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    Optical module and fabrication method
    1.
    发明公开
    Optical module and fabrication method 审中-公开
    光学模块和制造方法

    公开(公告)号：EP2733512A3

    公开(公告)日：2017-12-20

    申请号：EP13184938.2

    申请日：2013-09-18

    Applicant: FUJITSU LIMITED

    Inventor： Shiraishi, Takashi

    IPC: G02B6/42 ,  G02B6/43

    CPC classification number: G02B6/42 ,  G02B6/4214 ,  G02B6/4245 ,  G02B6/4255 ,  G02B6/4266 ,  G02B6/4281 ,  G02B6/43 ,  Y10T156/1089

    Abstract: An optical module includes a flexible printed circuit board on which a light receiving element and/or a light emitting element is mounted face-down as an optical element, and having a part that transmits incoming light to the light receiving element and/or outgoing light from the light emitting element; a lens member disposed on a surface of the printed circuit board, on which the optical element is not mounted, and integrally formed to have within a predetermined area, a lens that transmits the incoming and/or the outgoing light, and a convex part abutting the printed circuit board; a bonding member disposed in an area other than the predetermined area, between the printed circuit board and the lens member, and that bonds the printed circuit board and the lens member; and a cooling member disposed to apply pressure to the optical element toward the printed circuit board and cool the optical element.

    Abstract translation: 一种光学模块包括柔性印刷电路板，该柔性印刷电路板将光接收元件和/或发光元件作为光学元件面朝下地安装，并且具有将入射光传输到光接收元件和/或出射光 来自发光元件; 布置在印刷电路板的未安装光学元件的表面上并且一体地形成以在预定区域内具有透射入射光和/或出射光的透镜以及邻接凸出部的透镜构件 印刷电路板; 结合构件，所述结合构件布置在所述印刷电路板和所述透镜构件之间的所述预定区域之外的区域中，并且将所述印刷电路板和所述透镜构件结合; 以及冷却构件，该冷却构件被设置成向所述光学元件向所述印刷电路板施加压力并冷却所述光学元件。

    OPTICAL TRANSCEIVER DEVICE
    2.
    发明公开
    OPTICAL TRANSCEIVER DEVICE 审中-公开
    OPTISCHE SENDER-EMPFÄNGERVORRICHTUNG

    公开(公告)号：EP3076215A1

    公开(公告)日：2016-10-05

    申请号：EP14865353.8

    申请日：2014-11-28

    Applicant: Optomind Inc.

    Inventor： SON, Yung-sung ,  KIM, Bong-cheol

    IPC: G02B6/42 ,  G02B6/36 ,  G02B6/26

    CPC classification number: G02B6/4231 ,  G02B6/32 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4249 ,  G02B6/4255 ,  G02B6/428

    Abstract: An optical transceiver device includes a baseplate including a set position for mounting an optical element, an alignment plate including a mounting unit, a first and a second reference hole. The device includes an optical-fiber fixing block configured to fixedly mount at least one of a lens unit and an optical fiber optically linked with the optical element and to include a first and a second post, and a housing for enclosing the optical-fiber fixing block and alignment plate. The second post is inserted into the second reference hole in a looser manner than inserting the first post into the first reference hole, and the set position is determined by a first baseline passing through the first and the second reference hole and by a second baseline intersecting with the first baseline and positioned on opposite side of the second reference hole with respect to the first reference hole.

    Abstract translation: 光收发器装置包括：底板，其包括用于安装光学元件的设置位置;对准板，包括安装单元;第一和第二参考孔。 该装置包括光纤固定块，其被配置为固定地安装透镜单元和与光学元件光学连接的光纤中的至少一个，并且包括第一和第二柱以及用于封装光纤固定的壳体 块和对准板。 第二柱以比将第一柱插入第一参考孔更松动的方式插入到第二参考孔中，并且设定位置由通过第一和第二参考孔的第一基线和相交的第二基线确定 具有第一基线并且相对于第一参考孔定位在第二参考孔的相对侧上。

    VORRICHTUNG ZUM EINKOPPELN UND/ODER AUSKOPPELN OPTISCHER SIGNALE
    3.
    发明公开
    VORRICHTUNG ZUM EINKOPPELN UND/ODER AUSKOPPELN OPTISCHER SIGNALE 审中-公开
    VORRICHTUNG ZUM EINKOPPELN UND / ODER AUSKOPPELN OPTISCHER SIGNALE

    公开(公告)号：EP3052980A2

    公开(公告)日：2016-08-10

    申请号：EP14827412.9

    申请日：2014-09-30

    Applicant: Silicon Line GmbH

    Inventor： HOELTKE, Holger ,  GROEPL, Martin

    IPC: G02B6/42

    CPC classification number: G02B6/423 ,  G02B6/4202 ,  G02B6/4255 ,  G02B6/4292 ,  G02B6/4295

    Abstract: The invention relates to a device (100a, 100b, 100c, 100d, 100e, 100f) for coupling optical signals into at least one waveguide (10), which device comprises at least one electro-optical converter (28), which emits the optical signals in the direction of the axis or of the core (12) of the waveguide (10). In order to further develop said device in such a way that active alignment of the waveguide (10) is not required, the receiving-side optical subassembly (80) according to the comprises at least one guide channel (86) for aligning the waveguide (10) in relation to the optoelectrical converter (68), in particular in relation to the inlet opening or active surface (70) of the electro-optical converter (68), and the optoelectrical converter (68) is accommodated, in particular embedded, in at least one receiving-side optical subassembly (80). The same applies, accordingly, to a device (140) for coupling optical signals out of at least one waveguide (10).

    Abstract translation: 本发明涉及用于将光信号耦合到至少一个波导（10）中的装置（100a，100b，100c，100d，100e，100f），该装置包括至少一个电光转换器（28），该电光转换器发射光 信号沿着轴或波导（10）的芯（12）的方向。 为了进一步发展所述设备，使得不需要波导（10）的主动对准，根据该接收侧光学子组件（80）包括至少一个引导通道（86），用于对准波导 （68）相对于光电转换器（68）的入口开口或有效表面（70）特别是与光电转换器（68）相关联，并且光电转换器（68） 在至少一个接收侧光学子组件（80）中。 相应地，这同样适用于用于将光信号耦合出至少一个波导（10）的设备（140）。

    Optical waveguide device production method and connection structure
    5.
    发明公开
    Optical waveguide device production method and connection structure 有权
    通过该方法和波导管的连接结构，其装置产生一种制造光波导器件，光波导路装置的制造方法

    公开(公告)号：EP2063302A1

    公开(公告)日：2009-05-27

    申请号：EP08020117.1

    申请日：2008-11-18

    Applicant: Nitto Denko Corporation

    Inventor： Hodono, Masayuki

    IPC: G02B6/42

    CPC classification number: G02B6/4204 ,  G02B6/4201 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/4255 ,  G02B6/4259 ,  G02B6/4269 ,  G02B6/4281 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An optical waveguide device production method which ensures that a receptacle structure can be easily and highly accurately produced in a single step, an optical waveguide device produced by the method, and an optical waveguide connection structure to be used for the optical waveguide device. The optical waveguide device includes a light emitting element (21) mounted on an upper surface of a board (20), and a core layer (29) which seals the light emitting element (21). The core layer (29) has an optical waveguide insertion recess (25) and an optical coupling lens (27) unitarily formed in a portion thereof opposed to a light emitting surface of the light emitting element (21). One end of an optical waveguide (30) is inserted in the recess (25) and fixed by a sealing resin (31). Thus, the optical waveguide (30) is optically coupled with a light emitting/receiving point of the light emitting element (21) in the core layer (29).

    Abstract translation: 一种光波导器件的制造方法其确保确实的插座结构可以很容易地且高精度地设置在一个单一的步骤中产生，由该方法生产的光波导路装置，以及光波导的连接结构用于光波导器件。 的光波导路装置包括安装在在板（20）的上表面的发光元件（21），和密封该发光元件（21）的芯层（29）。 芯层（29）具有上光波导路插入用凹部（25）和光耦合用透镜（27）在其相对的所述发光元件（21）的发光表面的部分整体地形成。 光波导（30）的一个端部被插入在所述凹部（25）和固定用密封树脂（31）。 因此，光波导路（30）被光学耦合与光发射/接收在芯层（29）的发光元件（21）的点。

    ENCAPSULATION OF OPTOELECTRONIC COMPONENTS
    8.
    发明授权
    ENCAPSULATION OF OPTOELECTRONIC COMPONENTS 失效
    亚光电子元件的封装

    公开(公告)号：EP0750753B1

    公开(公告)日：2006-07-05

    申请号：EP95914617.6

    申请日：1995-03-20

    Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (publ)

    Inventor： STEIJER, Odd ,  ERIKSEN, Paul ,  MOLL, Hans ,  ENGSTRAND, Jan, Ake ,  PALMSKOG, Göran ,  JANSON, Mats ,  TINGHAG, Pia

    IPC: G02B6/42

    CPC classification number: G02B6/4201 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4257

    Abstract: An encapsulated optocomponent (1) comprises a single-crystal silicon wafer (3) and waveguides (9) located thereon, which at least partly are manufactured by means of process methods taken from the methods for manufacturing electronic integrated circuits. The waveguides (9) extend from an edge of the optoelectronic component (1) to an optoelectronic, active or passive component (11) attached to the surface of the silicon wafer (3). Over the region for connecting the waveguides (9) to the optoelectronic component (11) a transparent plastics material is molded (17), for instance an elastomer, having a refractive index adjusted to improve the optical coupling between the waveguides (9) and the optoelectronic component (11). The molding (17) covers advantageously all of said component (11) to also reduce thermal stresses between it and an exterior, protective layer (19) of a curable plastics material. The molded layer (17) can also cover the whole area of the waveguides (9) to form an upper cladding thereof. Guide grooves (5) are arranged in the silicon wafer (3) for positioning guide pins (7), utilized in the connection of the optocomponent (1) to another optocomponent having guides for guide pins and waveguides configured in the same way.

    An optoelectronic assembly
    10.
    发明公开
    An optoelectronic assembly 审中-公开
    一个光电子组件

    公开(公告)号：EP1403985A1

    公开(公告)日：2004-03-31

    申请号：EP02256675.6

    申请日：2002-09-25

    Applicant: Agilent Technologies, Inc. - a Delaware corporation -

    Inventor： Harker, Andrew Thomas

    IPC: H01S5/026 ,  G02B6/42

    CPC classification number: G02B6/4204 ,  G02B6/4214 ,  G02B6/4215 ,  G02B6/424 ,  G02B6/4251 ,  G02B6/4255 ,  H01L2224/48091 ,  H01S5/005 ,  H01S5/0085 ,  H01S5/02248 ,  H01S5/0687 ,  H01L2924/00014

    Abstract: An optoelectronic assembly (300) includes a laser (102) for emitting light along a main optical path. Beam splitters (110, 114) split a proportion of light from the main optical path and the split light is guided by optical light guides (310) to a photodiode array (302). The light guides (310) are mouldable and substantially rigid and can be co fabricated as a single assembly including fiducials to facilitate positioning on a substrate (124) of the assembly (300). By having the array (302) adjacent the periphery of the substrate (124), wirebonds (308) need only be provided directly from the array (302) to a feed-through (130), and electrical tracks on the substrate and ceramic blocks for mounting the photodiodes are eliminated, as is individual placement of the ceramic blocks on the substrate.

    Abstract translation: 光电子组件（300）包括用于沿主光路发射光的激光器（102）。 光束分离器（110,114）分离来自主光路的一定比例的光，并且分离光由光学光导（310）引导至光电二极管阵列（302）。 光导（310）是可成型的并且基本上是刚性的，并且可以共同制造成包括基准的单个组件，以便于定位在组件（300）的基板（124）上。 通过使阵列（302）与衬底（124）的外围相邻，只需要从阵列（302）直接提供引线（308）到馈通（130），并且衬底上的电迹线和陶瓷块 用于安装光电二极管被消除，陶瓷块在衬底上的单独放置也被消除。

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