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公开(公告)号：EP3852157A2
公开(公告)日：2021-07-21
申请号：EP21161352.6
申请日：2017-06-01
申请人： LG INNOTEK CO. LTD
发明人： TOSHO, Tsuyoshi
摘要： According to one embodiment of the present invention, a method of manufacturing a thermoelectric leg comprises: preparing a first metal substrate including a first metal, forming a first plated layer including a second metal on the first metal substrate, disposing a layer including tellurium (Te) on the first plated layer, forming a portion of the first plated layer as a first bonding layer by reacting the second metal and the Te, disposing a thermoelectric material layer including bismuth (Bi) and Te on an upper surface of the first bonding layer, disposing a second metal substrate, on which a second bonding layer and a second plated layer are formed, on the thermoelectric material layer, and sintering.
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公开(公告)号：EP3852157A3
公开(公告)日：2021-07-28
申请号：EP21161352.6
申请日：2017-06-01
申请人： LG INNOTEK CO. LTD
发明人： TOSHO, Tsuyoshi
摘要： According to one embodiment of the present invention, a method of manufacturing a thermoelectric leg comprises: preparing a first metal substrate including a first metal, forming a first plated layer including a second metal on the first metal substrate, disposing a layer including tellurium (Te) on the first plated layer, forming a portion of the first plated layer as a first bonding layer by reacting the second metal and the Te, disposing a thermoelectric material layer including bismuth (Bi) and Te on an upper surface of the first bonding layer, disposing a second metal substrate, on which a second bonding layer and a second plated layer are formed, on the thermoelectric material layer, and sintering.
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公开(公告)号：EP3467888A1
公开(公告)日：2019-04-10
申请号：EP17807042.1
申请日：2017-06-01
申请人： LG Innotek Co., Ltd.
发明人： TOSHO, Tsuyoshi
摘要： According to one embodiment of the present invention, a thermoelectric leg comprises: a thermoelectric material layer comprising Bi and Te; a first metal layer and a second metal layer respectively arranged on one surface of the thermoelectric material layer and on a surface different from the one surface; a first adhesive layer arranged between the thermoelectric material layer and the first metal layer and comprising the Te, and a second adhesive layer arranged between the thermoelectric material layer and the second metal layer and comprising the Te; and a first plating layer arranged between the first metal layer and the first adhesive layer, and a second plating layer arranged between the second metal layer and the second adhesive layer, wherein the thermoelectric material layer is arranged between the first metal layer and the second metal layer, the amount of the Te is higher than the amount of the Bi from the centerline of the thermoelectric material layer to the interface between the thermoelectric material layer and the first adhesive layer, and the amount of the Te is higher than the amount of the Bi from the centerline of the thermoelectric material layer to the interface between the thermoelectric material layer and the second adhesive layer.
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