公开(公告)号：EP1606108A1

公开(公告)日：2005-12-21

申请号：EP04723419.0

申请日：2004-03-25

Applicant: LG Chem Ltd.

Inventor： PARK, Soon-yong ,  KYUNG, You-jin ,  SONG, Heon-sik ,  AHN, Byeong-in; ,  KO, Joo-eun ,  PARK, Yong-jun ,  JANG, Se-myung,

IPC: B32B15/08

CPC classification number: B32B15/08 ,  B32B27/08 ,  B32B27/281 ,  B32B2307/308 ,  B32B2307/734 ,  B32B2457/08 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/068 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5x10-6 to 2.5x10-5/¡É and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.

公开(公告)号：EP1606108B1

公开(公告)日：2015-08-19

申请号：EP04723419.0

申请日：2004-03-25

Applicant: LG Chem Ltd.

Inventor： PARK, Soon-yong ,  KYUNG, You-jin ,  SONG, Heon-sik ,  AHN, Byeong-in; ,  KO, Joo-eun ,  PARK, Yong-jun ,  JANG, Se-myung,

IPC: B32B15/08

CPC classification number: B32B15/08 ,  B32B27/08 ,  B32B27/281 ,  B32B2307/308 ,  B32B2307/734 ,  B32B2457/08 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/068 ,  Y10T428/31681 ,  Y10T428/31721