摘要:
The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.
摘要:
The present invention relates to a thermoplastic resin composition having excellent heat resistance and electromagnetic wave shielding capacity including (a) 100 parts by weight of a thermoplastic resin including 80 to 100 % by weight of a base resin and 0 to 20 % by weight of a reinforcing resin; (b) 2 to 60 parts by weight of a linear carbon fiber having an average diameter of 1 to 15 µm; (c) 1 to 5 parts by weight of a carbon nanofibril having a BET specific surface area of 200 to 400 m 2 /g; (d) 1 to 15 parts by weight of a carbon nanoplate; and (e) 1 to 25 parts by weight of a metal powder, a method of preparing the thermoplastic resin composition; and an injection-molded article manufactured using the thermoplastic resin composition. According to the present invention, a thermoplastic resin composition having excellent mechanical properties, such as impact strength, conductivity, heat resistance, appearance, and electromagnetic wave shielding capacity, especially having high shielding efficiency against high-frequency electromagnetic waves; a method of preparing the thermoplastic resin composition; and an injection-molded article manufactured using the thermoplastic resin composition may be provided. With these advantages, the injection-molded article manufactured using the thermoplastic resin composition may be used as automobile parts and electric and electronic parts, and the thermoplastic resin composition may be used as a substitute for aluminum alloys and magnesium alloys.
摘要:
The present invention relates to a conductive concentrated resin composition including (a) 100 parts by weight of a base resin including 50 to 95 % by weight of a polyamide resin, 2.5 to 20 % by weight of a polar polymer, and 2.5 to 30 % by weight of a non-polar polymer, (b) 10 to 40 parts by weight of a carbon nanofibril, (c) 0.5 to 5 parts by weight of a carbon nanoplate, and (d) 0.5 to 4 parts by weight of nanoclay; a conductive polyamide resin composition including the conductive concentrated resin composition; a method of preparing the conductive concentrated resin composition; and a molded article including the conductive polyamide resin composition. When a polyamide alloy resin composition is prepared using the conductive concentrated resin composition of the present invention, compatibility between compositions and dispersion stability may be improved, thereby significantly increasing moisture stability while maintaining mechanical strength, conductivity, heat resistance, and appearance properties equal or superior to those of a conventional conductive polyamide alloy resin composition.
摘要:
The present invention relates to a polyphenylene sulfide resin composition including (a) 25 to 75 % by weight of a base resin including 95 % by weight or more of a polyphenylene sulfide resin; (b) 0.1 to 10 % by weight of an LDS additive; (c) 0.1 to 5 % by weight of a plating seed generation promoter; (d) 10 to 60 % by weight of a glass fiber; and (e) 0 to 40 % by weight of a mineral filler, a method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition. According to the present invention, a polyphenylene sulfide resin composition for laser direct structuring (LDS) having excellent plating adhesion and plating precision and low dielectric loss without deterioration in the intrinsic properties, such as heat resistance, flame retardancy, and dimensional stability, of a polyphenylene sulfide resin, a method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition are provided.