公开(公告)号：EP3159721A1

公开(公告)日：2017-04-26

申请号：EP16195157.9

申请日：2016-10-21

申请人： Luxtera, Inc.

发明人： Mekis, Attila ,  De Dobbelaere, Peter ,  Masini, Gianlorenzo ,  De Koninck, Yannick ,  Pinguet, Thierry

IPC分类号： G02B6/42 ,  G02B6/38

CPC分类号： G02B6/428 ,  G02B6/124 ,  G02B6/30 ,  G02B6/34 ,  G02B6/3897 ,  G02B6/4206 ,  G02B6/4208 ,  G02B6/4214 ,  G02B6/4239 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/4255 ,  H04B10/501 ,  H04B10/801

摘要： Methods and systems for a chip-on-wafer-on-substrate assembly are disclosed and may include in an integrated optical communication system comprising an electronics die and a substrate. The electronics die is bonded to a first surface of a photonic interposer and the substrate is coupled to a second surface of the photonic interposer opposite to the first surface. An optical fiber and a light source assembly are coupled to the second surface of the interposer in one or more cavities formed in the substrate. The integrated optical communication system is operable to receive a continuous wave (CW) optical signal in the photonic interposer from the light source assembly; and communicate a modulated optical signal to the optical fiber from said photonic interposer. A mold compound may be on the first surface of the interposer and in contact with the electronics die. The received CW optical signal may be coupled to an optical waveguide in the photonic interposer using a grating coupler.

摘要翻译： 公开了用于晶片上芯片上组装芯片的方法和系统，其可以包括在包括电子管芯和衬底的集成光通信系统中。 电子芯片被结合到光子插入器的第一表面，并且衬底被耦合到光子插入器的与第一表面相对的第二表面。 光纤和光源组件在形成于衬底中的一个或多个空腔中耦合至插入器的第二表面。 集成光通信系统可操作以从光源组件接收光子插入器中的连续波（CW）光信号; 并将调制的光信号从所述光子插入器传送到光纤。 模制化合物可以位于中介层的第一表面上并且与电子管芯接触。 接收的CW光信号可以使用光栅耦合器耦合到光子插入器中的光波导。