公开(公告)号：EP3182812B1

公开(公告)日：2018-11-21

申请号：EP16203315.3

申请日：2016-12-09

Applicant: Delphi Technologies, Inc.

Inventor： MORALES Jesus R. ,  MUNOZ Kevin G. ,  DE LA REZA Alvaro G. ,  VILLANUEVA Rodrigo

IPC: H05K7/02 ,  B60R16/023 ,  H05K1/03 ,  H05K7/10

CPC classification number: H05K7/10 ,  H05K1/0366 ,  H05K7/026 ,  H05K2201/068

Abstract: An electromechanical assembly (10) includes a generally planar printed circuit board (PCB) (16), an electrical terminal (18) electrically and mechanically connected to the PCB (16) and projecting from a major surface of the PCB (16), and a housing (14) formed of a dielectric material having a base portion (30) and a terminal portion (32). The terminal portion (32) defines a cavity (26) and the electrical terminal (18) is disposed within this cavity (26). The terminal portion (32) is disposed within a aperture (52) that is defined by the base portion (30). The electromechanical assembly (10) defines a gap (54) between the base portion (30) and the terminal portion (32). The terminal portion (32) is connected to the base portion (30) by a pair of flexible beams (56) which may have a serpentine or ogee curve shape (58, 60, 62), each of which is attached between one of two opposed sides of the base portion (30) and the terminal portion (32).

公开(公告)号：EP3351065A1

公开(公告)日：2018-07-25

申请号：EP16845819.8

申请日：2016-09-16

Applicant: At&S (China) Co., Ltd.

Inventor： TAY, Annie ,  BAUER-OEPPINGER, Nikolaus ,  DI GREGORIO, Giordano ,  DAI, Philips

IPC: H05K3/46

CPC classification number: H05K3/4682 ,  H05K1/0269 ,  H05K3/0097 ,  H05K3/022 ,  H05K3/108 ,  H05K3/32 ,  H05K3/4007 ,  H05K2201/068 ,  H05K2201/09918 ,  H05K2201/09936 ,  H05K2203/0156 ,  H05K2203/0264

Abstract: A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The sacrificial structure includes a central structure and releasing layers on or over both opposing main surfaces of the central structure The central structure includes a dummy core being covered, in particular fully, on or over both main surfaces thereof with a respective one of two spatially separated sections of separate material, in particular separate dielectric material.

公开(公告)号：EP2728616B1

公开(公告)日：2018-07-18

申请号：EP12805403.8

申请日：2012-06-06

Applicant: NGK Insulators, Ltd.

Inventor： HIRAI, Takami ,  YANO, Shinsuke ,  NANATAKI, Tsutomu ,  YAMAGUCHI, Hirofumi

IPC: H01L25/07 ,  H01L23/36 ,  H01L25/18 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K7/06 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/642 ,  H01L24/45 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/0207 ,  H05K1/0231 ,  H05K1/0263 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/145 ,  H05K1/162 ,  H05K3/0061 ,  H05K2201/068 ,  H05K2201/10015 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: [Summary] [Subject] In a high-capacity module, while attaining reduction in size and weight, reduction in serge, and reduction in a loss, overheating of the module due to the curvature of a power circuit board accompanying thermal expansion of a composition member of the power circuit due to heat generation from a high exothermic element should be prevented. [Solution means] A drive circuit is laminated via a high exothermic element disposed on a power circuit, and it is configured so that the average thermal expansion coefficient of the side of the power circuit of the drive circuit board may be larger than the average thermal expansion coefficient of the side opposite to the power circuit. Thereby, the drive circuit board will be curved in the same direction as the power circuit board when the power circuit board is curved due to heat generation from the high exothermic element accompanying the operation of the module. Thereby, in a high-capacity module, while attaining reduction in size and weight, reduction in serge, and reduction in a loss, poor junction between the high exothermic element of the power circuit and the drive circuit board can be suppressed and heat generating from the high exothermic element can be more effectively released.

公开(公告)号：EP3340754A1

公开(公告)日：2018-06-27

申请号：EP17209135.7

申请日：2017-12-20

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Schwarz, Timo ,  Zluc, Andreas ,  Schober, Mario

IPC: H05K1/18 ,  H01L23/538 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H01L23/5389 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/028 ,  H05K1/185 ,  H05K3/007 ,  H05K3/30 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/068 ,  H05K2203/1469

Abstract: A method of manufacturing a component carrier, wherein the method comprises covering a main surface of a base structure 102 at least partially by a component fixation structure 104, mounting a component 106 on a temporary carrier 108, and interconnecting the base structure with the carrier so that the component extends partially into the component fixation structure.

公开(公告)号：EP2099120B1

公开(公告)日：2018-05-16

申请号：EP09003031.3

申请日：2009-03-03

Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

Inventor： Onishi, Hiroyuki ,  Nagase, Toshiaki ,  Ishikawa, Jun ,  Kontani, Kazuyoshi ,  Fukatsu, Toshinari

IPC: H02M7/00 ,  H01L25/07 ,  H01L23/00 ,  H05K3/30

CPC classification number: H02M7/003 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H05K3/301 ,  H05K2201/068 ,  H05K2201/10272 ,  H05K2201/10522 ,  H05K2201/2018 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A power converter includes a base plate 20 having thereon a switching device, and positive 27 and negative 28 conductors respectively including main portions 27A, 28A disposed parallel to the base plate. One of the main portions is placed over the other of the main portions. The main portions are disposed adjacent to and parallel to each other. The main portions are insulated from each other. The power converter includes a capacitor 17 having positive and negative terminals electrically connected to the respective main portions of the positive and negative conductors. Each of the positive and negative conductors includes a side portion 27B, 28B extending from the main portion 27A, 28A toward the base plate 20, and a terminal portion 27C, 28C extending from the side portion and joined to the base plate. The side portion is formed with a cutout 27D, 28D extending from the end adjacent to the base plate to the opposite end connected to the main portion.

公开(公告)号：EP3229565A1

公开(公告)日：2017-10-11

申请号：EP17165397.5

申请日：2017-04-07

Applicant: Azbil Corporation

Inventor： NAGOYA, Hiroaki

IPC: H05K3/28 ,  H05K1/02

CPC classification number: H05K1/0209 ,  H05K1/0262 ,  H05K3/0091 ,  H05K3/284 ,  H05K7/205 ,  H05K7/209 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/10174 ,  H05K2203/125 ,  H05K2203/16

Abstract: To improve a substrate unit in which safety maintaining devices are mounted on a wiring substrate while suppressing manufacturing costs.
A substrate unit includes a wiring substrate, electronic components as safety maintaining devices arranged on the wiring substrate, plural metal components arranged on the wiring substrate at distances from the electronic components as the safety maintaining devices so as to satisfy a requirement for an intrinsically safe explosion-proof construction, and a resin film covering at least one of the plural metal components and the electronic components as the safety maintaining devices on the wiring substrate, in which the resin film has a thermal conductivity of at least 1.0W/mk and a dielectric breakdown strength of at least 3.0kV/mm.

Abstract translation: 为了改善其中安全保持装置被安装在布线基板上的基板单元，同时抑制制造成本。 基板单元包括布线基板，布置在布线基板上的作为安全维护装置的电子部件，布置在布线基板上与电子部件相距一定距离的多个金属部件作为安全维护装置，以满足本质安全爆炸的要求 以及覆盖多个金属部件和电子部件中的至少一个的树脂膜，作为布线基板上的安全保持装置，其中树脂膜具有至少1.0W / mk的导热率和电介质 击穿强度至少为3.0kV / mm。

公开(公告)号：EP3210774A1

公开(公告)日：2017-08-30

申请号：EP16173249.0

申请日：2016-06-07

Applicant: Hyundai Motor Company ,  Kia Motors Corporation

Inventor： CHOI, Seung Woo ,  JEONG, Sung Cheul ,  KIM, Ho Sub ,  KIM, Young Do ,  KIM, Cheol Ho

IPC: B32B15/08 ,  B32B15/20

CPC classification number: H05K1/09 ,  B32B7/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/281 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/54 ,  B32B2307/546 ,  B32B2307/732 ,  B32B2307/734 ,  B32B2307/748 ,  B32B2457/08 ,  B32B2605/00 ,  B32B2605/08 ,  H05K1/028 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/068

Abstract: Disclosed is a flexible copper clad laminate including a first copper foil layer, a composite layer, and a second copper foil layer. Preferably, the composite layer includes a polyimide layer and a plurality of thermoplastic polyimide layers as an outermost layer thereof being the thermoplastic polyimide layers. In particular, with respect to a total thickness of the composite layer, a total thickness of the plurality of thermoplastic polyimide layers is in a range of from about 15 to about 50 %, and a total thickness of the polyimide layer is in a range of from about 50 to about 85 %. Each thickness of the first copper foil layer and the second copper foil layer is in a range of from about 30 to about 80 µm, and the total thickness of the composite layer is in a range of from about 40 to about 60 µm.

Abstract translation: 公开了一种柔性覆铜层压板，其包括第一铜箔层，复合层和第二铜箔层。 优选地，复合层包括聚酰亚胺层和作为热塑性聚酰亚胺层的最外层的多个热塑性聚酰亚胺层。 特别地，关于复合层的总厚度，多个热塑性聚酰亚胺层的总厚度在约15至约50％的范围内，并且聚酰亚胺层的总厚度在 从约50至约85％。 第一铜箔层和第二铜箔层各自的厚度在约30至约80μm的范围内，并且复合层的总厚度在约40至约60μm的范围内。

公开(公告)号：EP3182812A1

公开(公告)日：2017-06-21

申请号：EP16203315.3

申请日：2016-12-09

Applicant: Delphi Technologies, Inc.

Inventor： MORALES Jesus R. ,  MUNOZ Kevin G. ,  DE LA REZA Alvaro G. ,  VILLANUEVA Rodrigo

IPC: H05K7/02 ,  B60R16/023

CPC classification number: H05K7/10 ,  H05K1/0366 ,  H05K7/026 ,  H05K2201/068

Abstract: An electromechanical assembly (10) includes a generally planar printed circuit board (PCB) (16), an electrical terminal (18) electrically and mechanically connected to the PCB (16) and projecting from a major surface of the PCB (16), and a housing (14) formed of a dielectric material having a base portion (30) and a terminal portion (32). The terminal portion (32) defines a cavity (26) and the electrical terminal (18) is disposed within this cavity (26). The terminal portion (32) is disposed within a aperture (52) that is defined by the base portion (30). The electromechanical assembly (10) defines a gap (54) between the base portion (30) and the terminal portion (32). The terminal portion (32) is connected to the base portion (30) by a pair of flexible beams (56) which may have a serpentine or ogee curve shape (58, 60, 62), each of which is attached between one of two opposed sides of the base portion (30) and the terminal portion (32).

Abstract translation: 机电组件（10）包括大致平面的印刷电路板（PCB）（16），电连接和机械连接到PCB（16）并且从PCB（16）的主表面突出的电端子（18），以及 由具有基部（30）和端子部（32）的电介质材料形成的壳体（14）。 端子部分（32）限定了空腔（26），电端子（18）设置在该空腔（26）内。 终端部分（32）设置在由基座部分（30）限定的孔（52）内。 机电组件（10）限定基部（30）和端子部分（32）之间的间隙（54）。 端子部分（32）通过一对柔性梁（56）连接到基座部分（30），所述柔性梁可以具有蛇形曲线或者ogee曲线形状（58,60,62），每个曲线形状附接在两个 基部（30）和端子部（32）的相对侧。

公开(公告)号：EP3109701A1

公开(公告)日：2016-12-28

申请号：EP15867418.4

申请日：2015-08-17

Applicant: Goo Chemical Co., Ltd.

Inventor： SAKAI, Yoshio

IPC: G03F7/004 ,  G03F7/029 ,  G03F7/031

CPC classification number: G03F7/031 ,  G03F7/0042 ,  G03F7/0043 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/20 ,  G03F7/2006 ,  G03F7/26 ,  G03F7/322 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/068

Abstract: This photosensitive resin composition includes: (A) a photopolymerizable compound including at least one of a photopolymerizable monomer and a photopolymerizable oligomer; (B) titanium dioxide; and (C) a photopolymerization initiator. The component (C) includes (C1) an acylphosphine oxide-containing photopolymerization initiator and (C2) a phenylglyoxylic acid-containing photopolymerization initiator.

Abstract translation: 该感光性树脂组合物包含：（A）包含光聚合性单体和光聚合性低聚物中的至少一种的光聚合性化合物， （B）二氧化钛; 和（C）光聚合引发剂。 组分（C）包括（C1）含酰基氧化膦的光聚合引发剂和（C2）含苯基乙醛酸的光聚合引发剂。

公开(公告)号：EP3054350A1

公开(公告)日：2016-08-10

申请号：EP14866816.3

申请日：2014-12-10

Applicant: Goo Chemical Co., Ltd.

Inventor： SAKAI, Yoshio ,  HAMADA, Nobuhito ,  HIGUCHI, Michiya ,  MIYAKE, Tokuzan

IPC: G03F7/031 ,  G03F7/004 ,  G03F7/038

CPC classification number: G03F7/031 ,  G03F7/0042 ,  G03F7/0043 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/20 ,  G03F7/2006 ,  G03F7/26 ,  G03F7/322 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/068

Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first α-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25°C, and a second α-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25°C.