-
1.发明授权Multifunction integrated optics chip having improved polarization extinction ratio 有权具有改进的偏振消光比的多功能集成光学芯片
公开(公告)号：EP1111413B1
公开(公告)日：2005-08-03
申请号：EP00311505.2
申请日：2000-12-20
申请人： LITTON SYSTEMS, INC.
-
公开(公告)号：EP1111411A3
公开(公告)日：2003-06-25
申请号：EP00311507.8
申请日：2000-12-20
申请人： Litton Systems
CPC分类号： G02B6/125 , G02B6/122 , G02B2006/12104 , G02B2006/12126 , G02B2006/12183 , G02F1/035 , G02F1/3137
摘要： An optical waveguide network (11) is formed in an integrated optics chip (58) that includes a substrate (16) formed of an electrooptically active material. The optical waveguide network (11) has an input facet (46) where optical signals may be input to the optical waveguide network (11) and an output facet (48) where optical signals may be output from the optical waveguide network (11). A structure (60) is located in an upper portion (44) of the substrate (16) to prevent surface waves that propagate in the substrate (16) from cross coupling into the output facet (48).
-
3.发明公开Integrated optics chip having reduced surface wave propagation 有权Inertgrierter optischer Schaltkreis mit reduzierterOberflächenwellenausbreitung
公开(公告)号：EP1111411A2
公开(公告)日：2001-06-27
申请号：EP00311507.8
申请日：2000-12-20
申请人： Litton Systems
CPC分类号： G02B6/125 , G02B6/122 , G02B2006/12104 , G02B2006/12126 , G02B2006/12183 , G02F1/035 , G02F1/3137
摘要： An optical waveguide network (11) is formed in an integrated optics chip (58) that includes a substrate (16) formed of an electrooptically active material. The optical waveguide network (11) has an input facet (46) where optical signals may be input to the optical waveguide network (11) and an output facet (48) where optical signals may be output from the optical waveguide network (11). A structure (60) is located in an upper portion (44) of the substrate (16) to prevent surface waves that propagate in the substrate (16) from cross coupling into the output facet (48).
摘要翻译： 光波导网络（11）形成在包括由电光活性材料形成的衬底（16）的集成光学芯片（58）中。 光波导网络（11）具有可将光信号输入到光波导网络（11）的输入面（46）和可从光波导网络（11）输出光信号的输出小面（48）。 结构（60）位于衬底（16）的上部（44）中，以防止在衬底（16）中传播的表面波从交叉耦合到输出小面（48）。
-
公开(公告)号：EP1111411B1
公开(公告)日：2006-06-07
申请号：EP00311507.8
申请日：2000-12-20
申请人： Litton Systems
CPC分类号： G02B6/125 , G02B6/122 , G02B2006/12104 , G02B2006/12126 , G02B2006/12183 , G02F1/035 , G02F1/3137
-
5.发明公开Multifunction integrated optics chip having improved polarization extinction ratio 有权多功能一体机 - 智能手机芯片mitemonicultem Polarisationsausöschungsverhältnis
公开(公告)号：EP1111413A1
公开(公告)日：2001-06-27
申请号：EP00311505.2
申请日：2000-12-20
申请人： LITTON SYSTEMS, INC.
发明人： Gampp, Lorrie L. , Martinez, Arthur R. , Flaherty, Thomas , Geosling, Christine E. , Zimmerman, Gregory
摘要： An integrated optics chip (70) includes an optical waveguide network (11) formed on a surface (106) of a substrate (72) formed of an electrooptically active material. The optical waveguide network (11) has an input facet (86) where an optical signal may be input to the optical waveguide network (11) and an output facet (88) where optical signals may be output from the optical waveguide network (11). A trench (74) is formed in the bottom surface (80) of the substrate and arranged to extend into the substrate toward the optical waveguide network (11). The trench (74) prevents light rays incident thereon from inside the substrate (72) from propagating to the output facet (88). In particular, the trench (74) prevents light scattered at the input facet (86) or from scattering centers in the optical waveguide network (11) from reflecting from the bottom surface (80) of the substrate (72) to the output facet (88). A cover (78) may be mounted to the top surface (106) of the substrate (72) to provide structural strength to the integrated optics chip (70). One or more side grooves (143, 144) may be formed in the sides of the substrate (72) and cover (78). A light absorbing material may be placed in the trench (74) and grooves (143, 144). A plurality of electrodes (150) may be formed on the substrate (72) adjacent the optical waveguide network (11), and a plurality of access electrodes (158, 160) may be formed on sides of the substrate (72) and cover (78) to provide electrical signals to the electrodes (150).
摘要翻译： 集成光学芯片（70）包括形成在由电光活性材料形成的衬底（72）的表面（106）上的光波导网络（11）。 光波导网络（11）具有可将光信号输入到光波导网络（11）的输入面（86）和可从光波导网络（11）输出光信号的输出小面（88） 。 沟槽（74）形成在基板的底面（80）中，并布置成朝向光波导网络（11）延伸到基板中。 所述沟槽（74）防止从所述衬底（72）内部入射到其上的光线传播到所述输出小面（88）。 特别地，沟槽74防止在输入面（86）处散射的光或光波导网络（11）中的散射中心从基板（72）的底表面（80）反射到输出小面（ 88）。 盖（78）可以安装到基板（72）的顶表面（106），以向集成光学芯片（70）提供结构强度。 可以在基板（72）和盖（78）的侧面中形成一个或多个侧槽（143,144）。 光吸收材料可以放置在沟槽（74）和凹槽（143,144）中。 可以在与光波导网络（11）相邻的基板（72）上形成多个电极（150），并且可以在基板（72）和盖（...）的侧面上形成多个接入电极（158,160） 78）以向电极（150）提供电信号。
-
6.发明公开Lateral trenching for cross coupling suppression in integrated optics chips 审中-公开Laterales Graben zurUnterdrückungder Kreuzkopplung in integriert-optischen Chips
公开(公告)号：EP1111412A1
公开(公告)日：2001-06-27
申请号：EP00311503.7
申请日：2000-12-20
申请人： Litton Systems
摘要： An optical waveguide network (11) is formed in a substrate (78) of an electrooptically active material. The optical waveguide network 11 has input and output facets (50, 52) where optical signals may be input to and output from the integrated optics chip (82). At least one lateral trench (84) is formed in the substrate (78). The lateral trench (84) is arranged to prevent light rays incident thereon from inside the substrate (78) from propagating to the output facet (52). The lateral trench (84) may be formed as a slot that extends toward the surface of the substrate (78) where the optical waveguide network (11) is formed, or the trench (84) may be parallel to the plane of the optical waveguides (11). The trench (84) may be formed in a surface (71, 77) that is either parallel or perpendicular to the plane of the optical waveguide network (11).
摘要翻译： 光电波导网络（11）形成在电光活性材料的衬底（78）中。 光波导网络11具有输入和输出小平面（50,52），其中光信号可以被输入到集成光学芯片（82）并从其输出。 至少一个横向沟槽（84）形成在衬底（78）中。 横向沟槽（84）被布置成防止从衬底（78）内部入射到其上的光线传播到输出小面（52）。 横向沟槽（84）可以形成为朝向衬底（78）的形成光波导网络（11）的表面延伸的槽，或者沟槽（84）可以平行于光波导的平面 （11）。 沟槽（84）可以形成在与光波导网络（11）的平面平行或垂直的表面（71,77）中。
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.012 秒)
