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8 条记录 (耗时 0.011 秒)

    THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDED PRODUCT MANUFACTURED THEREFROM
    1.
    发明公开
    THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDED PRODUCT MANUFACTURED THEREFROM 审中-公开

    公开(公告)号：EP4036171A1

    公开(公告)日：2022-08-03

    申请号：EP21843864.6

    申请日：2021-07-21

    申请人： LG Chem, Ltd.

    发明人： CHOI, Gi Dae ,  KIM, Hyuntae ,  HAM, Myong Jo ,  HAM, Hyeseung ,  KIM, Jinseon

    IPC分类号： C08L71/12 ,  C08L25/06 ,  C08K5/00 ,  C08K5/49 ,  C08K9/04 ,  C08K3/34 ,  C08K3/30

    摘要： The present invention relates to a thermoplastic resin composition, a method of preparing the same, and a molded article including the same. More particularly, the present invention relates to a thermoplastic resin composition including 100 parts by weight of a base resin including 50 to 95 % by weight of a polyarylene ether resin (a-1) and 5 to 50 % by weight of a polystyrene resin (a-2); 8.5 to 16 parts by weight of two or more types of organophosphorus flame retardants (b) having different phosphorus contents; 0.5 to 3 parts by weight of organoclay (c); 0.5 to 3.5 parts by weight of pulverized mica (d); 1 to 4 parts by weight of an alkaline earth metal sulfate (e); and 1 to 5 parts by weight of a polyfunctional reactant (f), a method of preparing the thermoplastic resin composition, and a molded article including the thermoplastic resin composition.
    The present invention has an effect of providing a thermoplastic resin composition having excellent mechanical properties, such as impact strength and tensile strength, heat resistance, electrical insulation, and flame retardancy; a method of preparing the thermoplastic resin composition; and a molded article including the thermoplastic resin composition.

    CONDUCTIVE RESIN COMPOSITION, METHOD FOR PREPARING SAME, AND MOLDED PRODUCT COMPRISING SAME
    5.
    发明公开
    CONDUCTIVE RESIN COMPOSITION, METHOD FOR PREPARING SAME, AND MOLDED PRODUCT COMPRISING SAME 审中-公开

    公开(公告)号：EP3992245A1

    公开(公告)日：2022-05-04

    申请号：EP21843865.3

    申请日：2021-07-08

    申请人： LG Chem, Ltd.

    发明人： CHOI, Gi Dae ,  KIM, Jinseon ,  HAM, Myong Jo ,  LEE, Hyun Jin

    IPC分类号： C08L67/02 ,  C08L71/12 ,  C08L25/10 ,  C08L63/00 ,  C08K7/24 ,  H01B1/24 ,  C08K3/04

    摘要： The present invention relates to a conductive resin composition, a method of preparing the same, and a molded article including the same. More particularly, the present invention relates to a conductive resin composition including 100 parts by weight of a base resin (A) including a polyester, a polyarylene ether, and an aromatic elastomer; 3 to 12 parts by weight of two or more polyfunctional reaction agents (B); 0.1 to 3 parts by weight of carbon nanotubes (C); 0.1 to 5 parts by weight of carbon nanoplates (D); and 1 to 10 parts by weight of glass powder (E), a method of preparing the conductive resin composition, and a molded article including the conductive resin composition.
    According to the present invention, there is an effect of providing a conductive resin composition having excellent moisture stability and heat resistance in addition to excellent appearance, rigidity, and conductivity; being capable of minimizing the influence of moisture and heat when exposed to external environments due to these properties; and thus being suitable for exterior parts replacing metal parts used in automobiles, a method of preparing the conductive resin composition, and a molded article including the conductive resin composition.

    POLYPHENYLENE SULFIDE RESIN COMPOSITION, METHOD FOR PREPARING SAME, AND INJECTION MOLDED PRODUCT MANUFACTURED FROM SAME
    7.
    发明公开
    POLYPHENYLENE SULFIDE RESIN COMPOSITION, METHOD FOR PREPARING SAME, AND INJECTION MOLDED PRODUCT MANUFACTURED FROM SAME 审中-公开

    公开(公告)号：EP3699234A1

    公开(公告)日：2020-08-26

    申请号：EP19877550.4

    申请日：2019-11-14

    申请人： LG Chem, Ltd.

    发明人： LEE, Hyun Jin ,  HAM, Myong Jo ,  KIM, Soongin ,  LEE, Eon Seok

    IPC分类号： C08L81/02 ,  C08K7/14 ,  C08K3/22 ,  C08K5/053 ,  C08K9/06 ,  C08K5/5415 ,  C08K3/013 ,  C08G75/0204 ,  B29B11/10 ,  B29B7/90

    摘要： The present invention relates to a polyphenylene sulfide resin composition including (a) 25 to 75 % by weight of a base resin including 95 % by weight or more of a polyphenylene sulfide resin; (b) 0.1 to 10 % by weight of an LDS additive; (c) 0.1 to 5 % by weight of a plating seed generation promoter; (d) 10 to 60 % by weight of a glass fiber; and (e) 0 to 40 % by weight of a mineral filler, a method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.
    According to the present invention, a polyphenylene sulfide resin composition for laser direct structuring (LDS) having excellent plating adhesion and plating precision and low dielectric loss without deterioration in the intrinsic properties, such as heat resistance, flame retardancy, and dimensional stability, of a polyphenylene sulfide resin, a method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition are provided.