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1.发明公开REFLECTIVE BANK STRUCTURE AND METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE 审中-公开参考文献UFERBAUWERK UND VERFAHREN ZUR INTEGRATION EINER LICHTEMITTIERENDEN VORRICHTUNG
公开(公告)号：EP2997608A1
公开(公告)日：2016-03-23
申请号：EP14736539.9
申请日：2014-06-09
发明人： BIBL, Andreas , GRIGGS, Charles R.
IPC分类号： H01L33/44
CPC分类号： H01L25/167 , H01L24/95 , H01L25/0753 , H01L25/165 , H01L27/0203 , H01L27/124 , H01L27/1244 , H01L33/0008 , H01L33/06 , H01L33/08 , H01L33/20 , H01L33/30 , H01L33/44 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
摘要翻译： 描述了将微型LED器件集成到发光器件中的发光器件和方法。 在一个实施例中，发光器件包括在堤层内的反射堤坝结构，以及位于堤层顶部并在反射堤岸结构上方升高的导电线。 微型LED器件在反射堤结构内，钝化层位于堤层之上，并且侧向围绕反射堤坝结构内的微型LED器件。 微型LED器件的一部分和在堤层顶部的导电线突出于钝化层的顶表面之上。
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2.发明公开LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME AND METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATED DEFECT DETECTION TEST 审中-公开用于生产具有集成的故障检测测试的LED显示器，带有冗余方案和方法LED显示屏
公开(公告)号：EP2973715A1
公开(公告)日：2016-01-20
申请号：EP14769046.5
申请日：2014-03-06
CPC分类号： H01L25/0753 , H01L24/95 , H01L27/1214 , H01L27/1259 , H01L33/0095 , H01L2924/0002 , H01L2924/12041 , H01L2924/12044 , H01L2924/00
摘要： A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.
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