IPC分类号： C08L67/02 ,  C08L71/12 ,  C08L25/10 ,  C08L63/00 ,  C08K7/24 ,  H01B1/24 ,  C08K3/04

摘要： The present invention relates to a conductive resin composition, a method of preparing the same, and a molded article including the same. More particularly, the present invention relates to a conductive resin composition including 100 parts by weight of a base resin (A) including a polyester, a polyarylene ether, and an aromatic elastomer; 3 to 12 parts by weight of two or more polyfunctional reaction agents (B); 0.1 to 3 parts by weight of carbon nanotubes (C); 0.1 to 5 parts by weight of carbon nanoplates (D); and 1 to 10 parts by weight of glass powder (E), a method of preparing the conductive resin composition, and a molded article including the conductive resin composition.
According to the present invention, there is an effect of providing a conductive resin composition having excellent moisture stability and heat resistance in addition to excellent appearance, rigidity, and conductivity; being capable of minimizing the influence of moisture and heat when exposed to external environments due to these properties; and thus being suitable for exterior parts replacing metal parts used in automobiles, a method of preparing the conductive resin composition, and a molded article including the conductive resin composition.

公开(公告)号：EP3699234A1

公开(公告)日：2020-08-26

申请号：EP19877550.4

申请日：2019-11-14

申请人： LG Chem, Ltd.

发明人： LEE, Hyun Jin ,  HAM, Myong Jo ,  KIM, Soongin ,  LEE, Eon Seok

IPC分类号： C08L81/02 ,  C08K7/14 ,  C08K3/22 ,  C08K5/053 ,  C08K9/06 ,  C08K5/5415 ,  C08K3/013 ,  C08G75/0204 ,  B29B11/10 ,  B29B7/90

摘要： The present invention relates to a polyphenylene sulfide resin composition including (a) 25 to 75 % by weight of a base resin including 95 % by weight or more of a polyphenylene sulfide resin; (b) 0.1 to 10 % by weight of an LDS additive; (c) 0.1 to 5 % by weight of a plating seed generation promoter; (d) 10 to 60 % by weight of a glass fiber; and (e) 0 to 40 % by weight of a mineral filler, a method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.
According to the present invention, a polyphenylene sulfide resin composition for laser direct structuring (LDS) having excellent plating adhesion and plating precision and low dielectric loss without deterioration in the intrinsic properties, such as heat resistance, flame retardancy, and dimensional stability, of a polyphenylene sulfide resin, a method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition are provided.